公开(公告)号：US20110227123A1

公开(公告)日：2011-09-22

申请号：US13115084

申请日：2011-05-24

Applicant: Do Hyung KIM ,  Chung-Hoon LEE

Inventor： Do Hyung KIM ,  Chung-Hoon LEE

IPC: H01L33/62

CPC classification number: H01L33/505 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2924/00011 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01049 ,  H01L2924/01005

Abstract: The present invention relates to a light emitting diode and a method of fabricating the same, wherein the distance between a fluorescent substance and a light emitting diode chip is uniformly maintained to enhance luminous efficiency. To this end, there is provided a light emitting diode comprising at least one light emitting diode chip, lead terminals for use in applying electric power to the light emitting diode chip, and a frame that is used for mounting the light emitting diode chip thereon and is formed to have a predetermined height and a shape corresponding to that of the light emitting diode chip.

Abstract translation: 发光二极管及其制造方法技术领域本发明涉及一种发光二极管及其制造方法，其中均匀地维持荧光物质与发光二极管芯片之间的距离，以提高发光效率。 为此，提供了一种发光二极管，其包括至少一个发光二极管芯片，用于向发光二极管芯片施加电力的引线端子，以及用于将发光二极管芯片安装在其上的框架， 形成为具有与发光二极管芯片相对应的预定高度和形状。

公开(公告)号：US08003036B2

公开(公告)日：2011-08-23

申请号：US12881657

申请日：2010-09-14

Applicant: Jung-Hwa Jung ,  Chung Hoon Lee

Inventor： Jung-Hwa Jung ,  Chung Hoon Lee

IPC: B29C70/72

CPC classification number: H01L21/565 ,  B29C33/10 ,  B29C39/006 ,  B29C39/10 ,  B29C39/26 ,  B29C45/14655 ,  B29C45/34 ,  B29L2011/00 ,  H01L23/49861 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49107 ,  H01L2924/00014

Abstract: There are provided a mold for forming a molding member and a method for forming a molding member using the same. The mold includes an upper surface, and a lower surface having an outer peripheral surface and a concave surface surrounded by the outer circumference. Injection and discharge holes extend from the upper surface to the lower surface. Accordingly, after the mold and the package are coupled so that the discharge hole is directed upward, a molding member can be formed on the package by injecting the molding material through the injection hole, whereby it is possible to prevent air bubbles from being captured in the molding member.

Abstract translation: 提供了用于形成模制构件的模具和使用其形成模制构件的方法。 模具包括上表面和具有外周表面和由外周围包围的凹面的下表面。 注射和排出孔从上表面延伸到下表面。 因此，在模具和包装件联接成使得排出孔向上指向之后，可以通过从注射孔注入成型材料而在包装上形成成型构件，由此可以防止气泡被捕获 模制构件。

公开(公告)号：US20110114969A1

公开(公告)日：2011-05-19

申请号：US12917937

申请日：2010-11-02

Applicant: Chung Hoon LEE ,  Sum Geun LEE ,  Sang Ki JIN ,  Jin Cheol SHIN ,  Jong Kyu KIM ,  So Ra LEE

Inventor： Chung Hoon LEE ,  Sum Geun LEE ,  Sang Ki JIN ,  Jin Cheol SHIN ,  Jong Kyu KIM ,  So Ra LEE

IPC: H01L33/46 ,  H01L33/08

CPC classification number: H01L33/46 ,  H01L33/0079 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

Abstract: An exemplary embodiment of the present invention discloses a light emitting diode chip including a substrate, a light emitting structure arranged on the substrate, the light emitting structure including an active layer arranged between a first conductive-type semiconductor layer and a second conductive-type semiconductor layer, and a distributed Bragg reflector to reflect light emitted from the light emitting structure. The distributed Bragg reflector has a reflectivity of at least 90% for light of a first wavelength in a blue wavelength range, light of a second wavelength in a green wavelength range, and light of a third wavelength in a red wavelength range.

Abstract translation: 本发明的一个示例性实施例公开了一种发光二极管芯片，其包括基板，布置在基板上的发光结构，发光结构包括布置在第一导电型半导体层和第二导电型半导体之间的有源层 层和分布布拉格反射器以反射从发光结构发射的光。 分布布拉格反射器对于蓝色波长范围内的第一波长的光，绿色波长范围内的第二波长的光和红色波长范围内的第三波长的光具有至少90％的反射率。

公开(公告)号：US07901113B2

公开(公告)日：2011-03-08

申请号：US12730856

申请日：2010-03-24

Applicant: Do-Hyung Kim ,  Chung-Hoon Lee ,  Keon-Young Lee ,  Kwang-Il Park

Inventor： Do-Hyung Kim ,  Chung-Hoon Lee ,  Keon-Young Lee ,  Kwang-Il Park

IPC: F21V5/00

CPC classification number: G02B19/0071 ,  G02B19/0028 ,  G02B19/0061 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/19107 ,  H01L2924/00014

