公开(公告)号：US07696990B2

公开(公告)日：2010-04-13

申请号：US11476120

申请日：2006-06-28

Applicant: Bily Wang ,  Hui-Chung Lin

Inventor： Bily Wang ,  Hui-Chung Lin

IPC: G09G5/00

CPC classification number: G09G3/14 ,  G09G2320/0233 ,  G09G2320/0626

Abstract: The present invention relates to an LED driving circuit and a serial LED illumination system. The LED driving circuit compares a data signal with a voltage threshold via a comparator to output a mode selection signal. The register unit includes an instruction register and a data register. The register unit is coupled to the comparator unit and controlled by the mode selection signal to perform an instruction or data transmission mode. The instruction register stores the instruction data under the instruction mode. The data register stores the illumination display data under the data transmission mode. When the data register is full, the register unit outputs a secondary data signal. The driving unit is controlled by the instruction data and drives an LED module according to the illumination display data. The serial LED illumination system includes a controller that is connected with at least one LED driving circuit in serial.

Abstract translation: 本发明涉及LED驱动电路和串联LED照明系统。 LED驱动电路通过比较器将数据信号与电压阈值进行比较，以输出模式选择信号。 寄存器单元包括指令寄存器和数据寄存器。 寄存器单元耦合到比较器单元并由模式选择信号控制，以执行指令或数据传输模式。 指令寄存器将指令数据存储在指令模式下。 数据寄存器将照明显示数据存储在数据传输模式下。 当数据寄存器满时，寄存器单元输出辅助数据信号。 驱动单元由指令数据控制，并根据照明显示数据驱动LED模块。 串联LED照明系统包括与至少一个LED驱动电路串联连接的控制器。

公开(公告)号：US20090246897A1

公开(公告)日：2009-10-01

申请号：US12385716

申请日：2009-04-17

Applicant: Bily Wang ,  Jonnie Chuang ,  Wen-Kuei Wu

Inventor： Bily Wang ,  Jonnie Chuang ,  Wen-Kuei Wu

IPC: H01L21/50

CPC classification number: G02B6/0073 ,  F21K9/00 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An LED chip package structure includes a substrate unit, a light-emitting unit, and a colloid unit. The substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace is respectively formed on the substrate body. The light-emitting unit has a plurality of LED chips arranged on the substrate body for generating light, wherein each of the LED chips has a positive side and a negative side respectively electrically connected with the positive electrode trace and the negative electrode trace. The colloid unit is covered over the substrate unit and the light-emitting unit for guiding the light from the light-emitting unit to form a series of light-generating areas on the colloid unit.

Abstract translation: LED芯片封装结构包括基板单元，发光单元和胶体单元。 基板单元具有基板主体，并且在基板主体上分别形成正极迹线和负极迹线。 发光单元具有布置在基板主体上用于产生光的多个LED芯片，其中每个LED芯片具有分别与正极迹线和负极迹线电连接的正侧和负极。 胶体单元被覆盖在基板单元和用于引导来自发光单元的光的发光单元上，以在胶体单元上形成一系列发光区域。

公开(公告)号：US20090239319A1

公开(公告)日：2009-09-24

申请号：US12385728

申请日：2009-04-17

Applicant: Bily Wang ,  Jonnie Chuang ,  Hui-Yen Huang

Inventor： Bily Wang ,  Jonnie Chuang ,  Hui-Yen Huang

IPC: H01L21/56

CPC classification number: H01L33/486 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

Abstract: A package for an LED, comprises a metal substrate, at least one LED chip, and an insulative housing, wherein the metal substrate has a first terminal and a second terminal, and the first terminal is formed with a recess. The at least one LED chip is arranged in the recess of the first terminal of the metal substrate, wherein the chip is electrically connected with the first terminal and the second terminal of the metal substrate. Since the insulative housing caps the chip and the metal substrate, and the LED package can be reduced in size.

Abstract translation: 一种用于LED的封装，包括金属基板，至少一个LED芯片和绝缘壳体，其中所述金属基板具有第一端子和第二端子，并且所述第一端子形成有凹部。 所述至少一个LED芯片布置在所述金属基板的所述第一端子的所述凹部中，其中所述芯片与所述金属基板的所述第一端子和所述第二端子电连接。 由于绝缘壳体覆盖芯片和金属基板，并且LED封装的尺寸可以减小。

