公开(公告)号：US20090152708A1

公开(公告)日：2009-06-18

申请号：US12049661

申请日：2008-03-17

Applicant: Woong Sun LEE ,  Qwan Ho CHUNG ,  Il Hwan CHO ,  Sang Joon LIM ,  Jong Woo YOO ,  Jin Ho BAE ,  Seung Hyun LEE

Inventor： Woong Sun LEE ,  Qwan Ho CHUNG ,  Il Hwan CHO ,  Sang Joon LIM ,  Jong Woo YOO ,  Jin Ho BAE ,  Seung Hyun LEE

IPC: H01L23/498

CPC classification number: H01L23/5384 ,  H01L23/5386 ,  H01L24/29 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83007 ,  H01L2224/83138 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The substrate for a semiconductor package includes a substrate body having a first surface and a second surface opposite to the first surface. Connection pads are formed near an edge of the first surface. Signal lines having conductive vias and first, second, and third line parts are formed. The first line parts are formed on the first surface and are connected to the connection pads and the conductive vias, which pass through the substrate body. The second line parts are formed on the first surface and connect to the conductive vias. The third line parts are formed on the second surface and connect to the conductive vias. The second and third line parts are formed to have substantially the same length. The semiconductor package utilizes the above substrate for processing data at a high speed.

Abstract translation: 用于半导体封装的衬底包括具有第一表面和与第一表面相对的第二表面的衬底本体。 在第一表面的边缘附近形成连接垫。 形成具有导电通孔和第一，第二和第三线部分的信号线。 第一线部分形成在第一表面上并且连接到穿过基板主体的连接焊盘和导电通孔。 第二线部分形成在第一表面上并连接到导电通孔。 第三线部分形成在第二表面上并连接到导电通孔。 第二和第三线部分形成为具有基本相同的长度。 半导体封装利用上述基板高速处理数据。

公开(公告)号：US07534545B2

公开(公告)日：2009-05-19

申请号：US11511021

申请日：2006-08-28

Applicant: Tae Min Kang ,  Jin Soo Kim ,  Mu Hyun Kim ,  Sun Hoe Kim ,  Noh Min Kwak ,  Sang Bong Lee ,  Seong Taek Lee ,  Seung Hyun Lee ,  Sok Won Noh ,  Jin Wook Seong ,  Myung Won Song ,  Yeun Joo Sung ,  Byeong Wook Yoo

Inventor： Tae Min Kang ,  Jin Soo Kim ,  Mu Hyun Kim ,  Sun Hoe Kim ,  Noh Min Kwak ,  Sang Bong Lee ,  Seong Taek Lee ,  Seung Hyun Lee ,  Sok Won Noh ,  Jin Wook Seong ,  Myung Won Song ,  Yeun Joo Sung ,  Byeong Wook Yoo

IPC: G03C8/00

CPC classification number: B41M5/265 ,  B41M5/38221 ,  H01L51/0013

Abstract: A laser induced thermal imaging (LITI) apparatus and a method of making an electronic device using the same are disclosed. The LITI apparatus includes a chamber, a substrate support, a contact frame, and a laser source or oscillator. The LITI apparatus transfers a transferable layer from a film donor device onto a surface of an intermediate electronic device. The LITI apparatus uses a magnetic force to provide a close contact between the transferable layer and the surface of the intermediate device. The magnetic force is generated by magnetic materials formed in two components of the LITI apparatus that are spaced apart interposing transferable layer and the surface of the intermediate device. Magnets or magnetic materials are formed in the two following components of the LITI apparatus: 1) the intermediate device and the film donor device; 2) the intermediate device and the contact frame; 3) the substrate support and the film donor device; or 4) the substrate support and the contact frame.

Abstract translation: 公开了一种激光诱导热成像（LITI）装置和使用其的电子装置的制造方法。 LITI装置包括腔室，衬底支撑件，接触框架和激光源或振荡器。 LITI装置将可转移层从成膜剂装置转移到中间电子装置的表面上。 LITI装置使用磁力来提供可转移层与中间装置的表面之间的紧密接触。 磁力由形成在LITI装置的两个部件中的磁性材料产生，该两个部件是间隔开的中间转印层和中间装置的表面。 在LITI装置的以下两个部件中形成磁体或磁性材料：1）中间装置和薄膜供体装置; 2）中间装置和接触框架; 3）基底支撑体和薄膜供体装置; 或4）衬底支撑件和接触框架。

公开(公告)号：US20090040977A1

公开(公告)日：2009-02-12

申请号：US12187893

申请日：2008-08-07

Applicant: Seung-Hyun LEE

Inventor： Seung-Hyun LEE

IPC: H04Q7/20

CPC classification number: H04W72/1257 ,  H04W72/1284

Abstract: An apparatus and a method for scheduling in consideration of a Service Connection Time Duration (SCTD) in a mobile communication system. The apparatus includes a User Equipment (UE) for transmitting a Media Access Control (MAC) Protocol Data Unit (PDU) including an SCTD measured by counting a connection time to receive an uplink service through a high speed data transmission, and a Base Transceiver Station (BTS) for receiving the MAC PDU including the SCTD from the UE, allocating a priority by considering the SCTD, and allocating radio resources based on the priority.

