公开(公告)号：US20140144551A1

公开(公告)日：2014-05-29

申请号：US13820581

申请日：2011-09-02

申请人： Izuru Minato ,  Nobuaki Takahashi ,  Akio Yamamoto

发明人： Izuru Minato ,  Nobuaki Takahashi ,  Akio Yamamoto

IPC分类号： C22C38/50 ,  C22C38/48 ,  C22C38/46 ,  C22C38/00 ,  C22C38/42 ,  C22C38/06 ,  C22C38/04 ,  C22C38/02 ,  C21D8/02 ,  C22C38/44

CPC分类号： C22C38/50 ,  C21D8/0205 ,  C21D8/0226 ,  C21D8/0263 ,  C21D2211/002 ,  C21D2211/005 ,  C21D2211/009 ,  C22C38/001 ,  C22C38/002 ,  C22C38/02 ,  C22C38/04 ,  C22C38/06 ,  C22C38/42 ,  C22C38/44 ,  C22C38/46 ,  C22C38/48 ,  C22C38/58 ,  F16L9/02

摘要： A high-strength steel sheet having improved HIC resistance and fracture resistance even when it is thick has a chemical composition comprising, in mass %, C: 0.02-0.07%, Si: 0.05-0.50%, Mn: 1.10-1.60%, P: at most 0.015%, S: at most 0.0030%, Nb: 0.005-0.030%, Ti: 0.005-0.020%, Al: 0.005-0.060%, Ca: 0.0005-0.0060%, N: 0.0015-0.0070%, at least one of Cu, Ni, Cr, and Mo in a total of greater than 0.1% to less than 1.5%, and a remainder of Fe and impurities and a steel structure composed of at least 10% by area of bainite and a remainder of ferrite and pearlite. The degree of segregation is less than 1.6 for Nb and less than 1.4 for Mn in the central portion of the thickness of the steel sheet.

摘要翻译： 即使厚度高的耐HIC和耐断裂性提高的高强度钢板也具有以质量％计含有C：0.02-0.07％，Si：0.05-0.50％，Mn：1.10-1.60％，P ：至少0.015％，S：0.0030％以下，Nb：0.005〜0.030％，Ti：0.005〜0.020％，Al：0.005〜0.060％，Ca：0.0005〜0.0060％，N：0.0015-0.0070％ Cu，Ni，Cr和Mo中的一种总计大于0.1％至小于1.5％，剩余的Fe和杂质以及由贝氏体至少10％的面积组成的钢结构和剩余的铁素体 和珠光体。 对于Nb，偏析度小于1.6，在钢板的中心部分的Mn小于1.4。

公开(公告)号：US20130170575A1

公开(公告)日：2013-07-04

申请号：US13819301

申请日：2011-08-24

申请人： Masahiro Imai ,  Nobuaki Takahashi

发明人： Masahiro Imai ,  Nobuaki Takahashi

IPC分类号： H04L1/00

CPC分类号： H04L1/0001 ,  G06F1/10 ,  G06F13/4282 ,  G06F13/4291 ,  H04L7/0008 ,  H04L25/0264

摘要： A master device and slave devices are connected with each other through an SDA and an SCL, and at least one of a serial communication data signal communicated through the SDA and a serial communication clock signal communicated through the SCL is latched with use of a noise removal clock signal whose frequency is higher than that of the serial communication clock signal, and is taken in.

摘要翻译： 主设备和从设备通过SDA和SCL彼此连接，并且通过SDA传送的串行通信数据信号和通过SCL传送的串行通信时钟信号中的至少一个被使用噪声消除 时钟信号的频率高于串行通信时钟信号，并被接收。

公开(公告)号：US08456019B2

公开(公告)日：2013-06-04

申请号：US13461230

申请日：2012-05-01

申请人： Masaya Kawano ,  Koji Soejima ,  Nobuaki Takahashi

发明人： Masaya Kawano ,  Koji Soejima ,  Nobuaki Takahashi

IPC分类号： H01L23/42 ,  H01L23/52

CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L2224/13 ,  H01L2224/13025 ,  H01L2224/14181

摘要： A falling off of a through electrode is inhibited without decreasing a reliability of a semiconductor device including a through electrode. A semiconductor device 100 includes: a silicon substrate 101; a through electrode 129 extending through the silicon substrate 101; and a first insulating ring 130 provided in a circumference of a side surface of the through electrode 129 and extending through the semiconductor substrate 101. In addition, the semiconductor device 100 also includes a protruding portion 146, being provided at least in the vicinity of a back surface of a device-forming surface of the semiconductor substrate 101 so as to contact with the through electrode 129, and protruding in a direction along the surface of the semiconductor substrate 101 toward an interior of the through electrode 129.

