LED display apparatus
    117.
    发明授权

    公开(公告)号:US11489002B2

    公开(公告)日:2022-11-01

    申请号:US17082018

    申请日:2020-10-28

    Abstract: A display apparatus including a display substrate, a plurality of light emitting devices disposed on the display substrate, a light blocking layer disposed between the light emitting devices, and a transparent layer covering the light emitting devices and the light blocking layer, in which the light emitting device includes a first LED sub-unit, a second LED sub-unit disposed on the first LED sub-unit, and a third LED sub-unit disposed on the second LED sub-unit, and the third LED sub-unit is disposed closer to an upper surface of the light emitting device than the first LED sub-unit.

    Light emitting device including light shielding layer

    公开(公告)号:US11482650B2

    公开(公告)日:2022-10-25

    申请号:US16672691

    申请日:2019-11-04

    Inventor: Chung Hoon Lee

    Abstract: A light emitting device including a substrate having a first surface and a second surface opposing each other, a plurality of light emitting parts disposed on the first surface of the substrate and defining a light emitting area, and a light shielding layer disposed on the second surface of the substrate and exposing at least a portion of the light emitting area, in which the light shielding layer has a thickness greater than a length of the longest wavelength among wavelengths of light generated from the light emitting parts.

    Method of transferring light emitting device for display and display apparatus

    公开(公告)号:US11387383B2

    公开(公告)日:2022-07-12

    申请号:US16788605

    申请日:2020-02-12

    Inventor: Chung Hoon Lee

    Abstract: A method of transferring a light emitting device including the steps of preparing a wafer including a substrate, semiconductor layers disposed on the substrate, and bump pads disposed on the semiconductor layers and arranged in a plurality of light emitting device regions, dividing the wafer into a plurality of light emitting devices, attaching the light emitting devices to a transfer tape disposed on a supporting substrate, such that the substrate contacts the transfer tape, preparing a circuit board including pads arranged thereon, adjoining the supporting substrate with the circuit board, so that the bump pads of at least one light emitting device contact the pads of the circuit board, bonding the at least one light emitting device to the pads by applying heat to the bump pads and the pads, and separating the at least one light emitting device bonded to the pads from the transfer tape.

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