Abstract: The present invention relates to a side illumination lens and a luminescent device using the same, and provides a body, a total reflection surface with a total reflection slope with respect to a central axis of the body, and a linear and/or curved refractive surface(s) formed to extend from a periphery of the total reflection surface; and a luminescent device including the lens. According to the present invention, a lens with total internal reflection surfaces with different slopes, and a linear and/or curved refractive surface(s) allows light emitted forward from a luminescent chip to be guided to a side of the lens. Further, a linear surface(s) formed in a direction perpendicular or parallel to a central axis of a lens and a curved surface are formed on an edge of the lens so that a process of fabricating the lens is facilitated, thereby reducing a defective rate and fabrication costs of the lens.

Abstract translation: 本发明涉及一种侧面照明透镜及其使用该发光装置的发光装置，其特征在于，具有相对于所述主体的中心轴线具有全反射斜率的全身反射面以及直线和/或弯曲的折射面 形成为从全反射表面的周边延伸; 以及包括该透镜的发光装置。 根据本发明，具有具有不同斜率的全内反射表面以及线性和/或弯曲折射表面的透镜允许从发光芯片向前发射的光被引导到透镜的一侧。 此外，在透镜的边缘上形成在垂直于或平行于透镜的中心轴线的方向上形成的线性表面，从而便于制造透镜的工艺，从而降低了缺陷率 和镜头的制造成本。

公开(公告)号：US07838891B2

公开(公告)日：2010-11-23

申请号：US12766656

申请日：2010-04-23

Applicant: Chung Hoon Lee ,  Lacroix Yves ,  Hyung Soo Yoon ,  Young Ju Lee

Inventor： Chung Hoon Lee ,  Lacroix Yves ,  Hyung Soo Yoon ,  Young Ju Lee

IPC: H01L29/18 ,  H01L23/48 ,  H01L33/00

CPC classification number: H01L27/153 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series. Further, it is possible to provide a light emitting device capable of being directly driven by an AC power source by connecting the serially connected light emitting cell arrays in reverse parallel to each other.

Abstract translation: 公开了一种发光器件，其具有多个发光单元及其上安装有该发光单元的封装。 发光装置包括形成在基板上的多个发光单元，每个发光单元具有位于N型半导体层的一部分上的N型半导体层和P型半导体层。 多个发光单元被接合到副安装座基板。 因此，可以容易地消散从发光单元产生的热量，从而可以减少发光器件上的热负荷。 同时，由于使用形成在副安装座基板上的连接电极或电极层使多个发光单元电连接，所以可以提供串联连接的发光单元阵列。 此外，可以提供一种能够由AC电源直接驱动的发光器件，通过将串联连接的发光单元阵列反向并联连接。

公开(公告)号：US20100219425A1

公开(公告)日：2010-09-02

申请号：US12772015

申请日：2010-04-30

Applicant: Chung Hoon LEE

Inventor： Chung Hoon LEE

IPC: H01L27/15 ,  H01L33/62

CPC classification number: H01L27/153 ,  H01L27/156 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: Disclosed are a light emitting device having a plurality of light emitting cells connected in series and a method of fabricating the same. The light emitting device includes a buffer layer formed on a substrate. A plurality of rod-shaped light emitting cells are located on the buffer layer to be spaced apart from one another. Each of the light emitting cells has an n-layer, an active layer and a p-layer. Meanwhile, wires connect the spaced light emitting cells in series or parallel. Accordingly, arrays of the light emitting cells connected in series are connected to be driven by currents flowing in opposite directions. Thus, there is provided a light emitting device that can be directly driven by an AC power source.

Abstract translation: 公开了具有串联连接的多个发光单元的发光器件及其制造方法。 发光器件包括形成在衬底上的缓冲层。 多个棒状发光单元位于缓冲层上以彼此间隔开。 每个发光单元具有n层，有源层和p层。 同时，电线将间隔开的发光单元串联或并联连接。 因此，串联连接的发光单元的阵列被连接以由相反方向流动的电流驱动。 因此，提供了可以由AC电源直接驱动的发光器件。

公开(公告)号：US20100207132A1

公开(公告)日：2010-08-19

申请号：US12440001

申请日：2008-08-14

Applicant: Chung Hoon Lee ,  Walter Tews ,  Gundula Roth ,  Stefan Tews

Inventor： Chung Hoon Lee ,  Walter Tews ,  Gundula Roth ,  Stefan Tews

IPC: H01L33/44

CPC classification number: H01L33/502 ,  C09K11/7734 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/19107 ,  H05B33/14 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Disclosed is a light emitting device employing non-stoichiometric tetragonal Alkaline Earth Silicate phosphors. The light emitting device comprises a light emitting diode emitting light of ultraviolet or visible light, and non-stoichiometric luminescent material disposed around the light emitting diode. The luminescent material adsorbs at least a portion of the light emitted from the light emitting diode and emits light having a different wavelength from the absorbed light. The non-stoichiometric luminescent material has tetragonal crystal structure, and contains more silicon in the crystal lattice than that in the crystal lattice of silicate phosphors having stoichiometric crystal structure. The luminescent material is represented as the formula (BauSrvCawCux)3−y(Zn,Mg,Mn)zSi1+bO5+2b:Euu. Light emitting devices having improved temperature and humidity stability can be provided by employing the non-stoichiometric tetragonal Alkaline Earth Silicate phosphors.

