公开(公告)号：US11379012B2

公开(公告)日：2022-07-05

申请号：US16481854

申请日：2018-02-08

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Wei-Chung Chen ,  Kuan-Ting Wu

IPC: G06F1/16 ,  F16C11/04 ,  E05D11/08

Abstract: In an example, a device includes a base unit, a cover unit, and a hinge assembly to couple the cover unit to the base unit The hinge assembly is moveable between a folded position and an unfolded position. The hinge assembly includes a channel, an annular holder disposed in the channel, a shaft engaged with the annular holder, and a hydraulic cylinder coupled to the shaft. The hydraulic cylinder is to move the shaft along a longitudinal axis of the shaft, based on a movement of the hinge assembly between the folded position and the unfolded position, to vary an operating torque of the hinge assembly.

公开(公告)号：US11353930B2

公开(公告)日：2022-06-07

申请号：US16646022

申请日：2017-10-09

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Wei-Chung Chen ,  Kuan-Ting Wu ,  Kun-Hung Lin

IPC: G06F1/16 ,  E05D3/02 ,  E05D11/10

Abstract: Examples herein relate to a hinge. In some examples, a hinge can include a first bracket connected to a shaft, a second bracket connected to the first bracket, a member connected to the shaft and magnetically attracted to a magnet at a first position, where the member translates relative to the magnet to a second position as the shaft rotates about an axis of the shaft, and the magnet to generate a magnetic attraction force between the member and the magnet, where the magnetic attraction force is higher at the second position than the first position.

公开(公告)号：US20220162766A1

公开(公告)日：2022-05-26

申请号：US17296784

申请日：2019-08-14

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kuan-Ting Wu ,  Chi Hao Chang ,  Hslng-Hung Hsieh

IPC: C25D13/06 ,  C25D13/20

Abstract: A coated metal alloy substrate with at least one chamfered edge, a process for producing a coated metal alloy substrate, and an electronic device having a housing comprising a coated metal alloy substrate are described. The coated metal alloy substrate with at least 10 one chamfered edge comprises a water transfer print layer deposited on the metal alloy substrate, a passivation layer deposited on the at least one chamfered edge, and an electrophoretic deposition layer deposited on the passivation layer.

公开(公告)号：US20220147118A1

公开(公告)日：2022-05-12

申请号：US17298582

申请日：2019-07-25

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chi Hao Chang ,  Kuan-Ting Wu ,  Hui He

IPC: G06F1/18 ,  C25D11/26 ,  C25D11/30 ,  C25D13/12 ,  H05K5/02 ,  H05K5/03

Abstract: The present disclosure is drawn to covers for electronic devices. In one example, a cover for an electronic device can include an enclosure with a light metal substrate with an opening therethrough, and a first protective coating covering the light metal substrate. A second protective coating is on the first protective coating, and a chamfered edge is present along the opening where the chamfer cuts through the first protective coating and the second protective coating to expose the light metal substrate at the chamfered edge. In one example, a transparent passivation layer is included along the chamfered edge.

公开(公告)号：US20220147100A1

公开(公告)日：2022-05-12

申请号：US17296732

申请日：2019-07-25

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chalam Kashyap ,  Hung-Sung Pan ,  Kuan-Ting Wu

IPC: G06F1/16 ,  H01L41/083 ,  H01L41/09 ,  H01F7/02

Abstract: A foldable computing device is described. The foldable computing device can include a power switch, a display screen unit including a first magnet, a base unit and an actuator. The base unit can include an assembly with a second magnet and a third magnet. The assembly can be at a first position that causes the first magnet of the display screen unit to attract to the second magnet of the assembly of the base unit to lock the display screen unit. The actuator can receive an electrical pulse when the power switch is selected to power on the foldable computing device and provide a motion to move the assembly to a second position, to cause the first magnet of the display screen unit to be moved away from the second magnet and repulse the third magnet of the assembly in the base unit to unlock the display screen unit.

