公开(公告)号：US10126629B1

公开(公告)日：2018-11-13

申请号：US15668584

申请日：2017-08-03

Applicant: INPHI CORPORATION

Inventor： Xiaoguang Tu ,  Radhakrishnan L. Nagarajan ,  Masaki Kato

IPC: G02F1/225 ,  G02B6/293 ,  G02F1/21

Abstract: An optical dispersion compensator integrated with a silicon photonics system including a first phase-shifter coupled to a second phase-shifter in parallel on the silicon substrate characterized in an athermal condition. The dispersion compensator further includes a third phase-shifter on the silicon substrate to the first phase-shifter and the second phase-shifter through two 2×2 splitters to form an optical loop. A second entry port of a first 2×2 splitter is for coupling with an input fiber and a second exit port of a second 2×2 splitter is for coupling with an output fiber. The optical loop is characterized by a total phase delay tunable via each of the first phase-shifter, the second phase-shifter, and the third phase-shifter such that a normal dispersion (>0) at a certain wavelength in the input fiber is substantially compensated and independent of temperature.

公开(公告)号：US10120150B2

公开(公告)日：2018-11-06

申请号：US15985584

申请日：2018-05-21

Applicant: INPHI CORPORATION

Inventor： Liang Ding ,  Radhakrishnan L. Nagarajan ,  Roberto Coccioli

IPC: G02B6/42 ,  G02B6/13 ,  G02B6/30 ,  H01L21/56 ,  H01L21/768 ,  H01L23/00 ,  H01L25/16 ,  G02B6/12

Abstract: An optical transceiver by hybrid multichip integration. The optical transceiver includes a PCB with a plurality of prefabricated surface bonding sites. A first chip includes a FOWLP package of multiple electronics devices embedded in a dielectric molding layer overlying a dielectric redistribution layer is disposed on the PCB by respectively bonding a plurality of conductor balls between the dielectric redistribution layer and the plurality of prefabricated surface bonding sites while exposing soldering material filled in multiple through-mold vias (TMVs) in the dielectric molding layer. The optical transceiver further includes a second chip configured as a Sipho die comprising photonics devices embedded in a SOI wafer substantially free from any electronics device process. The second chip is stacked over the first chip with multiple conductor bumps being bonded respectively to the soldering material in the multiple TMVs.

公开(公告)号：US10036904B1

公开(公告)日：2018-07-31

申请号：US14226713

申请日：2014-03-26

Applicant: INPHI CORPORATION

Inventor： Radhakrishnan L. Nagarajan

IPC: G02F1/035 ,  G02F1/025

CPC classification number: G02F1/025 ,  G02F1/0121 ,  G02F1/0123 ,  G02F1/2257 ,  G02F2001/0155 ,  G02F2201/58

Abstract: An integrated differential Electro-Absorption Modulator (EAM) device. The device includes a substrate, an electrical driver, and two EAM modules. The electrical driver circuit is configured overlying the substrate member and has one output electrically coupled to the first EAM module and the other output electrically coupled to the second EAM module. The first and second EAM modules have a first and a second output, respectively. A beam splitter can be configured to split an optical input into two optical outputs, each of which can be optically coupled to the optical inputs of the first and second EAM modules.

公开(公告)号：US10031289B2

公开(公告)日：2018-07-24

申请号：US15088862

申请日：2016-04-01

Applicant: INPHI CORPORATION

Inventor： Masaki Kato ,  Radhakrishnan L. Nagarajan

IPC: G02B6/293 ,  G02B6/27 ,  G02B6/122

Abstract: An apparatus of polarization self-compensated delay line interferometer. The apparatus includes a first waveguide arm of a first material of a first length disposed between an input coupler and an output coupler and a second waveguide arm of the first material of a second length different from the first length disposed between the same input coupler and the same output coupler. The apparatus produces an interference spectrum with multiple periodic passband peaks where certain TE (transverse electric) and TM (transverse magnetic) polarization mode passband peaks are lined up. The apparatus further includes a section of waveguide of a birefringence material of a third length added to the second waveguide arm to induce a phase shift of the lined-up TE/TM passband peaks to a designated grid as corresponding polarization compensated channels of a wide optical band.

公开(公告)号：US09958614B2

公开(公告)日：2018-05-01

申请号：US15786156

申请日：2017-10-17

Applicant: INPHI CORPORATION

Inventor： Masaki Kato ,  Radhakrishnan L. Nagarajan

IPC: G02B6/30 ,  G02B6/136 ,  G02B6/122 ,  G02B6/12

CPC classification number: G02B6/305 ,  G02B6/1228 ,  G02B6/136 ,  G02B6/26 ,  G02B2006/12061

Abstract: An apparatus for converting fiber mode to waveguide mode. The apparatus includes a silicon substrate member and a dielectric member having an elongated body. Part of the elongated body from a back end overlies the silicon substrate member and remaining part of the elongated body up to a front end is separated from the silicon substrate member by a second dielectric material at an under region. The apparatus also includes a waveguide including a segment from the back end to a tail end formed on the dielectric member at least partially overlying the remaining part of the elongated body. The segment is buried in a cladding overlying entirely the dielectric member. The cladding has a refractive index that is less than the waveguide but includes an index-graded section with decreasing index that is formed at least over the segment from the tail end toward the back end.

