公开(公告)号：US07619893B1

公开(公告)日：2009-11-17

申请号：US11707625

申请日：2007-02-16

申请人： Enchao Yu

发明人： Enchao Yu

IPC分类号： H05K7/20 ,  F28F7/00 ,  H01L23/26 ,  H01L23/34

CPC分类号： H01L23/3672 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat spreader is provided for use with an electronic module. The electronic module has a first side with a first plurality of electronic components mounted thereon and a second side with a second plurality of electronic components mounted thereon. The heat spreader includes a first segment mountable on the module to be in thermal communication with at least one electronic component mounted on the first side, and to be substantially thermally isolated from at least one electronic component mounted on the first side. The heat spreader further includes a second segment mountable on the module to be in thermal communication with the at least one electronic component mounted on the first side that is substantially thermally isolated from the first segment.

摘要翻译： 散热器提供用于电子模块。 电子模块具有安装在其上的第一多个电子部件的第一侧和安装在其上的第二多个电子部件的第二侧。 散热器包括可安装在模块上以与安装在第一侧上的至少一个电子部件热连通并且与安装在第一侧上的至少一个电子部件基本上热隔离的第一部分。 散热器还包括可安装在模块上以与安装在第一侧上的至少一个电子元件热连通的第二段，其基本上与第一段热隔离。

公开(公告)号：US07539019B2

公开(公告)日：2009-05-26

申请号：US11831583

申请日：2007-07-31

申请人： Michael J. Wayman ,  Michael J. Nelson

发明人： Michael J. Wayman ,  Michael J. Nelson

IPC分类号： H05K7/20 ,  F28F7/00 ,  H01L23/26

CPC分类号： H01L23/4006 ,  H01L23/3677 ,  H01L2023/4056 ,  H01L2924/0002 ,  H01L2924/00

摘要： An apparatus for transferring heat from a heat spreader is provided. The apparatus includes a heat dissipating member and a heat spreading member adjacent the heat dissipating member, the heat spreading member configured to spread heat laterally across the heat dissipating member, the heat spreading member defining a heat conduction plane. The apparatus also includes a base adjacent to the heat spreading member, wherein the heat spreading member is between the base and the heat dissipating member, and at least one thermal via within the heat conduction plane, the thermal via thermally coupled to the heat spreading member, the at least one thermal via thermally coupled to the heat dissipating member and the base through surface-to-surface contact.

摘要翻译： 提供了一种用于从散热器传热的装置。 该装置包括散热构件和与散热构件相邻的散热构件，散热构件构造成横向散热散热构件，散热构件限定热传导面。 该设备还包括与散热构件相邻的基座，其中散热构件位于基座和散热构件之间，以及在热传导平面内的至少一个热通孔，热通孔热耦合到散热构件 ，所述至少一个热通孔通过表面与表面接触热耦合到所述散热构件和所述基座。

公开(公告)号：US07256493B2

公开(公告)日：2007-08-14

申请号：US11143123

申请日：2005-06-02

申请人： Georg Meyer-Berg

发明人： Georg Meyer-Berg

IPC分类号： H01L23/26

CPC分类号： H01L23/3675 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A ball grid array housing, a semiconductor device having a ball grid array housing and an electronic circuit are disclosed. In one embodiment, a ball grid array housing includes a substrate with solder ball connections pointing out from a housing and at least one semiconductor chip. For better heat dissipation from the housing, the ball grid includes a metallic cooling foil, or a metallic cooling plate. A method of making a ball grid array is also disclosed.

摘要翻译： 公开了一种球栅阵列壳体，具有球栅阵列壳体和电子电路的半导体器件。 在一个实施例中，球栅阵列壳体包括具有从壳体和至少一个半导体芯片指出的焊球连接的衬底。 为了从壳体更好地散热，球栅包括金属冷却箔或金属冷却板。 还公开了制造球栅阵列的方法。

公开(公告)号：US20050277220A1

公开(公告)日：2005-12-15

申请号：US10955083

申请日：2004-09-30

申请人： Edward Fisher ,  Lawrence Latham

发明人： Edward Fisher ,  Lawrence Latham

IPC分类号： G02B26/08 ,  H01L21/00 ,  H01L21/44 ,  H01L23/26 ,  H01L23/31

CPC分类号： B81C1/00333 ,  B81B7/0038 ,  G02B26/0833 ,  H01L21/56 ,  H01L23/26 ,  H01L23/31 ,  H01L23/3185 ,  H01L24/48 ,  H01L2224/32014 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A packaged micromechanical device (100) having a blocking material (116) encapsulating debris-generating regions thereof. The blocking material (116) prevents the generation of debris that could interfere with the operation of the micromechanical device (100). Debris-generating regions of the device (100), including debris-creating sidewalls and any debris-harboring cavities, as well as electrical connections (108) linking the device (100) to the package substrate (102) are encapsulated by the blocking material (116). The blocking material (116) avoids contact with any debris-intolerant regions (118) of the device (100). A package lid (122), which is glass in the case of many DMD packages, seals the device (100) in a package cavity (120).

