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    Beamforming Device Testing
    141.
    发明申请
    Beamforming Device Testing 有权

    公开(公告)号：US20210211210A1

    公开(公告)日：2021-07-08

    申请号：US17143850

    申请日：2021-01-07

    Applicant: FormFactor, Inc.

    Inventor： Dennis Rosenauer ,  Roger Hayward ,  Roy Swart

    IPC: H04B17/12 ,  H04B17/16 ,  H04B17/19

    Abstract: Improved electrical testing of N-port beamforming devices is provided. For testing, an N:1 electrical network is connected to the N ports of the device under test to provide a single test port. This mode of testing can be used to determine parameters of interest (e.g., far field radiation patterns etc.) of the device under test more rapidly than with antenna range testing or with characterization of each port of the device under test. The N:1 electrical network can be passive or active. The N:1 electrical network can be integrated in a probe head to provide probe array testing of beamforming devices. Alternatively, the N:1 electrical network can be integrated with the device under test to provide onboard testing capability.

    Shielding for vertical probe heads
    143.
    发明授权
    Shielding for vertical probe heads 有权

    公开(公告)号：US10598697B2

    公开(公告)日：2020-03-24

    申请号：US15868737

    申请日：2018-01-11

    Applicant: FormFactor, Inc.

    Inventor： Benjamin N. Eldridge

    IPC: G01R1/073

    Abstract: Crosstalk between probes in a vertical probe array is reduced by providing a grounded metal carrier disposed between the guide plates of the probe array. The metal carrier includes pockets that are laterally separated from each other by the metal carrier. Probes in different pockets are thereby electrically shielded from each other.

    Probe card assembly for testing electronic devices
    145.
    发明授权
    Probe card assembly for testing electronic devices 有权
    用于测试电子设备的探头卡组件

    公开(公告)号：US09588139B2

    公开(公告)日：2017-03-07

    申请号：US14270235

    申请日：2014-05-05

    Applicant: FormFactor, Inc.

    Inventor： Li Fan ,  Darcy K. Kelly-Greene ,  Edward J. Milovic ,  Gensaku Nagai ,  Mukesh K. Selvaraj ,  Jim Zhang

    IPC: G01R1/067 ,  G01R35/00 ,  G01R1/36 ,  G01R1/073

    CPC classification number: G01R1/06716 ,  G01R1/06727 ,  G01R1/06733 ,  G01R1/07342 ,  G01R1/07371 ,  G01R1/36 ,  G01R35/00

    Abstract: A probe card assembly can comprise a guide plate comprising probe guides for holding probes in predetermined positions. The probe card assembly can also comprise a wiring structure attached to the guide plate so that connection tips of the probes are positioned against and attached to contacts on the wiring structure. The attachment of the guide plate to the wiring structure can allow the wiring structure to expand or contract at a greater rate than the guide plate. The probes can include compliant elements that fail upon high electrical current and thermal stresses located away from the contact tips.

    Abstract translation: 探针卡组件可以包括导板，其包括用于将探针保持在预定位置的探针引导件。 探针卡组件还可以包括附接到引导板的布线结构，使得探针的连接尖端定位成抵靠并附接到布线结构上的触点。 引导板到布线结构的附接可以使布线结构以比引导板更大的速率膨胀或收缩。 探针可以包括顺应元件，其在远离接触尖端的高电流和热应力下失效。

    Vertical probe array arranged to provide space transformation
    148.
    发明授权
    Vertical probe array arranged to provide space transformation 有权

    公开(公告)号：US09274143B2

    公开(公告)日：2016-03-01

    申请号：US13693971

    申请日：2012-12-04

    Applicant: FormFactor, Inc.

    Inventor： January Kister

    IPC: G01R1/073 ,  G01R1/067

    CPC classification number: G01R1/07307 ,  G01R1/06733

    Abstract: Improved probing of closely spaced contact pads is provided by an array of vertical probes having all of the probe tips aligned along a single contact line, while the probe bases are arranged in an array having two or more rows parallel to the contact line. With this arrangement of probes, the probe base thickness can be made greater than the contact pad spacing along the contact line, thereby advantageously increasing the lateral stiffness of the probes. The probe tip thickness is less than the contact pad spacing, so probes suitable for practicing the invention have a wide base section and a narrow tip section.

