MEASUREMENT DEVICE, MEASUREMENT SYSTEM, AND MEASUREMENT METHOD

    公开(公告)号:US20240210334A1

    公开(公告)日:2024-06-27

    申请号:US18600451

    申请日:2024-03-08

    CPC classification number: G01N23/201 G01N21/4788 G01N21/9501 G01N23/207

    Abstract: A measurement device includes: an X-ray irradiation section; an X-ray detection section configured to detect scattered X-rays generated from an object; and an analysis section configured to analyze diffraction images obtained through photoelectric conversion of the scattered X-rays and estimate a three-dimensional shape of the object. A recessed portion is formed in a first film from an opening portion in a second film formed on the first film. The analysis section estimates a three-dimensional shape of the object on the basis of the diffraction images acquired while an irradiation angle of the X-rays with respect to the object is changed and shape data obtained by measuring the object in advance. The shape data include a film thickness of the second film, a neck diameter, and a bottom diameter.

    Methods and systems for compact, small spot size soft x-ray scatterometry

    公开(公告)号:US12013355B2

    公开(公告)日:2024-06-18

    申请号:US17411030

    申请日:2021-08-24

    Abstract: Methods and systems for performing measurements of semiconductor structures based on high-brightness, Soft X-Ray (SXR) illumination over a small illumination spot size with a small physical footprint are presented herein. In one aspect, the focusing optics of an SXR based metrology system project an image of the illumination source onto a specimen under measurement with a demagnification of at least 1.25. In a further aspect, an illumination beam path from the x-ray illumination source to the specimen under measurement is less than 2 meters. In another aspect, SXR based measurements are performed with x-ray radiation in the soft x-ray region (i.e., 80-3000 eV). In some embodiments, SXR based measurements are performed at grazing angles of incidence in a range from near zero degrees to 90 degrees. In some embodiments, the illumination optics project an image of an illumination source onto a specimen under measurement with a demagnification of 50, or less.

    X-ray scattering apparatus
    118.
    发明授权

    公开(公告)号:US11796485B2

    公开(公告)日:2023-10-24

    申请号:US17621005

    申请日:2020-12-29

    Applicant: XENOCS SAS

    Abstract: An X-ray scattering apparatus having a sample holder for aligning and/or orienting a sample to be analyzed by X-ray scattering, a first X-ray beam delivery system having a first X-ray source and a first monochromator being arranged upstream of the sample holder for generating and directing a first X-ray beam along a beam path, a distal X-ray detector arranged downstream of the sample holder and being movable, in a motorized way, is disclosed. The first X-ray beam delivery system is configured to focus the first X-ray beam onto a focal spot near the distal X-ray detector when placed at its largest distance from the sample holder or produce a parallel beam so that the X-ray scattering apparatus has a second X-ray beam delivery system having a second X-ray source and being configured to generate and direct a divergent second X-ray beam towards the sample holder for X-ray imaging.

    Spot-size control in reflection-based and scatterometry-based X-ray metrology systems

    公开(公告)号:US11781999B2

    公开(公告)日:2023-10-10

    申请号:US17830389

    申请日:2022-06-02

    CPC classification number: G01N23/201 G01N23/207 G01N2223/045 G01N2223/6116

    Abstract: An X-ray system includes, first and second X-ray channels (XCs), a spot sizer and a processor. The first XC is configured to: (i) direct a first X-ray beam for producing a spot on a surface of a sample, and (ii) produce a first signal responsively to a first X-ray radiation received from the surface. The spot sizer is positioned at a distance from the surface and is shaped and positioned to set the spot size by passing to the surface a portion of the first X-ray beam. The second XC is configured to: (i) direct a second X-ray beam to the surface, and (ii) produce a second signal responsively to a second X-ray radiation received from the surface, and the processor is configured to: (i) perform an analysis of the sample based on the first signal, and (ii) estimate the size of the spot based on the second signal.

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