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公开(公告)号：US20240112968A1
公开(公告)日：2024-04-04
申请号：US18285389
申请日：2022-03-23
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Sung Hyun BYUN
CPC classification number: H01L23/142 , H01L24/11 , H01L24/13 , H01L24/16 , H01L25/16 , H01L23/49816 , H01L2224/13111 , H01L2224/16227
Abstract: Proposed are an anodic aluminum oxide film-based interposer for electrical connection and a manufacturing method therefor, a semiconductor package and a manufacturing method therefor, a multi-stacked semiconductor device and a manufacturing method therefor, and a display and a manufacturing method therefor that can cope with a narrow pitch between terminals and prevent an increase in current density and thermal energy density in a bump connection part. To this end, proposed is an interposer for electrical connection, in which a through-hole is provided in a body made of anodic aluminum oxide film and a first bonding material, an electrically conductive material, and a second bonding material are formed in the through-hole by electroplating. Here, fine trenches having repeated peaks and valleys in the circumferential direction are provided in an outer circumferential surface of a micro-bump.
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公开(公告)号：US11852655B2
公开(公告)日：2023-12-26
申请号：US17038642
申请日：2020-09-30
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo Ahn , Seung Ho Park , Sung Hyun Byun
CPC classification number: G01R1/07342 , H05K1/0298 , H05K3/107 , H05K3/462
Abstract: Proposed is a multilayer wiring substrate having excellent joining strength, a method of manufacturing the multilayer wiring substrate, and a probe card having the multilayer wiring substrate.
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公开(公告)号：US20230090643A1
公开(公告)日：2023-03-23
申请号：US18058177
申请日：2022-11-22
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo Ahn , Seung Ho Park , Sung Hyun Byun
Abstract: Proposed are a manufacturing method of an anodic oxide film structure, and an anodic oxide film structure. More particularly, proposed are a manufacturing method of an anodic oxide film structure, and an anodic oxide film structure, wherein production yield of the entire product can be improved by repairing a defective region to be made normal.
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154.发明授权公开(公告)号：US11610937B2
公开(公告)日：2023-03-21
申请号：US16921564
申请日：2020-07-06
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo Ahn , Seung Ho Park , Sung Hyun Byun
Abstract: Disclosed are a micro LED group substrate provided with a plurality of micro LEDs, a method of manufacturing the same, a micro LED display panel, and a method of manufacturing the same. More particularly, disclosed are a micro LED group substrate provided with a plurality of micro LEDs, a method of manufacturing the same, a micro LED display panel, and a method of manufacturing the same, wherein the need for a micro LED replacement process is eliminated.
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公开(公告)号：US11523504B2
公开(公告)日：2022-12-06
申请号：US17166768
申请日：2021-02-03
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo Ahn , Sung Hyun Byun , Tae Hwan Song
Abstract: Proposed is an anodic oxide film structure that includes an anodic oxide film sheet and has high strength, chemical resistance and corrosion resistance.
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Patent Agency Ranking
公开(公告)号：US11497126B2
公开(公告)日：2022-11-08
申请号：US17087261
申请日：2020-11-02
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo Ahn , Seung Ho Park , Sung Hyun Byun
IPC: H05K1/00 , H05K1/02 , H05K1/03 , H05K1/05 , H05K1/11 , H05K1/16 , H05K3/36 , H05K3/40 , H01L21/00 , H01L21/50 , H01L23/14 , H01L23/15 , H01L23/48 , H01L23/58 , H01L23/498 , H05K3/46
Abstract: Proposed are a multilayer wiring board having both durability and chemical resistance, and a probe card including the same.
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公开(公告)号：US11253619B2
公开(公告)日：2022-02-22
申请号：US16890777
申请日：2020-06-02
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo Ahn , Seung Ho Park , Moon Hyun Kim
Abstract: Provided is a UV sterilizer including an illumination unit, a cover that has an open hole in an upper surface thereof and supports the illumination unit, and a body that is provided underneath the cover and secures an illumination distance between the illumination unit and an illumination target object. The body is composed of a first body and a second body into which the first body is inserted. The first body and the second body are separably combined with each other.
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公开(公告)号：US11201272B2
公开(公告)日：2021-12-14
申请号：US16383462
申请日：2019-04-12
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo Ahn , Seung Ho Park , Moon Hyun Kim
Abstract: The present invention relates generally to an optical device package on which an optical device is mounted and, more particularly, to an optical device package that is configured such that a unit substrate of the optical device package comes into surface contact with a curved surface of a light transmission member.
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159.发明申请公开(公告)号：US20210331446A1
公开(公告)日：2021-10-28
申请号：US17232029
申请日：2021-04-15
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo Ahn , Seung Ho Park , Sung Hyun Byun
Abstract: Proposed are a laminated anodic aluminum oxide structure in which a plurality of anodic aluminum oxide films are stacked, a guide plate of a probe card using the same, and a probe card having the same. More particularly, proposed are a laminated anodic aluminum oxide structure with a high degree of surface strength, a guide plate of a probe card using the same, and a probe card having the same.
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公开(公告)号：US20210302472A1
公开(公告)日：2021-09-30
申请号：US17214785
申请日：2021-03-26
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Tae Hwan SONG
IPC: G01R1/073
Abstract: Proposed is a probe head having a probe card for performing a circuit inspection of a wafer. More particularly, proposed are a probe head and a probe card having the probe head, the probe head having a guide plate. The guide plate has a guide hole and a shield portion composed of a metal material positioned at the periphery of the guide hole, thereby blocking signal interference that may be occurred between adjacent probes.
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