MRAM cell with flat topography and controlled bit line to free layer distance and method of manufacture
    131.
    发明授权
    MRAM cell with flat topography and controlled bit line to free layer distance and method of manufacture 有权
    具有平坦地形和受控位线的自由层距离和制造方法的MRAM单元

    公开(公告)号:US07335960B2

    公开(公告)日:2008-02-26

    申请号:US11179252

    申请日:2005-07-12

    CPC classification number: H01L27/222 H01L43/12

    Abstract: A method for forming MRAM cell structures wherein the topography of the cell is substantially flat and the distance between a bit line and a magnetic free layer, a word line and a magnetic free layer or a word line and a bit line and a magnetic free layer is precise and well controlled. The method includes the formation of an MTJ film stack over which is formed both a capping and sacrificial layer. The stack is patterned by conventional means, then is covered by a layer of insulation which is thinned by CMP to expose a remaining portion of the sacrificial layer. The remaining portion of the sacrificial layer can be precisely removed by an etching process, leaving only the well dimensioned capping layer to separate the bit line from the magnetic free layer and the capping layer. The bit line and an intervening layer of insulation separate the free layer from a word line in an equally precise and controlled manner.

    Abstract translation: 一种用于形成MRAM单元结构的方法,其中单元的形貌基本上是平坦的,并且位线和无磁性层,字线和无磁性层或字线以及位线和无磁层之间的距离 是精确和良好的控制。 该方法包括形成MTJ膜堆叠,在其上形成封盖层和牺牲层。 堆叠通过常规方式图案化,然后被由CMP稀疏以暴露牺牲层的剩余部分的绝缘层覆盖。 可以通过蚀刻工艺精确地去除牺牲层的剩余部分,仅留下孔尺寸的覆盖层以将位线与无磁性层和封盖层分离。 位线和绝缘层的绝缘层以同样精确和受控的方式将自由层与字线分开。

    Method to improve heat dissipation in a magnetic shield
    132.
    发明授权
    Method to improve heat dissipation in a magnetic shield 有权
    改善磁屏蔽散热的方法

    公开(公告)号:US07320168B2

    公开(公告)日:2008-01-22

    申请号:US10696431

    申请日:2003-10-29

    Abstract: Problems such as thermal pole tip protrusion result from thermal mismatch between the alumina and pole material during the writing process. This, and similar problems due to inadequate heat dissipation, have been overcome by dividing the bottom shield into two pieces both of which sit on top of a non-magnetic heat sink. Heat generated by the coil during writing is transferred to the non-magnetic heat sink whence it gets transferred to the substrate. With this approach, the head not only benefits from less field disturbance due to the small shield but also improves heat dissipation from the additional heat sink.

    Abstract translation: 在写入过程中,由于氧化铝和极材料之间的热失配,导致热极尖突出的问题。 通过将底部屏蔽分成两个位于非磁性散热器顶部的两个部件,已经克服了由于不充分散热引起的这种和类似的问题。 在写入期间由线圈产生的热量被传递到非磁性散热器,因为它被传送到基板。 采用这种方法,由于小屏蔽,头部不但受益于较少的场干扰,还可以改善附加散热器的散热。

    Planarizing process
    133.
    发明授权
    Planarizing process 有权
    平面化过程

    公开(公告)号:US07047625B2

    公开(公告)日:2006-05-23

    申请号:US10647762

    申请日:2003-08-25

    Abstract: Present processes used for planarizing a cavity filled with a coil and hard baked photoresist require that a significant amount of the thickness of the coils be removed. This increases the DC resistance of the coil. In the present invention, cavity and coil are overfilled with photoresist which is then hard baked. A layer of alumina is then deposited onto the surface of the excess photoresist, following which CMP is initiated. The presence of the alumina serves to stabilize the photoresist so that it does not delaminate. CMP is terminated as soon as the coils are exposed, allowing their full thickness to be retained and resulting in minimum DC resistance.

    Abstract translation: 用于平坦化填充有线圈和硬烘烤光致抗蚀剂的空腔的现有方法需要去除大量的线圈厚度。 这增加了线圈的直流电阻。 在本发明中,腔和线圈被光致抗蚀剂过度填充,然后被硬烘烤。 然后将一层氧化铝沉积到多余光致抗蚀剂的表面上,随后开始CMP。 氧化铝的存在用于使光致抗蚀剂稳定,使其不分层。 一旦线圈被暴露,CMP就被终止,允许其保持其全部厚度并导致最小的直流电阻。

    CD uniformity in high track density recording head
    136.
    发明申请
    CD uniformity in high track density recording head 失效
    高跟踪密度记录头的CD均匀性

    公开(公告)号:US20060007602A1

    公开(公告)日:2006-01-12

    申请号:US10886888

    申请日:2004-07-08

    Abstract: For high track density recording, tighter reader and writer track width control are essential. This has been achieved by using the write gap layer as the plating seed on which the upper pole is electro-formed. This allows the write gap layer to be deposited through a precisely controllable process such as sputtering. Since less material needs to be removed during pole trimming, a thinner layer of photoresist may be used. This, in turn, makes possible a lower CD for the structure.

