公开(公告)号：US20090067884A1

公开(公告)日：2009-03-12

申请号：US12195817

申请日：2008-08-21

申请人： Takeshi Wakabayashi ,  Masanobu Deguchi ,  Takeshi Okuda

发明人： Takeshi Wakabayashi ,  Masanobu Deguchi ,  Takeshi Okuda

IPC分类号： G03G15/08

CPC分类号： G03G15/0877 ,  G03G15/0872 ,  G03G2215/0819 ,  G03G2215/0855

摘要： A toner supplier according to the present invention includes a toner stirrer. The toner stirrer includes a shaft, an auxiliary member, and a fixture. The melting point of the auxiliary member is higher than the melting points of the shaft and fixture. The shaft and fixture are welded to each other with the auxiliary member interposed between them.Because the melting point of the auxiliary member is higher than the melting points of the shaft and fixture, this member is not influenced by heat when the shaft and fixture are welded thermally to each other.

摘要翻译： 根据本发明的调色剂供应器包括调色剂搅拌器。 调色剂搅拌器包括轴，辅助构件和固定装置。 辅助部件的熔点高于轴和夹具的熔点。 轴和夹具彼此焊接，辅助构件插入它们之间。 由于辅助部件的熔点高于轴和夹具的熔点，所以当轴和夹具彼此热焊时，该部件不受热的影响。

公开(公告)号：US20080089718A1

公开(公告)日：2008-04-17

申请号：US11907028

申请日：2007-10-09

申请人： Yasuyuki Ishiguro ,  Takeshi Okuda ,  Takeshi Wakabayashi ,  Jun Yamaguchi ,  Hiroshi Kawahito

发明人： Yasuyuki Ishiguro ,  Takeshi Okuda ,  Takeshi Wakabayashi ,  Jun Yamaguchi ,  Hiroshi Kawahito

IPC分类号： G03G15/08

CPC分类号： G03G15/0879 ,  G03G15/0877 ,  G03G2215/0802

摘要： In a supply passage assembly having a toner passage arranged under a toner bottle for conveying toner supplied from the toner bottle to a developing unit arranged below, a toner conveying pipe for forming the toner passage is formed of an elastic material and a toner conveying pipe deforming member is arranged adjacent to the toner conveying pipe for elastically deforming the toner conveying pipe.

摘要翻译： 在具有调色剂通道的供给通道组件中，调色剂通道布置在调色剂瓶下面，用于将从调色剂瓶供应的调色剂输送到下面布置的显影单元，用于形成调色剂通道的调色剂输送管由弹性材料和调色剂输送管变形 构件邻近调色剂输送管布置，用于使调色剂输送管弹性变形。

公开(公告)号：US20080080901A1

公开(公告)日：2008-04-03

申请号：US11896541

申请日：2007-09-04

申请人： Yasuyuki Ishiguro ,  Takeshi Okuda ,  Takeshi Wakabayashi ,  Jun Yamaguchi ,  Hiroshi Kawahito

发明人： Yasuyuki Ishiguro ,  Takeshi Okuda ,  Takeshi Wakabayashi ,  Jun Yamaguchi ,  Hiroshi Kawahito

IPC分类号： G03G15/08

CPC分类号： G03G15/0879 ,  G03G15/0877

摘要： A supply passage assembly arranged under a toner bottle for conveying toner supplied from the toner bottle to a developing unit arranged below, includes: a toner passage having a toner input port at top and a toner discharge port at bottom and incorporating rotators for agitating the toner supplied from the toner bottle and is constructed so that the toner passage includes a first swing member for agitating toner near the toner input port and a second swing member for agitating toner near the toner discharge port.

