SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
    172.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    半导体器件及其制造方法

    公开(公告)号:US20140377907A1

    公开(公告)日:2014-12-25

    申请号:US14480760

    申请日:2014-09-09

    Abstract: An object is to provide a high reliable semiconductor device including a thin film transistor having stable electric characteristics. In a method for manufacturing a semiconductor device including a thin film transistor in which an oxide semiconductor film is used for a semiconductor layer including a channel formation region, heat treatment (which is for dehydration or dehydrogenation) is performed so as to improve the purity of the oxide semiconductor film and reduce impurities such as moisture. Besides impurities such as moisture existing in the oxide semiconductor film, heat treatment causes reduction of impurities such as moisture existing in the gate insulating layer and those in interfaces between the oxide semiconductor film and films which are provided over and below the oxide semiconductor film and are in contact with the oxide semiconductor film.

    Abstract translation: 目的是提供一种包括具有稳定电特性的薄膜晶体管的高可靠性半导体器件。 在包括使用氧化物半导体膜用于包括沟道形成区域的半导体层的薄膜晶体管的半导体器件的制造方法中,进行热处理(其用于脱水或脱氢),以提高纯度 氧化物半导体膜,并且减少诸如水分的杂质。 除了存在于氧化物半导体膜中的水分等杂质外,热处理会导致存在于栅极绝缘层中的杂质,氧化物半导体膜和氧化物半导体膜之间的氧化物半导体膜与膜之间的界面中的杂质的减少, 与氧化物半导体膜接触。

    METHOD FOR MANUFACTURING OXIDE SEMICONDUCTOR FILM AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    173.
    发明申请
    METHOD FOR MANUFACTURING OXIDE SEMICONDUCTOR FILM AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开
    制造氧化物半导体膜的方法和制造半导体器件的方法

    公开(公告)号:US20140235015A1

    公开(公告)日:2014-08-21

    申请号:US14260461

    申请日:2014-04-24

    Abstract: An object is to provide an oxide semiconductor having stable electric characteristics and a semiconductor device including the oxide semiconductor. A manufacturing method of a semiconductor film by a sputtering method includes the steps of holding a substrate in a treatment chamber which is kept in a reduced-pressure state; heating the substrate at lower than 400° C.; introducing a sputtering gas from which hydrogen and moisture are removed in the state where remaining moisture in the treatment chamber is removed; and forming an oxide semiconductor film over the substrate with use of a metal oxide which is provided in the treatment chamber as a target. When the oxide semiconductor film is formed, remaining moisture in a reaction atmosphere is removed; thus, the concentration of hydrogen and the concentration of hydride in the oxide semiconductor film can be reduced. Thus, the oxide semiconductor film can be stabilized.

    Abstract translation: 目的是提供具有稳定电特性的氧化物半导体和包括氧化物半导体的半导体器件。 通过溅射法制造半导体膜的方法包括将基板保持在保持在减压状态的处理室中的步骤; 在低于400℃下加热基材。 在去除处理室中的剩余水分的状态下引入除去氢气和水分的溅射气体; 以及使用设置在处理室中的金属氧化物作为目标,在基板上形成氧化物半导体膜。 当形成氧化物半导体膜时,除去反应气氛中的剩余水分; 因此,可以降低氧化物半导体膜中的氢浓度和氢化物浓度。 因此,可以使氧化物半导体膜稳定。

    METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    174.
    发明申请
    METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 有权
    制造半导体器件的方法

    公开(公告)号:US20140217402A1

    公开(公告)日:2014-08-07

    申请号:US14247665

    申请日:2014-04-08

    Abstract: It is an object to provide a highly reliable semiconductor device which includes a thin film transistor having stable electric characteristics. It is another object to manufacture a highly reliable semiconductor device at lower cost with high productivity. In a method for manufacturing a semiconductor device which includes a thin film transistor where a semiconductor layer having a channel formation region, a source region, and a drain region are formed using an oxide semiconductor layer, heat treatment (heat treatment for dehydration or dehydrogenation) is performed so as to improve the purity of the oxide semiconductor layer and reduce impurities such as moisture. Moreover, the oxide semiconductor layer subjected to the heat treatment is slowly cooled under an oxygen atmosphere.

