公开(公告)号：US07323393B2

公开(公告)日：2008-01-29

申请号：US11715527

申请日：2007-03-07

Applicant: Yu-Lin Yen ,  Ching-Yu Chang

Inventor： Yu-Lin Yen ,  Ching-Yu Chang

IPC: H01L21/76

CPC classification number: G03F9/7003 ,  G03F7/70633 ,  G03F9/7076 ,  G03F9/708 ,  G03F9/7084 ,  H01L23/544 ,  H01L2223/5442 ,  H01L2223/54453 ,  H01L2924/0002 ,  Y10S438/975 ,  H01L2924/00

Abstract: An integrated circuit capable of operating despite a profile shift is disclosed. Overlay marks on the integrated circuit are surrounded by a trench that tends to relieve the effect of a profile shift caused by stress applied to the integrated circuit. The position of the overlay marks tends, therefore, not to be affected by the stress.

Abstract translation: 公开了尽管轮廓偏移的能够运行的集成电路。 集成电路上的覆盖标记被沟槽包围，该沟槽倾向于减轻由施加到集成电路的应力引起的轮廓移位的影响。 因此，覆盖标记的位置倾向于不受应力的影响。

公开(公告)号：US07252911B2

公开(公告)日：2007-08-07

申请号：US10810920

申请日：2004-03-26

Applicant: Ching-Yu Chang

Inventor： Ching-Yu Chang

IPC: G03F1/00

CPC classification number: G03F1/60 ,  G03F1/40 ,  H01J2237/31794

Abstract: An ESD-resistant photomask and method of preventing mask ESD damage is disclosed. The ESD-resistant photomask includes a mask substrate, a pattern-forming material provided on the substrate, a circuit pattern defined by exposure regions etched in the pattern-forming material, and positive or negative ions implanted into the mask substrate throughout ion implantation regions. The ions in the ion implantation regions dissipate electrostatic charges on the mask, thus preventing the buildup of electrostatic charges which could otherwise attract image-distorting particles to the mask or damage the mask.

Abstract translation: 公开了一种防静电防护光掩模和防止掩膜ESD损伤的方法。 防静电光掩模包括掩模基板，设置在基板上的图案形成材料，由在图案形成材料中蚀刻的曝光区域限定的电路图案，以及在离子注入区域中注入到掩模基板中的正或负离子。 离子注入区域中的离子消耗掩模上的静电电荷，从而防止静电电荷的积累，否则可能会吸引图像变形颗粒到掩模或损坏掩模。

公开(公告)号：US07224427B2

公开(公告)日：2007-05-29

申请号：US10910480

申请日：2004-08-03

Applicant: Ching-Yu Chang ,  Chien-Hung Lin ,  Chin-Hsiang Lin ,  David Lu ,  Horng-Huei Tseng ,  Burn-Jeng Lin

Inventor： Ching-Yu Chang ,  Chien-Hung Lin ,  Chin-Hsiang Lin ,  David Lu ,  Horng-Huei Tseng ,  Burn-Jeng Lin

IPC: G03B27/52

CPC classification number: G03F7/70341

Abstract: A megasonic immersion lithography exposure apparatus and method for substantially eliminating microbubbles from an exposure liquid in immersion lithography is disclosed. The apparatus includes an optical system for projecting light through a mask and onto a wafer.An optical transfer chamber is provided adjacent to the optical system for containing an exposure liquid. At least one megasonic plate operably engages the optical transfer chamber for inducing sonic waves in and eliminating microbubbles from the exposure liquid.

Abstract translation: 公开了一种用于在浸没式光刻中基本上消除曝光液体中的微泡的兆声浸没式光刻曝光装置和方法。 该装置包括用于通过掩模将光投射到晶片上的光学系统。 光学传递室邻近光学系统设置，用于容纳曝光液体。 至少一个兆欧表板可操作地接合光学传递室，用于在曝光液体中引入声波并消除微泡。

公开(公告)号：US20070082275A1

公开(公告)日：2007-04-12

申请号：US11245522

申请日：2005-10-07

Applicant: Ching-Yu Chang

Inventor： Ching-Yu Chang

IPC: G03F1/00

CPC classification number: G03F1/36

Abstract: An optical proximity correction photomask comprises a transparent substrate, a main feature having a first transmitivity disposed on the transparent substrate and at least one assist feature having a second transmitivity disposed beside the main feature and on the transparent substrate, wherein the first transmitivity is not equal to the second transmitivity.

Abstract translation: 光学邻近校正光掩模包括透明衬底，具有设置在透明衬底上的第一透射率的主要特征和在主要特征旁边和透明衬底上具有第二透射率的至少一个辅助特征，其中第一透射率不相等 到第二个透射率。

公开(公告)号：US07192845B2

公开(公告)日：2007-03-20

申请号：US10864562

申请日：2004-06-08

Applicant: Yu Lin Yen ,  Ching-Yu Chang

Inventor： Yu Lin Yen ,  Ching-Yu Chang

IPC: H01L21/76 ,  H01L21/78 ,  H01L21/46 ,  H01L23/544

CPC classification number: H01L23/544 ,  H01L2223/54453 ,  H01L2924/0002 ,  Y10S438/975 ,  H01L2924/00

Abstract: An integrated circuit in which measurement of the alignment between subsequent layers has less susceptibility to stress induced shift. A first layer of the structure has a first overlay mark. A second and/or a third layer are formed in the alignment structure and on the first layer. Portions of the second and/or third layer are selectively removed from regions in and around the first overlay mark. A second overlay mark is formed and aligned to the first overlay mark. The alignment between the second overlay mark and first overlay mark may be measured with an attenuated error due to reflection and refraction or due to an edge profile shift of the first overlay mark.