摘要翻译： 一种布置在调色剂瓶下面的供应通道组件，用于将从调色剂瓶供应的调色剂输送到下面布置的显影单元，包括：调色剂通道，其具有顶部的调色剂输入端口和底部的调色剂排出口，并包括用于搅拌调色剂的旋转器 由调色剂瓶提供并且构造成调色剂通道包括用于搅拌调色剂输入端口附近的调色剂的第一摆动部件和用于搅拌调色剂排出口附近的调色剂的第二摆动部件。

公开(公告)号：US20080031657A1

公开(公告)日：2008-02-07

申请号：US11826426

申请日：2007-07-16

申请人： Takeshi Okuda ,  Yasuyuki Ishiguro ,  Takeshi Wakabayashi ,  Jun Yamaguchi ,  Hiroshi Kawahito

发明人： Takeshi Okuda ,  Yasuyuki Ishiguro ,  Takeshi Wakabayashi ,  Jun Yamaguchi ,  Hiroshi Kawahito

IPC分类号： G03G15/08

CPC分类号： G03G15/0879 ,  G03G15/0877

摘要： Accumulation and coagulation of toner inside a vertically-disposed toner carrying path is properly prevented. The toner carrier apparatus includes: a toner carrier pipe which includes therein a toner carrying path through which toner is carried and is disposed so that the toner carrier path vertically extends; a pipe supporting member which supports the toner carrier pipe in such a way as to allow the toner carrier pipe to be vertically movable; a rotational member and operation wings, which cause the toner carrier pipe to reciprocally move in the vertical direction and horizontally swing; and a knocking mechanism which horizontally hits the toner carrier pipe.

摘要翻译： 适当地防止垂直设置的调色剂承载路径内的调色剂的积聚和凝结。 调色剂载体装置包括：调色剂承载管，其中包括调色剂承载路径，通过该调色剂承载路径承载调色剂，并且被布置成使调色剂承载件路径垂直延伸; 管支撑构件，其以允许调色剂承载管可垂直移动的方式支撑调色剂承载管; 旋转构件和操作翼，其使调色剂承载管在垂直方向上往复移动并水平摆动; 以及水平撞击调色剂承载管的敲击机构。

公开(公告)号：US20070267743A1

公开(公告)日：2007-11-22

申请号：US11638717

申请日：2006-12-14

申请人： Aiko Mizusawa ,  Osamu Okada ,  Takeshi Wakabayashi

发明人： Aiko Mizusawa ,  Osamu Okada ,  Takeshi Wakabayashi

IPC分类号： H01L23/48

CPC分类号： H01L23/525 ,  H01L21/561 ,  H01L23/3114 ,  H01L23/5329 ,  H01L24/02 ,  H01L24/11 ,  H01L24/12 ,  H01L24/94 ,  H01L2224/0231 ,  H01L2224/0233 ,  H01L2224/02331 ,  H01L2224/0401 ,  H01L2224/12105 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/18301 ,  H01L2924/30105

摘要： A semiconductor device includes a semiconductor substrate and low dielectric film wiring line laminated structure portions which are provided in regions on the semiconductor substrate except a peripheral portion thereof. Each of the laminated structure portions has a laminated structure of low dielectric films and a plurality of wiring lines. An insulating film is provided on an upper side of the laminated structure portion. Connection pad portions for electrodes are arranged on the insulating film to be electrically connected to the connection pad portions of uppermost wiring lines of the laminated structure portion. Bump electrodes for external connection are provided on the connection pad portions for the electrodes. A sealing film is provided on the insulating film and on the peripheral portion of the semiconductor substrate. Side surfaces of the laminated structure portions are covered with the insulating film or the sealing film.

摘要翻译： 半导体器件包括半导体衬底和低电介质膜布线层叠结构部分，它们设置在除了其周边部分之外的半导体衬底上的区域中。 各层叠结构部分具有低电介质膜和多条布线的叠层结构。 绝缘膜设置在层叠结构部的上侧。 用于电极的连接焊盘部分布置在绝缘膜上以电连接到层叠结构部分的最上布线的连接焊盘部分。 用于外部连接的凸起电极设置在用于电极的连接焊盘部分上。 在绝缘膜上和半导体衬底的周边部分上设置密封膜。 层叠结构部分的侧表面被绝缘膜或密封膜覆盖。