    Abstract translation: 本发明的目的是提供一种高度可靠的半导体器件,其包括具有稳定电特性的薄膜晶体管。 另一个目的是以更高的生产率以更低的成本制造高可靠性的半导体器件。 在包括薄膜晶体管的半导体器件的制造方法中,使用氧化物半导体层形成具有沟道形成区域,源极区域和漏极区域的半导体层,进行热处理(脱水或脱氢的热处理) 以提高氧化物半导体层的纯度并减少诸如水分的杂质。 此外,在氧气氛下缓慢冷却经受热处理的氧化物半导体层。

    DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME
    175.
    发明申请
    DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
    显示装置及其制造方法

    公开(公告)号:US20140186997A1

    公开(公告)日:2014-07-03

    申请号:US14196236

    申请日:2014-03-04

    Abstract: An object is to provide a display device with excellent display characteristics, where a pixel circuit and a driver circuit provided over one substrate are formed using transistors which have different structures corresponding to characteristics of the respective circuits. The driver circuit portion includes a driver circuit transistor in which a gate electrode layer, a source electrode layer, and a drain electrode layer are formed using a metal film, and a channel layer is formed using an oxide semiconductor. The pixel portion includes a pixel transistor in which a gate electrode layer, a source electrode layer, and a drain electrode layer are formed using an oxide conductor, and a semiconductor layer is formed using an oxide semiconductor. The pixel transistor is formed using a light-transmitting material, and thus, a display device with higher aperture ratio can be manufactured.

    Abstract translation: 本发明的目的是提供具有优异显示特性的显示装置,其中使用具有对应于各个电路的特性的不同结构的晶体管形成设置在一个基板上的像素电路和驱动电路。 驱动器电路部分包括驱动电路晶体管,其中使用金属膜形成栅电极层,源电极层和漏电极层,并且使用氧化物半导体形成沟道层。 像素部分包括其中使用氧化物导体形成栅电极层,源电极层和漏电极层的像素晶体管,并且使用氧化物半导体形成半导体层。 像素晶体管使用透光材料形成,因此可以制造具有较高开口率的显示装置。

    METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    176.
    发明申请
    METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开
    制造半导体器件的方法

    公开(公告)号:US20140113406A1

    公开(公告)日:2014-04-24

    申请号:US14143542

    申请日:2013-12-30

    Abstract: An object is to manufacture a highly reliable semiconductor device including a thin film transistor with stable electric characteristics. In a method for manufacturing a semiconductor device including a thin film transistor in which an oxide semiconductor film is used for a semiconductor layer including a channel formation region, heat treatment (for dehydration or dehydrogenation) is performed to improve the purity of the oxide semiconductor film and reduce impurities including moisture or the like. After that, slow cooling is performed under an oxygen atmosphere. Besides impurities including moisture or the like exiting in the oxide semiconductor film, heat treatment causes reduction of impurities including moisture or the like exiting in a gate insulating layer and those in interfaces between the oxide semiconductor film and films which are provided over and below the oxide semiconductor and in contact therewith.

    Abstract translation: 本发明的目的是制造具有稳定电特性的薄膜晶体管的高度可靠的半导体器件。 在包括使用氧化物半导体膜用于包括沟道形成区域的半导体层的薄膜晶体管的半导体器件的制造方法中,进行热处理(脱水或脱氢)以提高氧化物半导体膜的纯度 并减少杂质,包括水分等。 之后,在氧气氛下进行缓慢冷却。 除了在氧化物半导体膜中排出的含有水分等的杂质以外,热处理会导致在栅极绝缘层中退出的杂质,包括氧化物半导体膜和膜之间的界面中的杂质,氧化物半导体膜和氧化物之间和之下的界面 半导体并与其接触。

    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
    177.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    半导体器件及其制造方法

    公开(公告)号:US20140110709A1

    公开(公告)日:2014-04-24

    申请号:US14140044

    申请日:2013-12-24

    Abstract: It is an object to provide an oxide semiconductor which is suitable for use in a semiconductor device. Alternatively, it is another object to provide a semiconductor device using the oxide semiconductor. Provided is a semiconductor device including an In—Ga—Zn—O based oxide semiconductor layer in a channel formation region of a transistor. In the semiconductor device, the In—Ga—Zn—O based oxide semiconductor layer has a structure in which crystal grains represented by InGaO3(ZnO)m (m=1) are included in an amorphous structure represented by InGaO3(ZnO)m (m>0).

    Abstract translation: 本发明的目的是提供一种适用于半导体器件的氧化物半导体。 或者,另一目的是提供一种使用氧化物半导体的半导体器件。 提供了在晶体管的沟道形成区域中包括In-Ga-Zn-O系氧化物半导体层的半导体器件。 在半导体器件中,In-Ga-Zn-O系氧化物半导体层具有以InGaO 3(ZnO)m(m = 1)表示的晶粒包含在由InGaO 3(ZnO)m( m> 0)。

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THE SAME
    178.
    发明申请
    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THE SAME 审中-公开
    半导体器件及其制造方法相同

    公开(公告)号:US20140048798A1

    公开(公告)日:2014-02-20

    申请号:US13969808

    申请日:2013-08-19

    Abstract: An object is to manufacture and provide a highly reliable semiconductor device including a thin film transistor with stable electric characteristics. In a method for manufacturing a semiconductor device including a thin film transistor in which a semiconductor layer including a channel formation region serves as an oxide semiconductor film, heat treatment for reducing impurities such as moisture (heat treatment for dehydration or dehydrogenation) is performed after an oxide insulating film serving as a protective film is formed in contact with an oxide semiconductor layer. Then, the impurities such as moisture, which exist not only in a source electrode layer, in a drain electrode layer, in a gate insulating layer, and in the oxide semiconductor layer but also at interfaces between the oxide semiconductor film and upper and lower films which are in contact with the oxide semiconductor layer, are reduced.

