公开(公告)号：US06396043B1

公开(公告)日：2002-05-28

申请号：US09448538

申请日：1999-11-22

Applicant: Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

Inventor： Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

IPC: H01L2700

CPC classification number: H01L24/97 ,  H01L27/14601 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2224/81

Abstract: A thin image sensor package includes an image sensor having an active area which is responsive to radiation. The image sensor is mounted to a substrate which is transparent to the radiation. The image sensor is mounted such that the active area of the image sensor faces the substrate. Of importance, the substrate serves a dual function. In particular, the substrate is the window which covers the active area of the image sensor. Further, the substrate is the platform upon which the image sensor package is fabricated. As a result, the image sensor package is thin, lightweight and inexpensive to manufacture.

Abstract translation: 薄图像传感器封装包括具有响应于辐射的有效区域的图像传感器。 图像传感器安装在对辐射透明的基板上。 图像传感器被安装成使得图像传感器的有效区域面向基板。 重要的是，衬底具有双重功能。 特别地，衬底是覆盖图像传感器的有效区域的窗口。 此外，基板是制造图像传感器封装的平台。 因此，图像传感器封装薄，重量轻且制造成本低廉。

公开(公告)号：US09506232B2

公开(公告)日：2016-11-29

申请号：US14226742

申请日：2014-03-26

Applicant: Steven Webster Terry

Inventor： Steven Webster Terry

IPC: E03D5/04

CPC classification number: E03D5/04

Abstract: A toilet bowl lid actuated linkage toilet flushing system wherein a conventional toilet-flushing flapper is actuated by a drain pull chain controlled relative to the positioning of the toilet bowl lid to the toilet. The toilet bowl lid must be moved from an upward position to a downward position to flush the toilet, which a magnetic plastic ribbon actuator mechanism is provided for completion of the toilet flush even when the toilet bowl lid remains in the downward position. Movement of the lid actuates a magnetic flush pull of a plastic ribbon that is linked to a drain pull chain connected to the flapper. An alternate version of the toilet bowl lid actuated linkage toilet flushing system is compatible with flushometer toilets and enables an opening and closing of a valve controlling outflow of a pressurized water source.

Abstract translation: 马桶盖致动联动马桶冲洗系统，其中传统的马桶冲洗挡板由相对于马桶盖的定位控制到马桶的排水拉链致动。 马桶盖必须从向上位置移动到向下的位置以冲洗马桶，即使当马桶盖保持在向下位置时，提供磁性塑料带致动器机构来完成马桶冲洗。 盖的运动致动与连接到挡板的排水拉链连接的塑料带的磁力齐平拉动。 马桶盖驱动联动马桶冲洗系统的替代版本与弗洛斯特马桶相配套，并且能够打开和关闭控制加压水源流出的阀门。

公开(公告)号：US20150027849A1

公开(公告)日：2015-01-29

申请号：US14507089

申请日：2014-10-06

Applicant: Mohsen Shahmirzadi Yeganeh ,  Peter W. Jacobs ,  Ian Alfred Cody ,  Steven Webster Levine ,  Eric B. Sirota ,  Ramesh Gupta ,  Walter Weissman

Inventor： Mohsen Shahmirzadi Yeganeh ,  Peter W. Jacobs ,  Ian Alfred Cody ,  Steven Webster Levine ,  Eric B. Sirota ,  Ramesh Gupta ,  Walter Weissman

IPC: C10G32/02

CPC classification number: C10G32/02 ,  C10G25/003 ,  C10G25/06 ,  C10G25/12 ,  C10G2300/202 ,  C10G2300/206

Abstract: The present invention relates to methods and systems for removing polar molecule contaminants from a refinery stream in connection with the processing of hydrocarbon fluids, chemicals, whole crude oils, blends and fractions in refineries and chemical plants that include adding high surface energy and/or high surface area nanoparticle compounds to a refinery stream to remove the polar molecule contaminants.

Abstract translation: 本发明涉及在炼油厂和化学工厂中与碳氢化合物流体，化学品，全部原油，混合物和馏分的加工相关的炼油厂流中去除极性分子污染物的方法和系统，包括加入高表面能和/或高 表面积纳米颗粒化合物转化为精炼物流以除去极性分子污染物。

公开(公告)号：US20110041067A1

公开(公告)日：2011-02-17

申请号：US09873163

申请日：2001-06-02

Applicant: Steven Olson ,  Steven Webster ,  Jordan Holt ,  John McGarry

Inventor： Steven Olson ,  Steven Webster ,  Jordan Holt ,  John McGarry

IPC: G06F3/048 ,  G06F15/16

CPC classification number: G06F9/451

Abstract: A method is disclosed for instructing a user interface (UI) in communication with a first of vision processor (VP) to establish communication with a second (VP). The invention is useful in a machine vision system having a plurality of VPs and at least one UI. The method includes the steps of providing each VP with a link function for establishing communication between a VP and a UI; and activating the link function so as to issue instructions to the UI to establish communication with another VP. The link function enables local dynamic display of a remote VP on the UI, and a dynamic connection that provides a continually updated display representing a current state of the VP connected to the UI. An operator may observe results and alter parameters on any of the VPs in the system without having to first understand the architecture of the machine vision system.