公开(公告)号：US20220089913A1

公开(公告)日：2022-03-24

申请号：US17424002

申请日：2019-05-15

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kuan-Ting Wu ,  Super Liao ,  Chung-Hua Ku

IPC: C09J7/35 ,  C09J7/38

Abstract: The present disclosure is drawn to re-workable adhesives for electronic devices. In one example, a re-workable adhesive for an electronic device can include a hot-melt adhesive present in an amount from about 60 wt % to about 90 wt % with respect to the total weight of the re-workable adhesive. The hot-melt adhesive can have a reduced bond strength at an elevated temperature. The re-workable adhesive can also include a pressure-sensitive adhesive present in an amount from about 10 wt % to about 40 wt % with respect to the total weight of the re-workable adhesive, wherein the pressure-sensitive adhesive has a higher bond strength compared to the hot-melt adhesive when at the elevated temperature.

公开(公告)号：US11259423B2

公开(公告)日：2022-02-22

申请号：US16074175

申请日：2016-10-03

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Kuan-Ting Wu ,  Kevin Voss ,  Ai-Tsung Li ,  Wei Kuang Chu ,  Wei-Chung Chen

IPC: B32B3/00 ,  H05K5/02 ,  B32B3/26 ,  B32B7/14 ,  G06F1/16 ,  H05K5/00

Abstract: Example implementations relate to multilayer housings. In one example, multilayer housing can include a first continuous layer comprising copper, plastic, graphene, aluminum, titanium, magnesium, or combinations thereof, a void layer on the first continuous layer, wherein the void layer comprises from (5) volume percent (vol. %) to (95) vol. % voids; and a second continuous layer on the void layer, wherein the second continuous layer comprises copper, plastic, graphene, aluminum, titanium, magnesium, or combinations thereof.

公开(公告)号：US11249524B2

公开(公告)日：2022-02-15

申请号：US16770535

申请日：2017-12-06

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Wei-Chung Chen ,  Kuan-Ting Wu

IPC: G06F1/20 ,  G06F1/16 ,  H05K7/20

Abstract: In one example, an electronic device is described, which may include an enclosure having at least two openings, and at least two air flow devices disposed in the enclosure and corresponding to the at least two openings. The at least two air flow devices may be movable between a retracted position and an extended position. The at least two air flow devices can be within the enclosure in the retracted position and can be at least partially outside the enclosure through the at least two openings in the extended position.

公开(公告)号：US20220016869A1

公开(公告)日：2022-01-20

申请号：US17054565

申请日：2019-03-27

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Ting Lin ,  Kuan-Ting Wu ,  Chi Hao Chang

IPC: B32B7/12 ,  C09K5/14 ,  C08J5/18 ,  C09J11/04 ,  C09J5/00 ,  B32B5/02 ,  B32B17/06 ,  B32B15/20 ,  B32B27/36 ,  B32B27/30 ,  B32B27/40 ,  B32B27/38 ,  B32B27/06

Abstract: The present disclosure is drawn to covers for electronic devices, coating sets for covers of electronic devices, and methods for making these covers. In one example, described herein is a cover for an electronic device comprising: a substrate; an adhesive layer on a surface of the substrate; a first thermally conductive layer on the adhesive layer; a first oxide layer on the first thermally conductive layer; an aluminum foil layer on the first oxide layer; a second oxide layer on the aluminum foil layer; and a second thermally conductive layer on the second oxide layer.

公开(公告)号：US20220001653A1

公开(公告)日：2022-01-06

申请号：US17054570

申请日：2019-03-22

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kuan-Ting Wu ,  Shing-Hung Hsieh ,  Super Liao

IPC: B32B27/08 ,  B32B27/30 ,  B32B27/36 ,  B32B27/32 ,  B32B27/20 ,  B32B25/20 ,  B32B25/08 ,  B32B7/12 ,  B32B17/06 ,  B32B5/02 ,  B32B27/12 ,  B32B37/16 ,  B32B15/082 ,  B32B15/09 ,  B32B15/085 ,  B32B7/023 ,  C09D133/12 ,  C09D7/41 ,  G06F1/16

Abstract: The present disclosure describes covers for electronic devices, electronic devices, and methods of making covers for the electronic devices. In an example, a cover for an electronic device can comprise: a rigid substrate; a high refraction polymeric film adherable on the rigid substrate; a semitransparent polymeric film adherable on the high refraction polymeric film, wherein the high refraction polymeric film comprises: polyacrylic, polycarbonate, cyclic olefin copolymer, or combinations thereof, and high refractive nanoparticles, and wherein the semi-transparent polymeric film comprises: polyester, polyacrylic, polycarbonate, polyvinyl chloride, silicone rubber, or combinations thereof, and at least one colorant.