Abstract translation: 考虑到移动通信系统中的服务连接时间持续时间（SCTD）的调度的装置和方法。 该装置包括用于发送媒体接入控制（MAC）协议数据单元（PDU）的用户设备（UE），该媒体接入控制（MAC）协议数据单元（PDU）包括通过计数通过高速数据传输接收上行链路服务的连接时间而测量的SCTD，以及基站收发台 （BTS），用于从UE接收包括SCTD的MAC PDU，通过考虑SCTD分配优先级，并且基于优先级分配无线电资源。

公开(公告)号：US07486014B2

公开(公告)日：2009-02-03

申请号：US11443067

申请日：2006-05-31

Applicant: Seong-Yeon Hwang ,  Seung-Hyun Lee

Inventor： Seong-Yeon Hwang ,  Seung-Hyun Lee

IPC: H01J1/30

CPC classification number: H01J31/127 ,  H01J1/304

Abstract: An electron emission device includes a first electrode disposed on a substrate, an electron emission region electrically coupled to the first electrode, and a second electrode spaced apart from the first electrode, wherein the first electrode includes an opening and an extension that projects into the opening, and the electron emission region is electrically coupled to the first electrode by the extension.

Abstract translation: 电子发射装置包括设置在基板上的第一电极，电耦合到第一电极的电子发射区域和与第一电极间隔开的第二电极，其中第一电极包括突出到开口中的开口和延伸部分 并且电子发射区域通过延伸电耦合到第一电极。

公开(公告)号：US20090003290A1

公开(公告)日：2009-01-01

申请号：US12161086

申请日：2007-07-26

Applicant: Seung-Hyun Lee

Inventor： Seung-Hyun Lee

IPC: H04J3/00

CPC classification number: H04L1/0025 ,  H04L1/0006 ,  H04L69/14 ,  H04W28/18 ,  H04W52/34

Abstract: A method and apparatus for selecting a Transport Format Combination (TFC) in a wireless communication system are provided, in which it is determined whether a previous TFC used for data transmission on a previous valid Transmission Time Interval (TTI) can be reused as a current TFC for data transmission on a current valid TTI via at least one transport channel according to at least one parameter related to the transport channel, the previous TFC is set as the current TFC without performing a TFC search and determination process, when the previous TFC can be reused on the current valid TTI, and TFCs, each having Transport Formats (TFs) preset for data transmission on transport channels are searched, and a suitable TFC is selected for the current valid TTI from among the TFCs when the previous TFC cannot be reused on the current valid TTI.

Abstract translation: 提供了一种用于在无线通信系统中选择传输格式组合（TFC）的方法和装置，其中确定用于先前有效传输时间间隔（TTI）上的数据传输的先前TFC是否可以重新用作电流 TFC，用于根据与传输信道有关的至少一个参数，经由至少一个传输信道在当前有效TTI上进行数据传输，将前一个TFC设置为当前TFC，而不执行TFC搜索和确定过程，当前一个TFC可以 在当前有效的TTI上重复使用，并且在传输信道上预先设置用于数据传输的传输格式（TF）的TFC，并且当前一个TFC不能被重用时，从TFC中选择适合的TFC用于当前有效的TTI 在当前有效的TTI上。

公开(公告)号：US20080318361A1

公开(公告)日：2008-12-25

申请号：US11777388

申请日：2007-07-13

Applicant: Kwon Whan HAN ,  Chang Jun PARK ,  Min Suk SUH ,  Seong Cheol KIM ,  Sung Min KIM ,  Seung Taek YANG ,  Seung Hyun LEE ,  Jong Hoon KIM ,  Ha Na LEE

Inventor： Kwon Whan HAN ,  Chang Jun PARK ,  Min Suk SUH ,  Seong Cheol KIM ,  Sung Min KIM ,  Seung Taek YANG ,  Seung Hyun LEE ,  Jong Hoon KIM ,  Ha Na LEE

IPC: H01L21/44 ,  H01L21/02

CPC classification number: H01L21/76898 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/16145 ,  H01L2224/274 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/013

Abstract: A method for manufacturing a semiconductor package includes forming a groove in the portion outside of the bonding pad of a semiconductor chip provided with the bonding pad on an upper surface thereof; forming an insulation layer on the side wall of the groove; forming a metal layer over the semiconductor chip so as to fill the groove formed with the insulation layer; etching the metal layer to simultaneously form a through silicon via for filling the groove and a distribution layer for connecting the through silicon via and the bonding pad; and removing a rear surface of the semiconductor chip such that the lower surface of the through silicon via protrudes from the semiconductor chip.