公开(公告)号：US20090224653A1

公开(公告)日：2009-09-10

申请号：US12232931

申请日：2008-09-26

Applicant: Bily Wang ,  Shih-Yu Wu ,  Wen-Kuei Wu

Inventor： Bily Wang ,  Shih-Yu Wu ,  Wen-Kuei Wu

IPC: H01J9/00 ,  H01J1/62

CPC classification number: H01L33/507 ,  H01L25/0753 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An LED chip package structure in order to prevent the light-emitting efficiency of fluorescent powder from decreasing due to high temperature includes a substrate unit, a light-emitting unit, a transparent colloid body unit, a fluorescent colloid body unit and a frame unit. The light-emitting unit has a plurality of LED chips electrically arranged on the substrate unit. The transparent colloid body unit has a plurality of transparent colloid bodies respectively covering the LED chips. The fluorescent colloid body unit has a plurality of fluorescent colloid bodies respectively covering the transparent colloid bodies. The frame unit is covering the peripheries of each transparent colloid body and each fluorescent colloid body in order to expose the top surfaces of the fluorescent colloid body.

Abstract translation: 为了防止荧光粉的发光效率由于高温而降低的LED芯片封装结构包括基板单元，发光单元，透明胶体主体单元，荧光胶体主体单元和框架单元。 发光单元具有电子地布置在基板单元上的多个LED芯片。 透明胶体体单元具有分别覆盖LED芯片的多个透明胶体。 荧光胶体主体单元具有分别覆盖透明胶体的多个荧光胶体。 框架单元覆盖每个透明胶体和每个荧光胶体的周边，以暴露荧光胶体的顶表面。

公开(公告)号：US20090213474A1

公开(公告)日：2009-08-27

申请号：US12285035

申请日：2008-09-29

Applicant: Bily Wang ,  Kuei-Pao Chen ,  Chih-Ming Wang ,  Jui-Wen Pan

Inventor： Bily Wang ,  Kuei-Pao Chen ,  Chih-Ming Wang ,  Jui-Wen Pan

IPC: G02B11/20

CPC classification number: G02B13/0095

Abstract: An optical object distance simulation device for reducing total optical path includes: a lens, an achromatic lens set, a first image lens, and a second image lens. The achromatic lens set disposes beside one side of the lens, the first image lens disposes beside one side of the achromatic lens set, and the second image lens disposes beside one side of the first image lens. The achromatic lens set is composed of a first lens and a second lens. The first lens is a double-concave lens. The second lens is a double-convex lens. One concave face of the double-concave tightly contacts with one convex face of the double-convex lens. Therefore, the lens, the achromatic lens set, the first image lens, and the second image lens match with each other in order to simulate real object distance for reducing an object distance between a test camera lens and a corresponding chart.

Abstract translation: 用于减小总光路的光学物体距离模拟装置包括：透镜，消色差透镜组，第一图像透镜和第二图像透镜。 消色差透镜组位于透镜的一侧旁边，第一图像透镜配置在消色差透镜组的一侧旁边，第二图像透镜配置在第一图像透镜的一侧旁边。 消色差透镜组由第一透镜和第二透镜组成。 第一个镜头是双凹透镜。 第二透镜是双凸透镜。 双凹面的一个凹面与双凸透镜的一个凸面紧密接触。 因此，透镜，消色差透镜组，第一图像透镜和第二图像透镜彼此匹配，以便模拟实际物体距离，以减少测试相机镜头与相应图表之间的物体距离。

公开(公告)号：US20090186434A1

公开(公告)日：2009-07-23

申请号：US12382760

申请日：2009-03-24

Applicant: Bily Wang ,  Jonnie Chuang ,  Hui-Yen Huang

Inventor： Bily Wang ,  Jonnie Chuang ,  Hui-Yen Huang

IPC: H01L21/50

CPC classification number: H01L25/0753 ,  H01L24/97 ,  H01L33/483 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2224/85 ,  H01L2924/00014

Abstract: An LED chip package structure with thick guiding pin includes a plurality of conductive pins separated from each other, an insulative casing, a plurality of LED chips, and a packaging colloid. The insulative casing covers a bottom side of each conductive pin to form an injection concave groove for exposing a top surface of each conductive pin. Two lateral sides of each conductive pin are extended outward from the insulative casing. The LED chips are arranged in the injection concave groove, and each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with different conductive pins. In addition, the packaging colloid is filled into the injection concave groove for covering the LED chips.

