Abstract:
As a vehicle resin used for self-polishing antifouling paints, a vinyl polymer having a plurality of primary amino groups in the form of Schiff base in the molecule is used. The films of an antifouling paint containing this vehicle resin gradually release an aldehyde exhibiting antifouling activity from the Schiff base group upon hydrolysis with sea water, while the film gradually dissolves from the surface.
Abstract:
A pressure sensitive structural or sealant composition comprises (a) from 15 to 95% by weight of a telechelic polymer such as a hydroxyl-functional telechelic polymer and from 5 to 85% by weight of a heterotelechelic polydiene block polymer wherein at least one of the functionalities is the same as the functionality of the telechelic polymer, such as a heterotelechelic polydiene block polymer with hydroxyl and glycidyl ether funciontialities, and (b) a dual curing system wherein one curing agent cures the teolechelic polymer and the common functionality on the heterotelechelic polydiene block polymer such as a polyisocyanate, and the other curing agent cures the other functionality on the heterotelechelic polydiene block polymer at higher temperatures but does not cure under conditions required to cure the telechelic polymer, such as a polycarboxylic acid, polycarboxylic acid anhydride or a catalyst.
Abstract:
Pressure sensitive structural adhesive and sealant compositions comprising: (a) a polymer system comprising from 95 to 15 percent by weight of a telechelic polymer and from 5 to 85 percent by weight of a heterotelechelic polymer wherein at least one of the functionalities thereon is the same as the functionality on the telechelic polymer, and (b) a dual curing system wherein one element of the curing system cures the telechelic polymer and the common functionality on the heterotelechelic polymer and the other element cures the functionality on the heterotelechelic polymer but does not cure under the conditions required to cure the telechelic polymer to form a structural adhesive or sealant composition. In a preferred embodiment, the polymer system is comprised of a hydroxyl functional telechelic diol or polyol polymer and the heterotelechelic polymer is a monohydroxylated polydiene polymer which also has epoxidized olefin functionality. The dual curing system preferably is comprised of an isocyanate curing agent to cure through the hydroxyl groups at ambient temperatures to form a pressure sensitive adhesive or sealant and an amino resin to cure through the epoxy functionality upon baking to form a structural adhesive or sealant.
Abstract:
Pressure sensitive structural adhesive and sealant compositions comprising: (a) a polymer system comprising from 95 to 15 percent by weight of a telechelic polymer and from 5 to 85 percent by weight of a heterotelechelic polymer wherein at least one of the functionalities thereon is the same as the functionality on the telechelic polymer, and (b) a dual curing system wherein one element of the curing system cures the telechelic polymer and the common functionality on the heterotelechelic polymer and the other element cures the functionality on the heterotelechelic polymer but does not cure under the conditions required to cure the telechelic polymer to form a structural adhesive or sealant composition. In a preferred embodiment, the polymer system is comprised of a hydroxyl functional telechelic diol or polyol polymer and the heterotelechelic polymer is a monohydroxylated polydiene polymer which also has epoxidized olefin functionality. The dual curing system preferably is comprised of an isocyanate curing agent to cure through the hydroxyl groups at ambient temperatures to form a pressure sensitive adhesive or sealant and an amino resin to cure through the epoxy functionality upon baking to form a structural adhesive or sealant.
Abstract:
A water-resistant, anti-static pressure-sensitive adhesive tape suitable for use as a wafer dicing tape comprising a flexible substrate having opposing surfaces, at least one surface bearing thereon a removable, aziridine-crosslinked microparticulate adhesive comprised of microparticles having a surface bearing thereon an ionic conductive material formed from a polymer electrolyte base polymer, and at least one ionic salt selected from the group consisting of salts of alkali metals and salts of alkaline earth metals, wherein said microparticles have an average diameter of at least about 1 micrometer, said adhesive having an adhesion to steel of from about 0.5 Newtons/100 mm (N/100 mm) to about 10 N/100 mm.
Abstract:
An electrically conductive adhesive having elasticity over a wide temperature range of approximately -60.degree. C. to about 180.degree. C. for securing sensitive electronic components to a foundation is provided.
Abstract:
A primer composition and method for improving adhesion of polymeric material to metal ion containing substrate is provided. The primer consists of a solution of a polymer whose chain contains polar groups, such as carboxy, hydroxy, groups and the like, and non-polar monoethylenically unsaturated terminal groups. The primer is applied to the surface to be treated, the solvent evaporated and the polymeric material applied and cured in the usual way. The bond tensile strength of samples employing the primer composition is substantially increased as compared to the bond tensile strength of samples not employing the primer composition of this invention.