Abstract:
Disclosed are a porous electroformed shell for forming a grain pattern and a manufacturing method thereof. The method includes the step of implanting a fiber into a patterned surface of a negative-type silicone cast; applying, laminating, and curing an epoxy resin on the patterned surface of the negative-type silicone cast, and transferring the fiber from the negative-type silicone cast to an epoxy mandrel during demolding of the epoxy mandrel; forming a conductive thin film on the patterned surface of the epoxy mandrel, and causing the patterned surface to be conductive; removing the fiber having the conductive thin film from a surface of the epoxy mandrel; forming an electrodeposited layer by electrodepositing an electroforming metal on the conductive thin film while generating and growing a fine pore at a position of a hole due to the removal of the fiber; and demolding the electrodeposited layer having the fine pore from the epoxy mandrel. Through the disclosed method, precise control on a diameter and distribution of a fine pore can be simply and efficiently can be carried out.
Abstract:
A semiconductor device includes a second conductive-type deep well configured above a substrate. The deep well includes an ion implantation region and a diffusion region. A first conductive-type first well is formed in the diffusion region. A gate electrode extends over portions of the ion implantation region and of the diffusion region, and partially overlaps the first well. The ion implantation region has a uniform impurity concentration whereas the impurity concentration of the diffusion region varies from being the highest concentration at the boundary interface between the ion implantation region and the diffusion region to being the lowest at the portion of the diffusion region that is the farthest away from the boundary interface.
Abstract:
A complementary metal-oxide-semiconductor (CMOS) image sensor, including a wiring layer, a photodiode stacked with the wiring layer, a micro-lens stacked on the photodiode, an anti-reflection layer stacked on the photodiode. An anti-absorption layer may be provided between the photodiode and the anti-reflection layer. The photodiode may include a first portion and a second portion. Light may be focused on the first portion by the micro-lens and the second portion may at least partially surround the first portion. A material of the first portion may have a refractive index higher than a refractive index of a material of the second portion. The anti-absorption layer may include a compound semiconductor having an energy band gap greater than an energy band gap of a semiconductor included in the photodiode.
Abstract:
Image sensors including a semiconductor substrate, a plurality of photo detecting elements, a dielectric layer, a plurality of color filters, and a plurality of micro lenses. The photo detecting elements may be in the semiconductor substrate and may convert an incident light into an electric signal. The dielectric layer may be on the semiconductor substrate and may include a plurality of photo blocking regions on regions between the photo detecting elements. The color filters may be on the dielectric layer and may be disposed corresponding to the plurality of photo detecting elements, respectively. The micro lenses may be on the plurality of color filters and may be disposed corresponding to the plurality of photo detecting elements, respectively.
Abstract:
An image sensor includes a semiconductor substrate, a plurality of photo detecting elements and a backside protection pattern. The plurality of photo detecting elements may be formed in an upper portion of the semiconductor substrate. The plurality of photo detecting elements may be separate from each other. The backside protection pattern may be formed in a lower portion of the semiconductor substrate between the plurality of photo detecting elements.
Abstract:
An FPCB and a method of manufacturing the same, in which an electrical signal-conductive portion of the FPCB is subjected to little stress so as not to be broken by fatigue in spite of repeated bending of the FPCB, thereby increasing the lifetime of the FPCB.
Abstract:
Disclosed herein is a linear vibration motor. The motor includes a casing surrounding the top and widthwise side of the motor, and a bracket surrounding the bottom and lengthwise side of the motor. A plate is provided on an inner surface of a side of the bracket and integrally has a cylindrical part to accommodate a coil. A mass body is provided in a central portion of the bracket and vibrates horizontally, a yoke is provided on a side surface of the mass body, and a magnet is mounted to a central portion of the yoke to be inserted into an internal space of the coil. A spring couples the plate with the yoke, thus transmitting vibratory force to the motor. An extension part extends from an end of the spring, and a bearing is provided on an end of the extension part, thus minimizing friction with the casing.
Abstract:
There is provided an organic light emitting diode driver being capable of compensating for pixel deterioration in real time during the driving of pixels by selectively compensating pixels, requiring compensation, for the deterioration thereof. The organic light emitting diode driver includes a converting unit converting input data into compensation data used to selectively compensate for pixel deterioration depending on whether the input data has been calibrated or not; a driving unit driving pixels of a pixel unit based on the compensation data from the converting unit; and a compensating unit providing the converting unit with a deterioration compensation signal based on deterioration information obtained from a pixel driven by the driving unit.
Abstract:
There is provided a music accompaniment apparatus that is connected to at least one external device to reproduce an audio or video signal, the music accompaniment apparatus including: an audio input section for inputting an external audio signal; an audio signal processing section for processing an audio signal including an accompaniment signal internally provided and an external audio signal input through the audio input section, and externally outputting the processed audio signal; a video signal processing section for processing a video signal including a caption signal, and externally outputting the processed video signal; a time delay calculating section for calculating the difference between a transmission time of a check signal to the at least one external device and a reception time of the check signal from the at least one external device to compute a time delay representing a delay of the audio or video signal for the at least one external device; and a control section for controlling the whole operation of the music accompaniment apparatus including generation and transmission/reception of the check signal, and controlling the transmission time of the video or audio signal in correspondence to the time delay. The present invention guarantees an efficient use of a digital device having a time delay as connected to the music accompaniment apparatus.