    Abstract translation: 目的是制造和提供包括具有稳定电特性的薄膜晶体管的高度可靠的半导体器件。 在包括薄膜晶体管的半导体器件的制造方法中,其中包括沟道形成区域的半导体层用作氧化物半导体膜,用于减少诸如水分的杂质(脱水或脱氢热处理)的热处理在 形成与氧化物半导体层接触的用作保护膜的氧化物绝缘膜。 然后,在漏极电极层,栅极绝缘层和氧化物半导体层中以及在氧化物半导体膜和上下膜之间的界面处不仅在源电极层中存在的诸如水分的杂质 它们与氧化物半导体层接触。

    LIGHT-EMITTING ELEMENT, LIGHT-EMITTING DEVICE, ELECTRONIC APPLIANCE, AND METHOD OF MANUFACTURING THE SAME
    179.
    发明申请
    LIGHT-EMITTING ELEMENT, LIGHT-EMITTING DEVICE, ELECTRONIC APPLIANCE, AND METHOD OF MANUFACTURING THE SAME 审中-公开
    发光元件,发光装置,电子器具及其制造方法

    公开(公告)号:US20140042414A1

    公开(公告)日:2014-02-13

    申请号:US14056173

    申请日:2013-10-17

    Abstract: A light-emitting element is provided which has a light-emitting layer between a first electrode and a second electrode, where the light-emitting layer has a first layer and a second layer; the first layer contains a first organic compound and a third organic compound; the second layer contains a second organic compound and the third organic compound; the first layer is provided to be in contact with the second layer on the first electrode side; the first organic compound is an organic compound with an electron transporting property; the second organic compound is an organic compound with a hole transporting property; the third organic compound has an electron trapping property; and light emission from the third organic compound can be obtained when voltage is applied to the first electrode and the second electrode so that the potential of the first electrode is higher than that of the second electrode.

    Abstract translation: 提供一种在第一电极和第二电极之间具有发光层的发光元件,其中发光层具有第一层和第二层; 第一层包含第一有机化合物和第三有机化合物; 第二层包含第二有机化合物和第三有机化合物; 第一层设置成与第一电极侧的第二层接触; 第一有机化合物是具有电子传输性质的有机化合物; 第二有机化合物是具有空穴传输性的有机化合物; 第三有机化合物具有电子捕获性; 并且当对第一电极和第二电极施加电压使得第一电极的电位高于第二电极的电位时,可以获得来自第三有机化合物的发光。

    MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
    180.
    发明申请
    MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE 审中-公开
    半导体器件的制造方法

    公开(公告)号:US20130328044A1

    公开(公告)日:2013-12-12

    申请号:US13965309

    申请日:2013-08-13

    CPC classification number: H01L29/7869 H01L21/67109 H01L21/67115 H01L27/1225

    Abstract: An object is to provide a highly reliable semiconductor device including a thin film transistor with stable electric characteristics. In a method for manufacturing a semiconductor device including a thin film transistor in which an oxide semiconductor film is used for a semiconductor layer including a channel formation region, impurities such as moisture existing in the gate insulating layer are reduced before formation of the oxide semiconductor film, and then heat treatment (heat treatment for dehydration or dehydrogenation) is performed so as to improve the purity of the oxide semiconductor film and reduce impurities such as moisture. After that, slow cooling is performed in an oxygen atmosphere. Besides impurities such as moisture existing in the gate insulating layer and the oxide semiconductor film, impurities such as moisture existing at interfaces between the oxide semiconductor film and upper and lower films provided in contact therewith are reduced.

    Abstract translation: 本发明的目的是提供一种具有稳定电特性的薄膜晶体管的高度可靠的半导体器件。 在制造包括薄膜晶体管的半导体器件的方法中,其中氧化物半导体膜用于包括沟道形成区域的半导体层,在形成氧化物半导体膜之前,存在于栅极绝缘层中的诸如水分的杂质减少 ,然后进行热处理(脱水或脱氢的热处理),以提高氧化物半导体膜的纯度并减少诸如水分的杂质。 之后,在氧气氛中进行缓慢冷却。 除了存在于栅极绝缘层和氧化物半导体膜中的杂质等杂质以外,氧化物半导体膜与与其接触的上下膜之间的界面处存在的诸如水分的杂质减少。

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