    Hybrid electrical contactor
    149.
    发明授权
    Hybrid electrical contactor 有权
    混合电气接触器

    公开(公告)号：US09229029B2

    公开(公告)日：2016-01-05

    申请号：US13681896

    申请日：2012-11-20

    Applicant: FormFactor, Inc.

    Inventor： Keith J. Breinlinger

    IPC: G01R31/20 ,  G01R1/067 ,  G01R1/073 ,  G01R31/28

    CPC classification number: G01R1/067 ,  G01R1/07342 ,  G01R1/07378 ,  G01R31/2889

    Abstract: An electrical connection between an electrically conductive probe on one device and a compliant pad on another device can be formed by piercing the compliant pad with the probe. The probe can contact multiple electrically conductive elements inside the pad and thereby electrically connect to the pad at multiple locations inside the pad.

    Abstract translation: 一个器件上的导电探针与另一器件上的柔性焊盘之间的电连接可以通过用探针刺穿柔性焊盘来形成。 探头可以接触焊盘内的多个导电元件，从而在焊盘内的多个位置处电连接到焊盘。

    Multipath Electrical Probe And Probe Assemblies With Signal Paths Through Secondary Paths Between Electrically Conductive Guide Plates
    150.
    发明申请
    Multipath Electrical Probe And Probe Assemblies With Signal Paths Through Secondary Paths Between Electrically Conductive Guide Plates 审中-公开
    多通道电探头和探头组件，其通过导电导板之间的次级路径的信号路径

    公开(公告)号：US20150015289A1

    公开(公告)日：2015-01-15

    申请号：US14327254

    申请日：2014-07-09

    Applicant: FormFactor, Inc.

    Inventor： Benjamin N. Eldridge

    IPC: G01R1/067 ,  G01R1/073

    CPC classification number: G01R1/06733 ,  G01R1/06772 ,  G01R1/07357

    Abstract: A multiple conduction path probe can provide an electrically conductive signal path from a first contact end to a second contact end. The probe can also include an electrically conductive secondary path and an electrically insulated gap between the signal path and the secondary path. The gap can be relatively small and thus provide the probe with a low loop inductance. A probe assembly can comprise multiple such probes disposed in passages in substantially parallel electrically conductive guide plates. The signal path of each of the probes can be electrically insulated from both guide plates, but the secondary path of each probe can be electrically connected to one or both of the guide plates. In some configurations, the probe assembly can include one or more secondary probes disposed in passages of the conductive guide plates and electrically connected to one or both of the guide plates. In some configurations, a probe assembly can comprise probes that are substantially the same shape and/or configuration all of which are disposed in passages through substantially parallel guide plates. Some of the probes can be electrically insulated from the guide plates and thus provide signal paths, and others of the probes can be electrically connected to the guide plates and thus provide secondary paths. Any of the foregoing types of probe assemblies can be part of a test contactor such as a probe card assembly, a load board, or the like.

    Abstract translation: 多导电路径探针可以提供从第一接触端到第二接触端的导电信号路径。 探针还可以包括导电次级路径和信号路径与次路径之间的电绝缘间隙。 间隙可以相对较小，从而为探头提供低回路电感。 探针组件可以包括多个这样的探针，其布置在基本上平行的导电导板中的通道中。 每个探针的信号路径可以与两个导向板电绝缘，但是每个探针的次级路径可以电连接到一个或两个导向板。 在一些构造中，探针组件可以包括设置在导电导板的通道中并电连接到一个或两个导板的一个或多个辅助探针。 在一些构造中，探针组件可以包括基本上相同的形状和/或构造的探针，所有探针组件都设置在通过基本平行的引导板的通路中。 一些探针可以与引导板电绝缘，从而提供信号路径，并且其它探针可以电连接到引导板，从而提供辅助路径。 任何上述类型的探针组件可以是测试接触器的一部分，例如探针卡组件，负载板等。

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