摘要翻译： 一种封装的微机械装置（100），其具有封装其碎屑生成区域的阻挡材料（116）。 阻挡材料（116）防止产生可能干扰微机械装置（100）的操作的碎片。 装置（100）的碎片产生区域（包括产生碎屑的侧壁和任何碎屑密封空腔）以及将装置（100）连接到封装基板（102）的电连接（108）被封闭材料 （116）。 阻挡材料（116）避免与装置（100）的任何不易碎片区域（118）接触。 在许多DMD封装的情况下，玻璃的封装盖（122）将封装空腔（120）中的器件（100）密封。

公开(公告)号：US20050201060A1

公开(公告)日：2005-09-15

申请号：US11019279

申请日：2004-12-23

申请人： Hong-Yuan Huang

发明人： Hong-Yuan Huang

IPC分类号： H01L23/26 ,  H05K7/20

CPC分类号： H01L23/427 ,  H01L23/433 ,  H01L23/49833 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4826 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00

摘要： A heat sink with a built-in heat pipe for semiconductor package is disclosed. At least a built-in heat pipe is disposed in a cavity of a metal vessel and sealed by a metal cover. The built-in heat pipe has an evaporating portion, a condensing portion, and a bent portion between the evaporating portion and the condensing portion. Thermal interface materials are applied in the cavity such that the evaporating portion is thermally coupled to the metal vessel, and the condensing portion is thermally coupled to the metal cover. The metal vessel has a flat surface opposing to the cavity for attaching to a heating surface of a semiconductor package.

摘要翻译： 公开了一种具有用于半导体封装的内置热管的散热器。 至少内置的热管设置在金属容器的空腔中并用金属盖密封。 内置热管具有蒸发部分，冷凝部分和蒸发部分与冷凝部分之间的弯曲部分。 将热界面材料施加在空腔中，使得蒸发部分热耦合到金属容器，并且冷凝部分热耦合到金属盖。 金属容器具有与空腔相对的平坦表面，用于附接到半导体封装的加热表面。

公开(公告)号：US20050124142A1

公开(公告)日：2005-06-09

申请号：US10946583

申请日：2004-09-20

申请人： Robert Bower

发明人： Robert Bower

IPC分类号： H01L21/265 ,  H01L21/762 ,  H01L23/26 ,  H01L21/322

CPC分类号： H01L21/26513 ,  H01L21/26506 ,  H01L21/76254 ,  H01L23/26 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method for the transposed splitting of ion cut materials. Getters are formed and selectively introduced into a solid material. In addition, atoms are introduced into the solid material at a location that is offset spatially from the locating of the getters. The atoms introduced into the solid material are then transported to the location of the getters where they will then condense in the region of the getters. As a result, then any expunged layer that is formed by ion splitting as result of the atoms being introduced into the solid material will follow the contour of the location of the getters, and will thus be transposed from the initial location of the atoms introduced into the solid material.

摘要翻译： 一种离子切割材料的转置分离方法。 吸气剂被形成并选择性地引入固体材料中。 此外，在与吸气剂的定位在空间上偏移的位置处将原子引入固体材料中。 引入固体材料的原子然后被运送到吸气剂的位置，然后它们将在吸气剂的区域中冷凝。 因此，由原子被引入固体材料的离子分裂形成的任何被破坏的层将遵循吸气剂位置的轮廓，并且因此将从引入的原子的初始位置转置 固体材料。

公开(公告)号：US20050085053A1

公开(公告)日：2005-04-21

申请号：US10689821

申请日：2003-10-20

申请人： Chien-Hua Chen ,  James McKinnell ,  John Liebeskind

发明人： Chien-Hua Chen ,  James McKinnell ,  John Liebeskind

IPC分类号： H01L23/26 ,  H01L21/322

CPC分类号： H01L23/26 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00

摘要： A method of activating a getter structure, including illuminating a photomask having a transmissive region substantially aligned with the getter structure, transmitting a portion of the photons through, the transmissive region. In addition the method includes absorbing the photons, transmitted through the transmissive region, in the getter structure and heating the getter structure with the absorbed photons.

