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1483 条记录 (耗时 0.037 秒)

    Electronic component built-in substrate and electronic device
    112.
    发明授权
    Electronic component built-in substrate and electronic device 有权

    公开(公告)号：US10211119B2

    公开(公告)日：2019-02-19

    申请号：US15163032

    申请日：2016-05-24

    申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

    发明人： Yasuhiko Kusama ,  Hironobu Hashimoto ,  Takeshi Chino ,  Kazuhiro Kobayashi

    IPC分类号： H05K1/11 ,  H05K3/42 ,  H05K3/46 ,  H01L23/31 ,  H01L23/50 ,  H01L23/498

    摘要： An electronic component built-in substrate includes an insulating base material having a first surface and a second surface opposite to the first surface, an electronic component embedded in the insulating base material and having an electrode on a side surface thereof, a first wiring layer embedded in an area outside the electrode of the electronic component in the insulating base material with a surface of the first wiring layer being exposed from the first surface of the insulating base material, a via conductor reaching from the second surface of the insulating base material to a side surface of the electrode of the electronic component and the first wiring layer, and a second wiring layer formed on the second surface of the insulating base material and connected to the via conductor.

    Wiring board and semiconductor device
    114.
    发明授权
    Wiring board and semiconductor device 有权

    公开(公告)号：US10192815B2

    公开(公告)日：2019-01-29

    申请号：US15441559

    申请日：2017-02-24

    申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

    发明人： Kosuke Tsukamoto ,  Noriyoshi Shimizu

    IPC分类号： H01L23/498 ,  H01L21/48 ,  H01L23/31 ,  H01L23/00 ,  H01L25/065

    摘要： A wiring board includes: a first insulating layer; a first wiring layer formed on a lower surface of the first insulating layer; a first through hole which penetrates the first insulating layer; a first via wiring including: a filling portion formed to fill the first through hole; and a protruding portion protruding upward from an upper surface of the first insulating layer; a second wiring layer including a land, wherein the land includes an outer circumferential portion and a central portion, a second insulating layer formed on the upper surface of the first insulating layer; a second through hole which penetrates the second insulating layer in the thickness direction; a second via wiring formed to fill the second through hole; and a third wiring layer formed on an upper surface of the second insulating layer.

    Optical waveguide apparatus
    115.
    发明授权
    Optical waveguide apparatus 有权

    公开(公告)号：US10185082B2

    公开(公告)日：2019-01-22

    申请号：US15957230

    申请日：2018-04-19

    申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

    发明人： Yusuke Ono

    IPC分类号： G02B6/02 ,  G02B6/122 ,  G02B6/42

    摘要： There is provided an optical waveguide apparatus. The optical waveguide apparatus includes: a first clad layer; a core layer formed on the first clad layer; and a second clad layer formed on the first clad layer to cover the core layer. At least one of the first clad layer and the second clad layer includes a fully cured portion and a semi-cured portion.

    LOOP HEAT PIPE AND METHOD OF MANUFACTURING LOOP HEAT PIPE
    116.
    发明申请
    LOOP HEAT PIPE AND METHOD OF MANUFACTURING LOOP HEAT PIPE 审中-公开

    公开(公告)号：US20190017749A1

    公开(公告)日：2019-01-17

    申请号：US16023020

    申请日：2018-06-29

    申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

    发明人： Nobuyuki KURASHIMA

    IPC分类号： F28D15/02

    摘要： A loop heat pipe includes a first loop heat pipe including a first evaporator, a first condenser, a first liquid pipe, and a first vapor pipe forming a first loop together with the first liquid pipe, a second loop heat pipe including a second evaporator, a second condenser, a second liquid pipe, and a second vapor pipe forming a second loop together with the second liquid pipe, and a connecting part to connect the first condenser and the second evaporator. The first loop and the second loop are separate and independent from each other. The first loop heat pipe, the second loop heat pipe, and the connecting part are integrally formed by a metal.

    SUBSTRATE FIXING DEVICE
    118.
    发明申请
    SUBSTRATE FIXING DEVICE 审中-公开

    公开(公告)号：US20180374735A1

    公开(公告)日：2018-12-27

    申请号：US15956852

    申请日：2018-04-19

    申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

    发明人： Kazuhiro FUJITA

    IPC分类号： H01L21/683 ,  H02N13/00 ,  H01L21/673

    摘要： A substrate fixing device includes a baseplate, an adhesive layer on the baseplate, and an electrostatic chuck on the adhesive layer. The adhesive layer includes a first layer and a second layer. The second layer is between the first layer and the electrostatic chuck. The thermal conductivity of the first layer is higher in a stacking direction in which the baseplate, the adhesive layer, and the electrostatic chuck are stacked than in a plane direction perpendicular to the stacking direction. The thermal conductivity of the second layer is higher in the plane direction than in the stacking direction.

    Cap member and light-emitting device
    119.
    发明授权
    Cap member and light-emitting device 有权

    公开(公告)号：US10164403B2

    公开(公告)日：2018-12-25

    申请号：US15840366

    申请日：2017-12-13

    申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

    发明人： Katsuya Nakazawa

    IPC分类号： H01S5/062 ,  H01S5/022

    摘要： A cap member comprises a cylindrical part, an annular top plate part having an opening formed at a central portion thereof and being configured to cover one end of the cylindrical part, a window glass disposed inside the cylindrical part, and an adhesion member configured to adhere the top plate part and the window glass each other. The top plate part is depressed so that an opening end of the opening enters an inside of the cylindrical part, and an inner surface of the top plate part is configured as a flat inclined surface from a coupling part between the cylindrical part and the top plate part to the opening end.

    Probe guide, probe card, and method for probe guide manufacturing
    120.
    发明授权
    Probe guide, probe card, and method for probe guide manufacturing 有权

    公开(公告)号：US10139430B2

    公开(公告)日：2018-11-27

    申请号：US15420111

    申请日：2017-01-31

    申请人： Japan Electronic Materials Corporation ,  Shinko Electric Industries Co., Ltd.

    发明人： Chikaomi Mori ,  Yuichiro Shimizu ,  Kosuke Fujihara

    IPC分类号： G01R31/28 ,  G01R1/073 ,  G01R3/00

    摘要： OBJECTTo improve the strength of a probe guide and improve the abrasion resistance of the probe guide.MEANS FOR SETTLEMENTA guide plate 20 is formed of a silicon plate 22 having guide holes 23 respectively adapted to support contact probes 13, the inner walls of the guide holes 23 include a guide film 25 formed on the inner wall surfaces of corresponding penetration-processed holes 24 of the silicon plate 22, the cross-sectional areas of the penetration-processed holes 24 gradually increase toward a first surface of the silicon plate 22, and the film thickness of the guide film 25 gradually increases toward the first surface of the silicon plate 22. By employing such a configuration, as compared with the tilts of the inner wall surfaces of the penetration-processed holes 24, the tilts of the inner wall surfaces of the guide holes 23 can be suppressed, and the strength of the silicon plate 20 can be improved. Accordingly, the abrasion resistance of a probe guide 100 can be improved.