公开(公告)号：US20070010403A1

公开(公告)日：2007-01-11

申请号：US11476198

申请日：2006-06-28

申请人： Ikuo Nanno ,  Takaaki Yamada ,  Masahito Tanaka ,  Yosuke Iwai ,  Takeshi Wakabayashi

发明人： Ikuo Nanno ,  Takaaki Yamada ,  Masahito Tanaka ,  Yosuke Iwai ,  Takeshi Wakabayashi

IPC分类号： H01L39/24

CPC分类号： G05D23/1917

摘要： When a work is set on a hot plate and a heat treatment is started and the like, an addition waveform of a target temperature is formed based on a previously formed data of an adjustment value, and a temperature is controlled by adding the addition waveform to the target temperature SP, and with the data of the adjustment value, the variation in temperature of the work is prevented using an interference matrix showing a relation between the target temperature SP and the temperature of the work.

摘要翻译： 当在热板上设置工件并开始热处理等时，基于预先形成的调整值的数据形成目标温度的相加波形，并且通过将加法波形相加来控制温度 目标温度SP，并且利用调整值的数据，使用表示目标温度SP与工件温度之间的关系的干涉矩阵来防止工件的温度变化。

公开(公告)号：US07075181B2

公开(公告)日：2006-07-11

申请号：US10851880

申请日：2004-05-20

申请人： Takeshi Wakabayashi ,  Shinji Wakisaka

发明人： Takeshi Wakabayashi ,  Shinji Wakisaka

IPC分类号： H01L21/302

CPC分类号： H01L24/97 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/19 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/056 ,  H01L2224/05655 ,  H01L2224/12105 ,  H01L2224/2402 ,  H01L2224/24226 ,  H01L2224/274 ,  H01L2224/73267 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2924/00014

摘要： A semiconductor package includes at least one semiconductor constructing body which has a semiconductor substrate and a plurality of external connection electrodes formed thereon. An insulating film covers the semiconductor constructing body. Each of interconnections which has a projecting electrode is formed on the insulating film. The projecting electrodes of the interconnection cut through the insulating film at portions corresponding to the external connection electrodes and electrically connected to the external connection electrodes.

公开(公告)号：US06951998B2

公开(公告)日：2005-10-04

申请号：US10257241

申请日：2001-04-13

申请人： Ikuo Nanno ,  Kousaku Ando ,  Masahito Tanaka ,  Seiya Narimatsu ,  Naotaka Uchiyama ,  Motohisa Furukawa ,  Akira Takaishi ,  Yuuki Kataoka ,  Tsunetoshi Ooba ,  Atsushi Mukai ,  Takeshi Wakabayashi ,  Hirokazu Kitamura ,  Nobumasa Nakamizo ,  Hideki Kobori

发明人： Ikuo Nanno ,  Kousaku Ando ,  Masahito Tanaka ,  Seiya Narimatsu ,  Naotaka Uchiyama ,  Motohisa Furukawa ,  Akira Takaishi ,  Yuuki Kataoka ,  Tsunetoshi Ooba ,  Atsushi Mukai ,  Takeshi Wakabayashi ,  Hirokazu Kitamura ,  Nobumasa Nakamizo ,  Hideki Kobori

IPC分类号： G05B11/32 ,  G05B11/42 ,  G05B13/02 ,  G05D23/20 ,  H05B1/02

CPC分类号： G05B13/024 ,  G05B11/32 ,  G05B11/42 ,  G05D23/1919 ,  G05D23/1932 ,  G05D23/20

摘要： A plurality of individually corresponding heaters and temperature sensors are provided along with a plurality of a PID control means. An average temperature/gradient temperature calculating means calculates the average temperatures of the temperatures measured by the temperature sensors and the gradient temperatures based on the measured temperatures. Each of the PID control means outputs an operation signal so that the average temperatures or gradient temperatures may be made equal to the desired values. A distributing means distributes the operation signal from each of the PID control means to each heater so that control by the PID control means may produce no effect on the control of the other PID control means.