Abstract translation: 一种集成电路，其中后续层之间的对准测量对应力诱导偏移具有较小的敏感性。 该结构的第一层具有第一覆盖标记。 在对准结构中和第一层上形成第二层和/或第三层。 第二层和/或第三层的部分从第一重叠标记中和周围的区域选择性地去除。 形成第二重叠标记并与第一覆盖标记对准。 可以由于反射和折射或由于第一重叠标记的边缘轮廓偏移而具有衰减误差来测量第二覆盖标记和第一覆盖标记之间的对准。

公开(公告)号：US20070037410A1

公开(公告)日：2007-02-15

申请号：US11426233

申请日：2006-06-23

Applicant: Ching-Yu CHANG ,  Chin-Hsiang LIN ,  Burn Jeng LIN

Inventor： Ching-Yu CHANG ,  Chin-Hsiang LIN ,  Burn Jeng LIN

IPC: H01L21/31 ,  H01L21/469

CPC classification number: G03F7/40 ,  G03F7/405 ,  H01L21/0273 ,  H01L21/3081 ,  H01L21/3086

Abstract: A method of lithography patterning includes forming a first material layer on a substrate, the first material layer being substantially free of silicon, and forming a patterned resist layer including at least one opening therein above the first material layer. A second material layer containing silicon is formed on the patterned resist layer and an opening is formed in the first material layer using the second material layer as a mask.

Abstract translation: 光刻图案的方法包括在基底上形成第一材料层，第一材料层基本上不含硅，并且在第一材料层上方形成包括至少一个开口的图案化抗蚀剂层。 在图案化的抗蚀剂层上形成含有硅的第二材料层，并且使用第二材料层作为掩模在第一材料层中形成开口。

公开(公告)号：US20070037089A1

公开(公告)日：2007-02-15

申请号：US11427721

申请日：2006-06-29

Applicant: Ching-Yu CHANG

Inventor： Ching-Yu CHANG

IPC: G03C1/00

CPC classification number: G03F7/091

Abstract: An anti-reflective coating comprises a plurality of main backbone chains, and at least one long free polymer chain coupled to at least one of the plurality of main backbone chains.

Abstract translation: 抗反射涂层包含多个主要主链，以及至少一个与多个主要主链中的至少一个连接的长自由聚合物链。

公开(公告)号：US20070020877A1

公开(公告)日：2007-01-25

申请号：US11186360

申请日：2005-07-21

Applicant: Uway Tseng ,  Ching-Yu Chang

Inventor： Uway Tseng ,  Ching-Yu Chang

IPC: H01L21/76

CPC classification number: H01L21/76224

Abstract: A shallow trench isolation structure has a trench formed in a substrate, a silicon oxynitride layer conformally formed on the sidewalls and bottom of the trench, and a high density plasma (HDP) oxide layer substantially filling the trench.

Abstract translation: 浅沟槽隔离结构具有在衬底中形成的沟槽，保形地形成在沟槽的侧壁和底部上的氧氮化硅层和基本上填充沟槽的高密度等离子体（HDP）氧化物层。

公开(公告)号：US20070002296A1

公开(公告)日：2007-01-04

申请号：US11384624

申请日：2006-03-20

Applicant: Ching-Yu Chang ,  Vincent Yu ,  Chin-Hsiang Lin

Inventor： Ching-Yu Chang ,  Vincent Yu ,  Chin-Hsiang Lin

IPC: G03B27/42

CPC classification number: G03F7/70341

Abstract: A method of performing immersion lithography on a semiconductor substrate includes providing a layer of resist onto a surface of the semiconductor substrate and exposing the resist layer using an immersion lithography exposure system. The immersion lithography exposure system utilizes a fluid during exposure and may be capable of removing some, but not all, of the fluid after exposure. After exposure, a treatment process is used to remove the remaining portion of fluid from the resist layer. After treatment, a post-exposure bake and a development step are used.

Abstract translation: 在半导体衬底上进行浸渍光刻的方法包括在半导体衬底的表面上提供抗蚀剂层并使用浸没光刻曝光系统曝光抗蚀剂层。 浸没式光刻曝光系统在曝光期间利用流体，并且可以在曝光后能够去除一些但不是全部的流体。 曝光后，使用处理工艺从抗蚀剂层中除去剩余部分的流体。 处理后，使用曝光后烘烤和显影步骤。

公开(公告)号：US20060172520A1

公开(公告)日：2006-08-03

申请号：US11050312

申请日：2005-02-03

Applicant: Ching-Yu Chang ,  Chin-Hsiang Lin ,  Burn Lin

Inventor： Ching-Yu Chang ,  Chin-Hsiang Lin ,  Burn Lin

IPC: H01L21/4763 ,  H01L21/3205

CPC classification number: H01L21/76802 ,  H01L21/31144

Abstract: A method for forming a semiconductor device includes forming a photoresist layer over a substrate and patterning the photoresist layer to form photoresist portions. A second layer is formed over the substrate in areas not covered by the photoresist portions and the photoresist portions are removed. After removing the photoresist portions, the second layer is used to modify the substrate to create at least a portion of the semiconductor device.

Abstract translation: 一种用于形成半导体器件的方法包括在衬底上形成光致抗蚀剂层并图案化光致抗蚀剂层以形成光致抗蚀剂部分。 在不被光致抗蚀剂部分覆盖的区域中的衬底上形成第二层，并去除光致抗蚀剂部分。 在去除光致抗蚀剂部分之后，第二层用于修改基板以产生半导体器件的至少一部分。