摘要翻译： 在不降低包括通孔的半导体器件的可靠性的情况下，抑制穿通电极的脱落。 半导体器件100包括：硅衬底101; 穿过硅衬底101的通孔电极129; 以及设置在贯通电极129的侧面的周围并延伸穿过半导体基板101的第一绝缘环130.此外，半导体器件100还包括突出部分146，其设置在至少在 半导体衬底101的器件形成表面的背表面与通孔129接触，并沿着半导体衬底101的表面朝向通孔129的内部突出。

公开(公告)号：US20130026910A1

公开(公告)日：2013-01-31

申请号：US13640355

申请日：2011-04-18

申请人： Masaaki Murayama ,  Nobuaki Takahashi ,  Daisuke Numakura

发明人： Masaaki Murayama ,  Nobuaki Takahashi ,  Daisuke Numakura

IPC分类号： H05B33/10 ,  H05B33/14

CPC分类号： H01L51/5246

摘要： A simple manufacturing method for an organic electroluminescent panel in which organic electroluminescent elements are arranged and sealed by a sealing adhesive. The electroluminescent panel has excellent sealing properties and excellent durability as a result of the organic electroluminescent elements being adhered to one another by a heat-curable adhesive. The manufacturing method is for an organic electroluminescent panel in which at least a first electrode, an organic functional layer containing a light-emitting layer, an organic electroluminescent element having a second electrode, and a sealing substrate are bonded together on a substrate by the heat-curable adhesive. The method includes forming a heat-curable adhesive layer on the sealing substrate, subjecting the heat-curable adhesive layer formed on the sealing substrate to pre-heating treatment, bonding the pre-heated heat-curable adhesive layer to the organic electroluminescent element, and subjecting the heat-curable adhesive layer to heat curing, in the given order.

摘要翻译： 一种有机电致发光面板的简单制造方法，其中有机电致发光元件由密封胶布置和密封。 电致发光面板由于有机电致发光元件通过热固性粘合剂彼此粘合而具有优异的密封性和优异的耐久性。 该制造方法用于有机电致发光面板，其中至少第一电极，含有发光层的有机功能层，具有第二电极的有机电致发光元件和密封基板通过热量在基板上接合在一起 可固化粘合剂。 该方法包括在密封基板上形成热固性粘合剂层，对形成在密封基板上的热固性粘合剂层进行预热处理，将预热的可热固化粘合剂层接合到有机电致发光元件，以及 以给定的顺序对热固性粘合剂层进行热固化。

公开(公告)号：US08217516B2

公开(公告)日：2012-07-10

申请号：US12477178

申请日：2009-06-03

申请人： Nobuaki Takahashi ,  Masahiro Komuro ,  Satoshi Matsui

发明人： Nobuaki Takahashi ,  Masahiro Komuro ,  Satoshi Matsui

IPC分类号： H01L23/24

CPC分类号： H01L23/481 ,  H01L21/76898 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05684 ,  H01L2224/13009 ,  H01L2224/131 ,  H01L2224/13562 ,  H01L2224/1357 ,  H01L2224/13644 ,  H01L2224/13664 ,  H01L2224/17181 ,  H01L2924/00014

摘要： In this semiconductor device, the through-hole is formed in the substrate, and is located under the conductive pattern. The insulating layer is located at the bottom surface of the through-hole. The conductive pattern is located on one surface side of the substrate. The opening pattern is formed in the insulating layer which is located between the through-hole and the conductive pattern, where the distance r3 from the circumference of the opening pattern to the central axis of the through-hole is smaller than the distance r1 in the through-hole. By providing the opening pattern, the conductive pattern is exposed at the bottom surface of the through-hole. The bump is located on the back surface side of the substrate, and is formed integrally with the through-electrode.