摘要翻译： 多个单独对应的加热器和温度传感器与多个PID控制装置一起提供。 平均温度/梯度温度计算装置根据测量的温度来计算由温度传感器测量的温度和梯度温度的平均温度。 PID控制装置中的每一个输出操作信号，使得平均温度或梯度温度可以等于期望值。 分配装置将来自每个PID控制装置的操作信号分配给每个加热器，使得PID控制装置的控制可以不对其他PID控制装置的控制产生影响。

公开(公告)号：US06733089B1

公开(公告)日：2004-05-11

申请号：US09419243

申请日：1999-10-15

申请人： Takeshi Wakabayashi ,  Kazuhiko Tani

发明人： Takeshi Wakabayashi ,  Kazuhiko Tani

IPC分类号： B60T1300

CPC分类号： B62L3/08 ,  B60T8/261

摘要： A brake assembly for a motorcycle having a reduced number of components and assembly steps, and a simple control system with no interference between separate hydraulic systems. A brake assembly for a motorcycle provided with a front brake and a rear brake respectively for a front wheel and a rear wheel includes a first brake actuator and second brake actuator. An electronically controlled braking system includes a first actuating amount transmission system extending from the first brake actuating member connected to one of either the front brake or the rear brake for actuating whichever one of the front brake and rear brake that is not connected to the first actuating amount transmission system using an actuator as a result of being input with detection values for each of a first actuating amount detection member for detecting an actuating amount of the first brake actuator and second amount detection member for detecting an actuating amount of the second brake actuator and subjecting them to computation, and outputting control signals to the actuator based on the result of computation.

摘要翻译： 具有减少部件数量和组装步骤的摩托车的制动组件，以及在单独的液压系统之间没有干扰的简单的控制系统。 具有分别用于前轮和后轮的前制动器和后制动器的摩托车的制动组件包括第一制动器致动器和第二制动器致动器。 电子控制的制动系统包括从连接到前制动器或后制动器之一的第一制动器致动构件延伸的第一致动量传动系统，用于致动未连接到第一致动器的前制动器和后制动器中的任何一个 由于输入了用于检测第一制动器致动器的致动量的第一致动量检测构件的检测值和用于检测第二制动器致动器的致动量的第二量检测构件的检测值，使用致动器的量传递系统，以及 对它们进行计算，并且基于计算结果将控制信号输出到致动器。

公开(公告)号：US06607970B1

公开(公告)日：2003-08-19

申请号：US09704156

申请日：2000-11-01

申请人： Takeshi Wakabayashi

发明人： Takeshi Wakabayashi

IPC分类号： H01L21301

CPC分类号： H01L21/568 ,  H01L21/56 ,  H01L21/6836 ,  H01L23/3107 ,  H01L24/27 ,  H01L2221/68327 ,  H01L2221/68363 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/94 ,  H01L2924/01057 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/11 ,  H01L2224/03

摘要： A dicing tape is adhered to the lower surface of a silicon wafer that has pillar-shaped electrodes. The silicon wafer is cut along dicing streets, thereby making trenches among the chip-forming regions of the wafer. Next, a seal film is formed. The seal film is cut, substantially along the centerlines of the trenches. A support tape is adhered to the upper surface of the seal film. The dicing tape is peeled off. Then, those parts of the seal film that project from the lower surface of the silicon wafer are polished and removed. The support tape is peeled off. IC chips are thereby obtained. In each IC chip, the seal film covers and protects the upper surface and sides of the semiconductor substrate.

摘要翻译： 切割胶带粘附到具有柱状电极的硅晶片的下表面。 沿着切割街道切割硅晶片，从而在晶片的芯片形成区域之间形成沟槽。 接着，形成密封膜。 大致沿着沟槽的中心线切割密封膜。 支撑带粘附到密封膜的上表面。 切割胶带剥离。 然后，从硅晶片的下表面突出的密封膜的那些部分被抛光和去除。 支撑带剥离。 从而获得IC芯片。 在每个IC芯片中，密封膜覆盖并保护半导体衬底的上表面和侧面。