公开(公告)号：US09887516B2

公开(公告)日：2018-02-06

申请号：US15372524

申请日：2016-12-08

Applicant: INPHI CORPORATION ,  Luxnet Corporation

Inventor： Radhakrishnan L. Nagarajan ,  Peng-Chih Li ,  Pi-Cheng Law

IPC: H04B10/50 ,  G02B6/42 ,  H01S5/00 ,  H01S5/022 ,  H01S5/024 ,  H01S5/068 ,  H01S5/06 ,  H01S5/125

CPC classification number: H01S5/0612 ,  G02B6/4204 ,  G02B6/4212 ,  G02B6/4215 ,  G02B6/4271 ,  G02B6/4287 ,  G02B6/4296 ,  H01S5/0064 ,  H01S5/0224 ,  H01S5/02248 ,  H01S5/02284 ,  H01S5/02288 ,  H01S5/02415 ,  H01S5/02438 ,  H01S5/068 ,  H01S5/125 ,  H04B10/501

Abstract: A packaged transmitter device includes a base member comprising a planar part mounted with a thermoelectric cooler, a transmitter, and a coupling lens assembly, and an assembling part connected to one side of the planar part. The device further includes a circuit board bended to have a first end region and a second end region being raised to a higher level. The first end region disposed on a top surface of the planar part includes multiple electrical connection patches respectively connected to the thermoelectric and the transmitter. The second end region includes an electrical port for external connection. Additionally, the device includes a cover member disposed over the planar part. Furthermore, the device includes a cylindrical member installed to the assembling part for enclosing an isolator aligned to the coupling lens assembly along its axis and connected to a fiber to couple optical signal from the transmitter to the fiber.

公开(公告)号：US09864146B1

公开(公告)日：2018-01-09

申请号：US15356438

申请日：2016-11-18

Applicant: INPHI CORPORATION

Inventor： Pei-Keng Fu ,  Chris Kiyoshi Togami ,  Masaki Kato ,  Radhakrishnan L. Nagarajan

IPC: G02B6/30 ,  G02B6/36 ,  G02B6/38

CPC classification number: G02B6/30 ,  G02B6/3636 ,  G02B6/3893

Abstract: An apparatus for handling a fiber-array to be attached with a silicon-photonics chip. The apparatus includes a bottom-plate having a first trench formed with two first branches connected to two first recessed regions at a first end and one second branch straight to a second end thereof and a second trench sharing the same second branch and having two third branches connected to two second recessed regions with an angle towards two sides outside the two first branches. The bottom-plate includes many female clip structures located at the first end, the second end, and the two sides. The apparatus includes a top-plate having corresponding male clip structures configured to lock with the female clip structures to at least have two shaped cavities at the first end for firmly holding fiber ferrules of the fiber-array substantially without lateral and axial motion while leaving excess lengths of fibers outside the second end.

公开(公告)号：US09838135B1

公开(公告)日：2017-12-05

申请号：US15061994

申请日：2016-03-04

Applicant: INPHI CORPORATION

Inventor： Chao Xu ,  Radhakrishnan L. Nagarajan

IPC: H04B10/25 ,  H04B10/516 ,  H04B10/50

CPC classification number: H04B10/516 ,  H04B10/503

Abstract: Embodiments are directed to a driver circuit for an electro-absorption modulator (EAM). Particular embodiments may employ a single differential electrical driver supplying complementary positive and negative voltage signals to two respective EAMs. DC bias for the EAMs is provided at a common node in the middle. An optical source is split and fed to each of the EAMs. The EAM receiving the positive voltage signal functions to communicate the optical data as output. The other EAM receiving the negative voltage is a dummy device providing a balance load for the differential driver circuit. Signal swing is determined by a termination resistor Rt located between parallel rails of the differential driver circuit. EAM properties such as swing and signal integrity can be traded off by choosing a different value for the termination resistor. In certain embodiments, the optical output of the dummy EAM may be used for device monitoring purposes.

公开(公告)号：US09780881B1

公开(公告)日：2017-10-03

申请号：US14881401

申请日：2015-10-13

Applicant: INPHI CORPORATION

Inventor： Todd Rope ,  Radhakrishnan L. Nagarajan ,  Jamal Riani ,  Pulkit Khandelwal

IPC: H04B10/40 ,  H04B10/079

CPC classification number: H04B10/40 ,  H04B10/0731 ,  H04B10/0795 ,  H04B10/524

Abstract: A Pulse Amplitude Modulated (PAM) optical device utilizing multiple wavelengths, features a communications interface having enhanced diagnostics capability. New registers are created to house additional diagnostic information, such as error rates. The diagnostic information may be stored in raw form, or as processed on-chip utilizing local resources.

公开(公告)号：US09671557B1

公开(公告)日：2017-06-06

申请号：US15061946

申请日：2016-03-04

Applicant: INPHI CORPORATION

Inventor： Liang Ding ,  Radhakrishnan L. Nagarajan

IPC: G02B6/12 ,  G02B6/122 ,  G02B6/132 ,  G02B6/136

CPC classification number: G02B6/132 ,  G02B6/122 ,  G02B6/125 ,  G02B6/136 ,  G02B2006/12061

Abstract: A silicon photonics device of hybrid waveguides having a coupling interlayer with an accurately controlled thickness and a method of making the same. The device includes a first plurality of Si waveguides formed in a SOI substrate and a first layer of SiO2 overlying the first plurality of Si waveguides and a second plurality of Si3N4 waveguides formed on the first layer of SiO2. At least one Si3N4 waveguide is disposed partially overlapping with at least one of the first plurality Si waveguides in vertical direction separated by the first layer of SiO2 with a thickness controlled no greater than 90 nm. The device includes a second layer of SiO2 overlying the second plurality of Si3N4 waveguides. The method of accurately controlling the coupling interlayer SiO2 thickness includes a multilayer SiO2/Si3N4/SiO2 hard mask process for SiO2 etching and polishing as stopping and buffering layer as well as Si waveguide etching mask.