Abstract translation: 公开了一种用于指示与第一视觉处理器（VP）通信的用户界面（UI）与第二（VP）建立通信的方法。 本发明在具有多个VP和至少一个UI的机器视觉系统中是有用的。 该方法包括以下步骤：为每个VP提供用于建立VP与UI之间的通信的链接功能; 并激活链接功能，以向UI发出指令以建立与另一个VP的通信。 链接功能使得UI上的远程VP的本地动态显示以及提供连续更新的显示的动态连接表示连接到UI的VP的当前状态。 操作员可以观察系统中任何VP的结果并更改参数，而无需首先了解机器视觉系统的架构。

公开(公告)号：US07540672B2

公开(公告)日：2009-06-02

申请号：US11262592

申请日：2005-10-31

Applicant: Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu ,  Po-Chih Hsu

Inventor： Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu ,  Po-Chih Hsu

IPC: G03B17/00

CPC classification number: H04N5/2254 ,  G02B7/025 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H04N5/2253 ,  H01L2924/00014

Abstract: A digital still camera module includes an image sensor package (2) and a lens barrel (30) mounted on the image sensor package. The image sensor package includes a substrate (20), an image sensor chip (22), and a cover (28). The substrate defines a receiving chamber (203) therein. The image sensor chip mounted in the receiving chamber of the substrate. The cover, which is transparent and has a smaller profile than that of the substrate, is secured to the top portion of the substrate thereby sealing the receiving chamber. The top portion of the substrate has an uncovered section (29) at a periphery of the cover. The lens barrel includes at least one lens (31) received therein. The lens barrel is securely attached to the uncovered section of the top portion of the substrate.

Abstract translation: 数字静态照相机模块包括安装在图像传感器封装上的图像传感器封装（2）和透镜镜筒（30）。 图像传感器封装包括基板（20），图像传感器芯片（22）和盖子（28）。 衬底在其中限定接收室（203）。 图像传感器芯片安装在基板的接收室中。 透明并且具有比基板更小的轮廓的盖被固定到基板的顶部，从而密封接收室。 衬底的顶部在盖的周边具有未覆盖部分（29）。 镜筒包括容纳在其中的至少一个透镜（31）。 透镜筒牢固地附接到基板的顶部的未覆盖部分。

公开(公告)号：US20080308717A1

公开(公告)日：2008-12-18

申请号：US12221948

申请日：2008-08-08

Applicant: Thomas P. Glenn ,  Steven Webster

Inventor： Thomas P. Glenn ,  Steven Webster

IPC: H01J5/02

CPC classification number: H01L27/14625 ,  B29C33/0022 ,  B29C43/36 ,  B29C2043/023 ,  H01L24/73 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14632 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16153 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An image sensor package includes a molding having a locking feature. The package further includes a snap lid having a tab, where the tab is attached to the locking feature of the molding. To form the image sensor package, a window is placed in a pocket of the molding. The snap lid is secured in place. Once secured, the snap lid presses against a peripheral region of an exterior surface of the window. The window is sandwiched between the molding and the snap lid and held in place.

Abstract translation: 图像传感器封装包括具有锁定特征的模制件。 该包装还包括具有突片的卡扣盖，其中突片附接到模制件的锁定特征。 为了形成图像传感器封装，将窗口放置在模制品的口袋中。 卡扣盖固定就位。 一旦固定，卡扣盖压靠窗口外表面的周边区域。 窗口夹在模制件和卡扣盖之间并保持就位。

公开(公告)号：US07361880B2

公开(公告)日：2008-04-22

申请号：US11478503

申请日：2006-06-28

Applicant: Steven Webster

Inventor： Steven Webster

IPC: H01L27/00 ,  H01L27/14 ,  H01L23/02 ,  H01L23/52

CPC classification number: H01L27/14625 ,  H01L27/14618 ,  H01L27/14634 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/16151 ,  H05K1/118 ,  H05K3/326 ,  H01L2924/00014

Abstract: A digital camera module (100) includes a holder, an image sensor chip package (30), a number of conductive elements (24) and a circuit board (40). The holder defines a receiving portion. The holder is mounted on the image sensor chip package. The image sensor chip package has a number of outer pads. The outer pads are positioned in the receiving portion of the holder. The conductive elements are received in the receiving portion. One end of each of the conductive elements is connected to the inner pads, the other end of each of the conductive elements is connected to the circuit board.