    Abstract translation: 对于高轨道密度记录,更紧密的读写器轨道宽度控制是至关重要的。 这是通过使用写间隙层作为上电极电镀的电镀种子来实现的。 这允许通过诸如溅射的精确控制的工艺来沉积写间隙层。 由于在极修整期间需要去除更少的材料,所以可以使用更薄的光致抗蚀剂层。 这反过来,使得结构的CD更低。

    MRAM cell with flat topography and controlled bit line to free layer distance and method of manufacture

    公开(公告)号:US06969895B2

    公开(公告)日:2005-11-29

    申请号:US10732013

    申请日:2003-12-10

    CPC classification number: H01L27/222 H01L43/12

    Abstract: A method for forming MRAM cell structures wherein the topography of the cell is substantially flat and the distance between a bit line and a magnetic free layer, a word line and a magnetic free layer or a word line and a bit line and a magnetic free layer is precise and well controlled. The method includes the formation of an MTJ film stack over which is formed both a capping and sacrificial layer. The stack is patterned by conventional means, then is covered by a layer of insulation which is thinned by CMP to expose a remaining portion of the sacrificial layer. The remaining portion of the sacrificial layer can be precisely removed by an etching process, leaving only the well dimensioned capping layer to separate the bit line from the magnetic free layer and the capping layer. The bit line and an intervening layer of insulation separate the free layer from a word line in an equally precise and controlled manner.

    MRAM cell with flat topography and controlled bit line to free layer distance and method of manufacture
    139.
    发明申请
    MRAM cell with flat topography and controlled bit line to free layer distance and method of manufacture 有权
    具有平坦地形和受控位线的自由层距离和制造方法的MRAM单元

    公开(公告)号:US20050248980A1

    公开(公告)日:2005-11-10

    申请号:US11179252

    申请日:2005-07-12

    CPC classification number: H01L27/222 H01L43/12

    Abstract: A method for forming MRAM cell structures wherein the topography of the cell is substantially flat and the distance between a bit line and a magnetic free layer, a word line and a magnetic free layer or a word line and a bit line and a magnetic free layer is precise and well controlled. The method includes the formation of an MTJ film stack over which is formed both a capping and sacrificial layer. The stack is patterned by conventional means, then is covered by a layer of insulation which is thinned by CMP to expose a remaining portion of the sacrificial layer. The remaining portion of the sacrificial layer can be precisely removed by an etching process, leaving only the well dimensioned capping layer to separate the bit line from the magnetic free layer and the capping layer. The bit line and an intervening layer of insulation separate the free layer from a word line in an equally precise and controlled manner.

    Abstract translation: 一种用于形成MRAM单元结构的方法,其中单元的形貌基本上是平坦的,并且位线和无磁性层,字线和无磁性层或字线以及位线和无磁层之间的距离 是精确和良好的控制。 该方法包括形成MTJ膜堆叠,在其上形成封盖层和牺牲层。 堆叠通过常规方式图案化,然后被由CMP稀疏以暴露牺牲层的剩余部分的绝缘层覆盖。 可以通过蚀刻工艺精确地去除牺牲层的剩余部分,仅留下孔尺寸的覆盖层以将位线与无磁性层和封盖层分离。 位线和绝缘层的绝缘层以同样精确和受控的方式将自由层与字线分开。

    Method to make a wider trailing pole structure by self-aligned pole trim process
    140.
    发明授权
    Method to make a wider trailing pole structure by self-aligned pole trim process 失效
    通过自对准极修剪工艺制作更宽的尾柱结构的方法

    公开(公告)号:US06960281B2

    公开(公告)日:2005-11-01

    申请号:US10394098

    申请日:2003-03-21

    CPC classification number: G11B5/3163 G11B5/3116 G11B5/3967 Y10T29/49032

    Abstract: A method for forming a trimmed upper pole piece for a magnetic write head, said pole piece having a tapered profile that is widest at its trailing edge. Such a pole piece is capable of writing narrow tracks with sharply and well defined patterns and minimal overwriting of adjacent tracks. The present method produces the necessary taper by using NiCr, NiFeCr, Rh or Ru as write gap filling materials which have an etch rate which is substantially equal to the etch rate of the other layers forming the pole piece and are highly corrosion resistant. As a result, the write gap does not protrude to mask the effects of the ion-beam etch used to form the taper.

    Abstract translation: 一种用于形成用于磁性写入头的修整的上极片的方法,所述极片具有在其后缘处最宽的锥形轮廓。 这样的极片能够以清晰明确的图案和相邻轨迹的最小重写来写入窄轨道。 本方法通过使用NiCr,NiFeCr,Rh或Ru作为写入间隙填充材料产生必要的锥度,其具有基本上等于形成极片的其它层的蚀刻速率的蚀刻速率,并且具有高耐腐蚀性。 结果,写入间隙不突出以掩盖用于形成锥形的离子束蚀刻的效果。

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