Abstract translation: 一种半导体封装的制造方法，其特征在于，在设置有所述接合焊盘的半导体芯片的焊盘的外侧的部分的外表面形成有槽， 在所述槽的侧壁上形成绝缘层; 在半导体芯片上形成金属层，以填充形成有绝缘层的槽; 蚀刻金属层以同时形成用于填充槽的通过硅通孔和用于连接通过硅通孔和接合焊盘的分布层; 以及去除所述半导体芯片的后表面，使得所述贯穿硅通孔的下表面从所述半导体芯片突出。

公开(公告)号：US20080214024A1

公开(公告)日：2008-09-04

申请号：US12005624

申请日：2007-12-28

Applicant: Young-Eun Lee ,  Seung-Hyun Lee

Inventor： Young-Eun Lee ,  Seung-Hyun Lee

IPC: H01R12/00

CPC classification number: G02F1/133604 ,  G02F2001/133612

Abstract: A capacitive connector for a backlight unit having a light source including: a first conductive layer covering an end portion of the light source; an insulation layer covering an external surface of the first conductive layer; and a second conductive layer separated from the first conductive layer with the insulation layer interposed therebetween.

Abstract translation: 一种用于具有光源的背光单元的电容连接器，包括：覆盖所述光源的端部的第一导电层; 覆盖所述第一导电层的外表面的绝缘层; 以及与所述第一导电层分离的第二导电层，其间具有绝缘层。

公开(公告)号：US20080181166A1

公开(公告)日：2008-07-31

申请号：US12019432

申请日：2008-01-24

Applicant: Seung-Hyun LEE ,  Jin-Young Oh

Inventor： Seung-Hyun LEE ,  Jin-Young Oh

IPC: H04Q7/00

CPC classification number: H04W28/06 ,  H04L47/10 ,  H04L69/22

Abstract: Disclosed is a method and an apparatus for transmitting and receiving data via a MAC protocol in a mobile communication system. The method includes inputting at least one Service Data Unit (SDU) containing transmission data through a corresponding logical channel and generating at least one first Protocol Data Unit (PDU) that includes said at least one SDU without including multiplexing information for identification of the logical channel, by a first transmission entity; acquiring the first PDU and generating a second PDU including the first PDU in a payload of the second PDU, by a second transmission entity that operates between the first transmission entity and a physical layer; inserting the multiplexing information for identification of the logical channel corresponding to said at least one first PDU into header information of the second PDU; and transmitting the second PDU through the physical layer. The method can reduce load due to additional processing, such as a bit operation or memory copying, in a receiver requiring high speed data transmission.

Abstract translation: 公开了一种用于在移动通信系统中通过MAC协议发送和接收数据的方法和装置。 该方法包括通过相应的逻辑信道输入包含传输数据的至少一个服务数据单元（SDU），并且生成包括所述至少一个SDU的至少一个第一协议数据单元（PDU），而不包括用于识别逻辑信道的复用信息 ，由第一传输实体; 通过在所述第一传输实体和物理层之间操作的第二传输实体获取所述第一PDU并在所述第二PDU的有效载荷中生成包括所述第一PDU的第二PDU; 将用于识别对应于所述至少一个第一PDU的逻辑信道的复用信息插入到第二PDU的报头信息中; 以及通过所述物理层发送所述第二PDU。 该方法可以在需要高速数据传输的接收机中由于诸如位操作或存储器复制的附加处理而减少负载。

公开(公告)号：US20070046174A1

公开(公告)日：2007-03-01

申请号：US11508225

申请日：2006-08-23

Applicant: Seung-Hyun Lee

Inventor： Seung-Hyun Lee

IPC: H01J63/04 ,  H01J1/62

CPC classification number: H01J1/62 ,  H01J29/467 ,  H01J31/127

Abstract: An electron emission includes: first and second substrates arranged to face each other; an electron emission region arranged on the first substrate; a plurality of driving electrodes arranged on the first substrate and adapted to control electron emission of the electron emission region; a focusing electrode arranged above the driving electrodes and including openings adapted to focus electrons passing therethrough; and phosphor layers arranged on the second substrate, the phosphor layers respectively corresponding to each pixel region on the first substrate. The openings and the phosphor layer satisfy the following inequality: F2

Abstract translation: 电子发射包括：布置成彼此面对的第一和第二基板; 布置在所述第一基板上的电子发射区域; 多个驱动电极，设置在所述第一基板上并适于控制所述电子发射区域的电子发射; 布置在驱动电极上方的聚焦电极，并且包括适于聚焦穿过其中的电子的开口; 以及配置在所述第二基板上的荧光体层，所述荧光体层分别对应于所述第一基板上的每个像素区域。 开口和荧光体层满足以下不等式：F2