摘要翻译： 一种激活吸气剂结构的方法，包括照射具有与吸气剂结构基本上对准的透射区域的光掩模，透射部分光子穿过透射区域。 此外，该方法包括吸收通过透射区域传输的光子，在吸气剂结构中并用吸收的光子加热吸气剂结构。

公开(公告)号：US06879147B2

公开(公告)日：2005-04-12

申请号：US10674829

申请日：2003-09-30

申请人： Vincent C. Lopes ,  Jwei Wien Liu

发明人： Vincent C. Lopes ,  Jwei Wien Liu

IPC分类号： B81B7/00 ,  H01L23/26 ,  G01R31/302

CPC分类号： H01L23/26 ,  B81B3/0005 ,  B81B7/0038 ,  H01L2924/0002 ,  H01L2924/00

摘要： A drop-in environmental control material carrier assembly 55, which improves the performance and lowers the cost of semiconductor packages. The disclosed approach positions the environmental control materials inside the package cavity by means of a drop-in environmental control material carrier assembly 54, which can hold up to eight materials. In the case of a packaged micromirror, the getters consist of at least three types; i.e., (1) one for absorbing moisture inside the package, (2) one for absorbing adhesive outgassing constituents inside the package, and (3) one for storing the PFDA lubricant used to prevent the micromirror mirrors from sticking. The performance and lifetime of the micromirror devices are improved and the cost of projection display systems, in which these micromirrors are central components, is lowered. The preceding abstract is submitted with the understanding that it only will be used to assist in determining, from a cursory inspection, the nature and gist of the technical disclosure as described in 37 C.F.R. § 1.72(b). In no case should this abstract be used for interpreting the scope of any patent claims.

摘要翻译： 一种落入式环境控制材料载体组件55，其改进了性能并降低了半导体封装的成本。 所公开的方法通过能够容纳多达八种材料的落入式环境控制材料载体组件54将环境控制材料定位在包装腔内。 在包装微镜的情况下，吸气剂由至少三种类型组成; 即（1）用于吸收包装内的水分的装置，（2）用于吸收包装内的粘合剂除气成分的装置，和（3）用于储存用于防止微反射镜粘附的PFDA润滑剂的装置。 提高了微镜器件的性能和寿命，降低了这些微镜是中心部件的投影显示系统的成本。 提交上述摘要的理解是，它只会用于协助从粗略检查中确定37 C.F.R.描述的技术披露的性质和要点。 §1.72（b）。 在任何情况下，本摘要不得用于解释任何专利权利要求的范围。

公开(公告)号：US5679590A

公开(公告)日：1997-10-21

申请号：US623882

申请日：1996-03-29

申请人： Seiichi Mori ,  Masaki Sato ,  Kuniyoshi Yoshikawa

发明人： Seiichi Mori ,  Masaki Sato ,  Kuniyoshi Yoshikawa

IPC分类号： H01L21/768 ,  H01L23/26 ,  H01L23/29 ,  H01L23/31 ,  H01L23/532 ,  H01L21/8247

CPC分类号： H01L21/76801 ,  H01L21/76804 ,  H01L21/76814 ,  H01L21/76831 ,  H01L23/26 ,  H01L23/291 ,  H01L23/3157 ,  H01L23/3192 ,  H01L23/5329 ,  H01L23/53295 ,  H01L2924/0002

摘要： An SiO.sub.2 film and a PSG film are stacked on a semiconductor substrate. A contact hole is formed through the both films. An Si.sub.3 N.sub.4 film is formed on a side wall of the contact hole as a free ion Na.sup.+ blocking film. An aluminum wiring layer is formed in the contact hole. This arrangement prevents free ions Na.sup.+ from externally migrating through the SiO.sub.2 film and reaching a nonvolatile semiconductor memory cell during and after the formation of the contact hole.

摘要翻译： SiO 2膜和PSG膜堆叠在半导体衬底上。 通过两个膜形成接触孔。 在接触孔的侧壁上形成Si 3 N 4膜作为游离离子Na +阻挡膜。 在接触孔中形成铝布线层。 这种布置防止游离离子Na +在形成接触孔期间和之后从外部迁移通过SiO 2膜并到达非易失性半导体存储单元。

公开(公告)号：US5195299A

公开(公告)日：1993-03-23

申请号：US843735

申请日：1992-02-28

申请人： My N. Nguyen

发明人： My N. Nguyen

IPC分类号： H01L23/26

CPC分类号： H01L23/26 ,  H01L2924/0002 ,  H01L2924/09701

摘要： Described is a method of reducing the moisture content in a hermetic package containing a semiconductor device by including a small amount of cyanate ester within the package.

摘要翻译： 描述了通过在包装中包含少量的氰酸酯来降低包含半导体器件的密封包装中的含水量的方法。