Abstract translation: 数字照相机模块（100）包括保持器，图像传感器芯片封装（30），多个导电元件（24）和电路板（40）。 保持器限定接收部分。 保持器安装在图像传感器芯片封装上。 图像传感器芯片封装具有多个外部焊盘。 外垫位于保持器的接收部分中。 导电元件被接收在接收部分中。 每个导电元件的一端连接到内部焊盘，每个导电元件的另一端连接到电路板。

公开(公告)号：US20070152147A1

公开(公告)日：2007-07-05

申请号：US11706726

申请日：2007-02-14

Applicant: Steven Webster

Inventor： Steven Webster

IPC: H01J5/02 ,  H01J40/14

CPC classification number: H01L27/14627 ,  G02B7/02 ,  G02B7/022 ,  H01L24/73 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14636 ,  H01L27/14683 ,  H01L27/14685 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/02325 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H04N5/2251 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  Y10T29/49002 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window such that the window is exposed through the aperture. A lens is supported in a threaded lens support. The threaded lens support is threaded into the aperture of the lens holder extension portion. The lens is readily adjusted relative to the image sensor by rotating the lens support.

Abstract translation: 图像传感器封装包括图像传感器，窗口和模制件，其中模制件包括从窗户向上延伸的透镜保持器延伸部分。 透镜保持器延伸部分包括从窗口延伸的阴螺纹孔，使得窗口通过孔露出。 透镜支撑在螺纹透镜支架中。 带螺纹的透镜支撑件被拧入透镜保持器延伸部分的孔中。 通过旋转透镜支架，相对于图像传感器容易地调节透镜。

公开(公告)号：US20070057149A1

公开(公告)日：2007-03-15

申请号：US11453456

申请日：2006-06-14

Applicant: Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu

Inventor： Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu

IPC: H01L27/00

CPC classification number: H01L27/14685 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: An image sensor package method includes the steps of first, providing a carrier (30), which includes a base (24) and a leadframe (320). The base has a cavity therein and the leadframe includes a number of conductive pieces; Second, mounting an image sensor chip on the base and received in the cavity, the image sensor having a photosensitive area. Third, providing a plurality of wires, each electrically connects the image sensor chip and a corresponding one of the conductive pieces of the carrier. Fourth, applying an adhesive means around the image sensor chip that at least partially covers all the wires. Finally, mounting a transparent cover on the carrier, where an adhesive means fixes the cover in place.

Abstract translation: 图像传感器封装方法包括以下步骤：首先提供一种包括基座（24）和引线框架（320）的载体（30）。 基座在其中具有空腔，引线框架包括多个导电件; 第二，将图像传感器芯片安装在基座上并被接纳在空腔中，图像传感器具有感光区域。 第三，提供多条导线，每个电线将图像传感器芯片和载体的相应的一个导电片电连接。 第四，在图像传感器芯片周围施加至少部分地覆盖所有电线的粘合剂装置。 最后，将透明盖子安装在托架上，粘合剂将盖子固定在适当位置。

公开(公告)号：US20070034772A1

公开(公告)日：2007-02-15

申请号：US11448314

申请日：2006-06-07

Applicant: Steven Webster ,  Ying-Cheng Wu

Inventor： Steven Webster ,  Ying-Cheng Wu

IPC: C12Q1/68

CPC classification number: H04N5/2253 ,  H01L2224/32014 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/16195 ,  H01L2924/00014

Abstract: A digital camera module includes a barrel (10), a seat (20) and an image sensor chip package (30) in accordance with a preferred embodiment is shown. The image sensor chip package includes a carrier (32), a chip (34), a number of bonding wires (36) and a cover (38). The carrier includes a base (24). The chip is mounted on the base and has an active area. The second conductive means electronically connects the chip and the conductive means. An adhesive means is applied around the active area of the chip. The transparent cover is mounted to the base of the carrier. The cover adheres to the carrier with the adhesive means and defines a sealing space (37) for sealing the active area of the chip therein. The active area of the chip is sufficiently protected from pollution by the small volume of the sealing space.

Abstract translation: 示出了根据优选实施例的数字照相机模块，包括镜筒（10），座（20）和图像传感器芯片封装（30）。 图像传感器芯片封装包括载体（32），芯片（34），多个接合线（36）和盖（38）。 载体包括基部（24）。 芯片安装在基座上并具有有效区域。 第二导电装置电连接芯片和导电装置。 在芯片的有效区域周围施加粘合剂。 透明盖安装在托架的底座上。 盖子用粘合剂粘合到载体上并且限定用于密封芯片的有效区域的密封空间（37）。 芯片的有效面积被充分保护，免受小体积密封空间的污染。