摘要翻译： 在该半导体装置中，通孔形成在基板上，位于导电图案的下方。 绝缘层位于通孔的底面。 导电图案位于基板的一个表面侧。 开口图案形成在位于通孔和导电图案之间的绝缘层中，其中从开口图案的周边到通孔的中心轴线的距离r3小于通孔中的距离r1 通孔。 通过设置开口图案，导电图案在通孔的底面露出。 凸块位于基板的背面侧，与贯通电极一体形成。

公开(公告)号：US08183685B2

公开(公告)日：2012-05-22

申请号：US12986716

申请日：2011-01-07

申请人： Masaya Kawano ,  Koji Soejima ,  Nobuaki Takahashi

发明人： Masaya Kawano ,  Koji Soejima ,  Nobuaki Takahashi

IPC分类号： H01L23/04 ,  H01L23/48

CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L2224/13 ,  H01L2224/13025 ,  H01L2224/14181

摘要： A falling off of a through electrode is inhibited without decreasing a reliability of a semiconductor device including a through electrode. A semiconductor device 100 includes: a silicon substrate 101; a through electrode 129 extending through the silicon substrate 101; and a first insulating ring 130 provided in a circumference of a side surface of the through electrode 129 and extending through the semiconductor substrate 101. In addition, the semiconductor device 100 also includes a protruding portion 146, being provided at least in the vicinity of a back surface of a device-forming surface of the semiconductor substrate 101 so as to contact with the through electrode 129, and protruding in a direction along the surface of the semiconductor substrate 101 toward an interior of the through electrode 129.

摘要翻译： 在不降低包括通孔的半导体器件的可靠性的情况下，抑制穿通电极的脱落。 半导体器件100包括：硅衬底101; 穿过硅衬底101的通孔电极129; 以及设置在贯通电极129的侧面的周围并延伸穿过半导体基板101的第一绝缘环130.此外，半导体器件100还包括突出部分146，其设置在至少在 半导体衬底101的器件形成表面的背表面与通孔129接触，并沿着半导体衬底101的表面朝向通孔129的内部突出。

公开(公告)号：US20120092431A1

公开(公告)日：2012-04-19

申请号：US13252339

申请日：2011-10-04

申请人： Kazuhiro Hara ,  Satoshi Kaiho ,  Yasushi Kuribayashi ,  Nobuaki Takahashi

发明人： Kazuhiro Hara ,  Satoshi Kaiho ,  Yasushi Kuribayashi ,  Nobuaki Takahashi

IPC分类号： B41J2/01 ,  B65H3/18 ,  B65H3/06

CPC分类号： B41J13/223 ,  B65H5/004 ,  B65H5/062 ,  B65H5/38 ,  B65H9/006 ,  B65H2404/6111 ,  B65H2801/15

摘要： According to one embodiment, an apparatus includes a leading end gripper and a trailing end gripper provided on a drum. The leading end gripper is moved by a leading end gripper driving mechanism. The trailing end gripper switches between a standby position where this gripper is stopped relatively to the rotating drum and a grip position where this gripper rotates with the drum. The leading end gripper and a recording medium pass through an inside of the trailing end gripper stopped in the standby position. If a trailing end of the recording medium reaches the trailing end gripper, the trailing end gripper is released and switches to the grip position. Thus, the trailing end of the medium is held on the drum by the trailing end gripper. The trailing end gripper moves in a rotating direction of the drum while continuing nipping the trailing end of the medium.

摘要翻译： 根据一个实施例，一种装置包括设置在鼓上的前端夹持器和后端夹持器。 前端夹具由前端夹持器驱动机构移动。 尾端夹持器在该夹持器相对于旋转滚筒停止的待机位置与该夹持器与滚筒一起旋转的夹持位置之间切换。 前端夹具和通过后端夹持器的内部的记录介质停止在待机位置。 如果记录介质的尾端到达尾端夹具，则后端夹具被释放并切换到夹持位置。 因此，介质的后端由尾端夹持器保持在滚筒上。 尾端夹持器沿鼓的旋转方向移动，同时继续夹持介质的后端。

公开(公告)号：US20110310169A1

公开(公告)日：2011-12-22

申请号：US13159633

申请日：2011-06-14

申请人： Nobuaki Takahashi ,  Satoshi Kaiho ,  Hiroshi Murata ,  Takashi Hatakeyama

发明人： Nobuaki Takahashi ,  Satoshi Kaiho ,  Hiroshi Murata ,  Takashi Hatakeyama

IPC分类号： B41J2/165

CPC分类号： B41J2/16508

摘要： According to one embodiment, a maintenance unit includes an inkjet head and a cap. The inkjet head includes plural nozzle arrays and discharges a different color of ink from each of the plural nozzle arrays. The cap includes plural protrusions at positions facing the plural nozzle arrays, includes a groove between the plural protrusions, and tightly closes the plural nozzle arrays with the plural protrusions.