Abstract translation: 公开了采用非化学计量的四方碱性硅酸盐磷光体的发光器件。 发光装置包括发射紫外线或可见光的发光二极管和设置在发光二极管周围的非化学计量的发光材料。 发光材料吸收从发光二极管发射的光的至少一部分，并发射与吸收光不同的波长的光。 非化学计量的发光材料具有四方晶体结构，并且在晶格中含有比在具有化学计量晶体结构的硅酸盐荧光体的晶格中更多的硅。 发光材料由式（BauSrvCawCux）3-y（Zn，Mg，Mn）zSi1 + bO5 + 2b：Euu表示。 具有改善的温度和湿度稳定性的发光器件可以通过使用非化学计量的四方碱性碱土硅酸盐荧光体来提供。

公开(公告)号：US07763900B2

公开(公告)日：2010-07-27

申请号：US11813812

申请日：2005-07-04

Applicant: Chung Hoon Lee

Inventor： Chung Hoon Lee

IPC: H01L29/18

CPC classification number: H01L27/153 ,  H01L27/156 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: Disclosed are a light emitting device having a plurality of light emitting cells connected in series and a method of fabricating the same. The light emitting device includes a buffer layer formed on a substrate. A plurality of rod-shaped light emitting cells are located on the buffer layer to be spaced apart from one another. Each of the light emitting cells has an n-layer, an active layer and a p-layer. Meanwhile, wires connect the spaced light emitting cells in series or parallel. Accordingly, arrays of the light emitting cells connected in series are connected to be driven by currents flowing in opposite directions. Thus, there is provided a light emitting device that can be directly driven by an AC power source.

Abstract translation: 公开了具有串联连接的多个发光单元的发光器件及其制造方法。 发光器件包括形成在衬底上的缓冲层。 多个棒状发光单元位于缓冲层上以彼此间隔开。 每个发光单元具有n层，有源层和p层。 同时，电线将间隔开的发光单元串联或并联连接。 因此，串联连接的发光单元的阵列被连接以由相反方向流动的电流驱动。 因此，提供了可以由AC电源直接驱动的发光器件。

公开(公告)号：US07723736B2

公开(公告)日：2010-05-25

申请号：US11721803

申请日：2005-10-25

Applicant: Chung Hoon Lee ,  Lacroix Yves ,  Hyung Soo Yoon ,  Young Ju Lee

Inventor： Chung Hoon Lee ,  Lacroix Yves ,  Hyung Soo Yoon ,  Young Ju Lee

IPC: H01L29/18 ,  H01L23/48 ,  H01L33/00

CPC classification number: H01L27/153 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series. Further, it is possible to provide a light emitting device capable of being directly driven by an AC power source by connecting the serially connected light emitting cell arrays in reverse parallel to each other.

公开(公告)号：US07667225B1

公开(公告)日：2010-02-23

申请号：US12541749

申请日：2009-08-14

Applicant: Chung Hoon Lee ,  Dae Won Kim ,  Dae Sung Kal ,  Ki Bum Nam

Inventor： Chung Hoon Lee ,  Dae Won Kim ,  Dae Sung Kal ,  Ki Bum Nam

IPC: H01L33/00

CPC classification number: H01S5/34333 ,  B82Y20/00 ,  H01L33/06 ,  H01L33/32 ,  H01S5/1053 ,  H01S5/341 ,  H01S5/3412

Abstract: A light emitting device can be used for light emitting diodes and laser diodes. The light emitting device includes a substrate, a first semiconductor layer on the substrate, a second semiconductor layer on the first semiconductor layer, and a multi-quantum well structure including at least one well layer and at least one barrier layer between the first and second semiconductor layers. A carrier trap portion is formed in at least one layer within the multi-quantum well structure. The carrier trap portion has a band-gap energy that gradually decreases from a periphery of the carrier trap portion to a center thereof.

Abstract translation: 发光器件可用于发光二极管和激光二极管。 发光器件包括衬底，衬底上的第一半导体层，第一半导体层上的第二半导体层，以及多量子阱结构，其包括至少一个阱层和在第一和第二阱之间的至少一个势垒层 半导体层。 载流子捕获部分形成在多量子阱结构内的至少一层中。 载流子捕获部分具有从载流子捕获部分的周边逐渐减小到其中心的带隙能量。