Abstract translation: 具有厚引导针的LED芯片封装结构包括彼此分离的多个导电引脚，绝缘壳体，多个LED芯片和封装胶体。 绝缘壳体覆盖每个导电销的底侧，以形成用于暴露每个导电销的顶表面的注入凹槽。 每个导电针的两个侧面从绝缘壳体向外延伸。 LED芯片布置在注入凹槽中，并且每个LED芯片分别具有正极侧和负极侧，并与不同的导电针电连接。 此外，将包装胶体填充到用于覆盖LED芯片的注入凹槽中。

公开(公告)号：US07563641B2

公开(公告)日：2009-07-21

申请号：US11605425

申请日：2006-11-29

Applicant: Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin ,  Chao-Yuan Huang

Inventor： Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin ,  Chao-Yuan Huang

IPC: H01L21/00

CPC classification number: G09F9/302 ,  G09F9/33 ,  H05K1/0306 ,  H05K1/0393 ,  H05K1/181 ,  H05K2201/0108 ,  H05K2201/10106 ,  Y02P70/611

Abstract: A laminated light-emitting diode display device and a manufacturing method thereof are described. The laminated light-emitting diode display device has an insulator, a circuitry device placed on the insulator and having of a plurality of circuits interconnected with each other, and a plurality of SMT-type light-emitting diodes electrically connected to the circuits of the circuitry unit.

Abstract translation: 对层叠型发光二极管显示装置及其制造方法进行说明。 层叠发光二极管显示装置具有绝缘体，放置在绝缘体上并具有彼此互连的多个电路的电路装置，以及电连接到电路的电路的多个SMT型发光二极管 单元。

公开(公告)号：USD595674S1

公开(公告)日：2009-07-07

申请号：US29309665

申请日：2008-09-24

Applicant: Bily Wang ,  Chao-Yuan Huang ,  Ping-Chou Yang ,  Jia-Wen Chen ,  Hsiu-Wen Wang

Designer： Bily Wang ,  Chao-Yuan Huang ,  Ping-Chou Yang ,  Jia-Wen Chen ,  Hsiu-Wen Wang

公开(公告)号：US20090152570A1

公开(公告)日：2009-06-18

申请号：US12232835

申请日：2008-09-25

Applicant: Bily Wang ,  Shih-Yu Wu ,  Wen-Kuei Wu

Inventor： Bily Wang ,  Shih-Yu Wu ,  Wen-Kuei Wu

IPC: H01L33/00

CPC classification number: H01L24/97 ,  F21K9/90 ,  F21Y2103/10 ,  F21Y2115/10 ,  G02B6/0031 ,  G02B6/0073 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An LED chip package structure with high-efficiency light emission by rough surfaces includes a substrate unit, a light-emitting unit, and a package colloid unit. The substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace respectively formed on the substrate body. The light-emitting unit has a plurality of LED chips arranged on the substrate body. Each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit. The package colloid unit has a plurality of package colloids respectively covering the LED chips. Each package colloid has a cambered colloid surface and a light-emitting colloid surface respectively formed on its top surface and a lateral surface thereof.

Abstract translation: 通过粗糙表面具有高效发光的LED芯片封装结构包括基板单元，发光单元和封装胶体单元。 基板单元具有分别形成在基板主体上的基板主体和正极迹线和负极迹线。 发光单元具有布置在基板主体上的多个LED芯片。 各LED芯片分别具有正极侧和负极侧，与基板单元的正极迹线和负极迹线电连接。 封装胶体单元具有分别覆盖LED芯片的多个封装胶体。 每个包装胶体具有分别形成在其顶表面及其侧表面上的弧形胶体表面和发光胶体表面。

公开(公告)号：US20090146156A1

公开(公告)日：2009-06-11

申请号：US12285034

申请日：2008-09-29

Applicant: Bily Wang ,  Shih-Yu Wu ,  Wen-Kuei Wu

Inventor： Bily Wang ,  Shih-Yu Wu ,  Wen-Kuei Wu

IPC: H01L33/00 ,  H01L21/00

CPC classification number: G02B6/0031 ,  F21K9/00 ,  F21K9/20 ,  F21Y2103/10 ,  F21Y2115/10

Abstract: An LED chip package structure with high-efficiency light-emitting effect includes a substrate unit, a light-emitting unit, a package colloid unit, and a frame unit. The light-emitting unit has a plurality of LED chips electrically arranged on the substrate unit. The package colloid unit has a longitudinal package colloid covering the LED chips, and the longitudinal package colloid has a cambered colloid surface and a light-emitting colloid surface respectively formed on its top surface and a lateral surface thereof. The frame unit that is a frame layer covering the substrate unit and disposed around a lateral side of the longitudinal package colloid for exposing the light-emitting colloid surface of the longitudinal package colloid.

Abstract translation: 具有高效率发光效果的LED芯片封装结构包括基板单元，发光单元，封装胶体单元和框架单元。 发光单元具有电子地布置在基板单元上的多个LED芯片。 封装胶体单元具有覆盖LED芯片的纵向封装胶体，并且纵向封装胶体具有分别形成在其顶表面及其侧表面上的弧形胶体表面和发光胶体表面。 所述框架单元是覆盖所述基板单元并且设置在所述纵向封装胶体的侧面周围的框架层，用于暴露所述纵向封装胶体的发光胶体表面。