摘要翻译： 根据一个实施例，维护单元包括喷墨头和盖。 喷墨头包括多个喷嘴阵列，并且从多个喷嘴阵列中的每一个喷出不同颜色的墨水。 所述盖在与所述多个喷嘴列对置的位置上具有多个突起，在所述多个突起之间包括槽，并且，以多个突起紧密地封闭所述多个喷嘴列。

公开(公告)号：US20110290137A1

公开(公告)日：2011-12-01

申请号：US13118905

申请日：2011-05-31

申请人： Takashi Hatakeyama ,  Satoshi Kaiho ,  Nobuaki Takahashi

发明人： Takashi Hatakeyama ,  Satoshi Kaiho ,  Nobuaki Takahashi

IPC分类号： B41F33/00 ,  B65H85/00

CPC分类号： B41J13/103 ,  B41J3/60 ,  B65H5/36 ,  B65H7/00 ,  B65H85/00 ,  B65H2403/514 ,  B65H2511/216 ,  B65H2511/31 ,  B65H2511/414 ,  B65H2220/01 ,  B65H2220/02

摘要： According to one embodiment, an image recording apparatus includes a printing unit and an entry angle changing mechanism. The entry angle changing mechanism is disposed further along the upstream than the printing unit in a conveying direction and changes the entry angle of the paper with an upper surface not printed and a lower surface printed, after printing on the first surface if printing on both sides is performed by the printing unit.

摘要翻译： 根据一个实施例，图像记录装置包括打印单元和入口角度改变机构。 入口角度改变机构在输送方向上沿着印刷单元的上游进一步配置，并且在打印在第一表面上时在两面打印时改变纸张的入口角度，其中打印在第一表面上的未打印的上表面和下表面 由打印单元执行。

公开(公告)号：US08006363B2

公开(公告)日：2011-08-30

申请号：US11793379

申请日：2005-12-13

申请人： Nobuaki Takahashi ,  Osamu Shibazaki

发明人： Nobuaki Takahashi ,  Osamu Shibazaki

IPC分类号： B23P17/00

CPC分类号： G02B5/32 ,  G02B27/0037 ,  G02B27/0172 ,  G02B27/1093 ,  G02B27/4205 ,  G02B2027/0109 ,  G02B2027/011 ,  G02B2027/0174 ,  G03H1/0236 ,  G03H1/04 ,  G03H2001/043 ,  G03H2270/55 ,  Y10T29/4981 ,  Y10T29/49812 ,  Y10T83/0333 ,  Y10T83/0341 ,  Y10T156/1082

摘要： A method for manufacturing a hologram optical substrate having a hologram element includes: a cutting process that employs a laminate sheet having a pair of protective sheets with a hologram photosensitive sheet peelably interposed therebetween, and makes a cut to a depth for cutting the hologram photosensitive sheet, the cut corresponding to a hologram element forming section; a first peeling process that peels the protective sheet having the cut; a sticking process that sticks a hologram photosensitive material of the hologram element forming section to an inclined surface of the optical substrate, with the hologram photosensitive material adhered to the other protective sheet; a second peeling process that peels the other protective sheet; an exposure process that exposes the hologram photosensitive material to a laser beam after the second peeling process; and a developing process that develops the exposed hologram photosensitive material so as to form a hologram element.

摘要翻译： 一种具有全息元件的全息光学基板的制造方法，其特征在于，包括：切割工序，其使用具有一对保护片的层合片，所述保护片具有可剥离地插入其间的全息感光片，并切割成用于切割全息感光片的深度 ，对应于全息元件形成部分的切口; 剥离具有切割的保护片的第一剥离处理; 将全息元件形成部的全息图感光材料粘附到光学基板的倾斜面的粘贴工序，全息感光材料粘贴到另一保护片上; 剥离另一个保护片的第二剥离处理; 在第二剥离处理之后将全息感光材料曝光于激光束的曝光处理; 以及显影过程，其显影曝光的全息图感光材料以形成全息元件。