DISPLAY DEVICE
    3.
    发明申请

    公开(公告)号:US20210111196A1

    公开(公告)日:2021-04-15

    申请号:US16965053

    申请日:2019-01-28

    摘要: A high-definition display device is provided. A display device with low power consumption is provided. A highly reliable display device is provided. The display device includes a first transistor and a display element electrically connected to the first transistor. The first transistor includes a first oxide, a second oxide, a first conductor, a second conductor, a third conductor, a first insulator, and a second insulator. The first conductor and the second conductor are positioned over the first oxide to be apart from each other. The first insulator is positioned over the first conductor and the second conductor and includes an opening. The opening overlaps with a portion between the first conductor and the second conductor. The third conductor is positioned in the opening. The second insulator is positioned between the third conductor, and the first oxide, the first conductor, the second conductor, and the first insulator. The second oxide is positioned between the second insulator, and the first oxide, the first conductor, the second conductor, and the first insulator.

    SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    6.
    发明申请
    SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开
    半导体基板和制造半导体器件的方法

    公开(公告)号:US20150333036A1

    公开(公告)日:2015-11-19

    申请号:US14728134

    申请日:2015-06-02

    IPC分类号: H01L23/00

    摘要: A first semiconductor substrate is used which has a structure in which a peeling layer is not formed in a section subjected to a first dividing treatment, so that the peeling layer is not exposed at the end surface of a second semiconductor substrate when the second semiconductor substrate is cut out of the first semiconductor substrate. In addition, a supporting material is provided on a layer to be peeled of the second semiconductor substrate before the second semiconductor substrate is subjected to a second dividing treatment.

    摘要翻译: 使用第一半导体基板,其具有其中在经受第一分割处理的部分中不形成剥离层的结构,使得当第二半导体基板上的剥离层不暴露在第二半导体基板的端面时 被切出第一半导体衬底。 另外,在对第二半导体衬底进行第二次分割处理之前,在要被剥离的第二半导体衬底的层上提供支撑材料。

    DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME
    7.
    发明申请
    DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    显示装置及其制造方法

    公开(公告)号:US20150303072A1

    公开(公告)日:2015-10-22

    申请号:US14790668

    申请日:2015-07-02

    摘要: An object is to provide a display device with excellent display characteristics, where a pixel circuit and a driver circuit provided over one substrate are formed using transistors which have different structures corresponding to characteristics of the respective circuits. The driver circuit portion includes a driver circuit transistor in which a gate electrode layer, a source electrode layer, and a drain electrode layer are formed using a metal film, and a channel layer is formed using an oxide semiconductor. The pixel portion includes a pixel transistor in which a gate electrode layer, a source electrode layer, and a drain electrode layer are formed using an oxide conductor, and a semiconductor layer is formed using an oxide semiconductor. The pixel transistor is formed using a light-transmitting material, and thus, a display device with higher aperture ratio can be manufactured.

    摘要翻译: 本发明的目的是提供具有优异显示特性的显示装置,其中使用具有对应于各个电路的特性的不同结构的晶体管形成设置在一个基板上的像素电路和驱动电路。 驱动器电路部分包括驱动电路晶体管,其中使用金属膜形成栅电极层,源电极层和漏电极层,并且使用氧化物半导体形成沟道层。 像素部分包括其中使用氧化物导体形成栅电极层,源电极层和漏电极层的像素晶体管,并且使用氧化物半导体形成半导体层。 像素晶体管使用透光材料形成,因此可以制造具有较高开口率的显示装置。

    SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    8.
    发明申请
    SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开
    半导体基板和制造半导体器件的方法

    公开(公告)号:US20140248744A1

    公开(公告)日:2014-09-04

    申请号:US14276239

    申请日:2014-05-13

    IPC分类号: H01L27/12 H01L21/78

    摘要: Provided is a method for manufacturing a semiconductor device, which prevents waste generation from being caused peeling of films and prevents failure of peeling from being caused by waste due to peeling of films. A first semiconductor substrate is used which has a structure in which a peeling layer is not formed in a section subjected to a first dividing treatment, so that the peeling layer is not exposed at the end surface of a second semiconductor substrate when the second semiconductor substrate is cut out of the first semiconductor substrate. In addition, a supporting material is provided on a layer to be peeled of the second semiconductor substrate before the second semiconductor substrate is subjected to a second dividing treatment.

    摘要翻译: 提供一种制造半导体器件的方法,其防止废物产生被膜剥离,并防止由于剥离而导致的剥离不会导致剥离。 使用第一半导体基板,其具有其中在经受第一分割处理的部分中不形成剥离层的结构,使得当第二半导体基板上的剥离层不暴露在第二半导体基板的端面时 被切出第一半导体衬底。 另外,在对第二半导体衬底进行第二次分割处理之前,在要被剥离的第二半导体衬底的层上提供支撑材料。

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    9.
    发明申请
    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 审中-公开
    半导体器件及其制造方法

    公开(公告)号:US20140099752A1

    公开(公告)日:2014-04-10

    申请号:US14104264

    申请日:2013-12-12

    IPC分类号: H01L29/66

    摘要: An oxide semiconductor layer with excellent crystallinity is formed to enable manufacture of transistors with excellent electrical characteristics for practical application of a large display device, a high-performance semiconductor device, etc. By first heat treatment, a first oxide semiconductor layer is crystallized. A second oxide semiconductor layer is formed over the first oxide semiconductor layer. By second heat treatment, an oxide semiconductor layer including a crystal region having the c-axis oriented substantially perpendicular to a surface is efficiently formed and oxygen vacancies are efficiently filled. An oxide insulating layer is formed over and in contact with the oxide semiconductor layer. By third heat treatment, oxygen is supplied again to the oxide semiconductor layer. A nitride insulating layer containing hydrogen is formed over the oxide insulating layer. By fourth heat treatment, hydrogen is supplied at least to an interface between the second oxide semiconductor layer and the oxide insulating layer.

    摘要翻译: 形成具有优异结晶度的氧化物半导体层,以便制造具有优异的电特性的晶体管,用于实际应用大型显示器件,高性能半导体器件等。通过第一热处理,第一氧化物半导体层被结晶。 在第一氧化物半导体层上形成第二氧化物半导体层。 通过第二热处理,有效地形成包括具有取向为基本上垂直于表面的c轴的晶体区域的氧化物半导体层,并且有效地填充氧空位。 氧化物绝缘层形成在氧化物半导体层上并与氧化物半导体层接触。 通过第三次热处理,再次向氧化物半导体层供给氧。 在氧化物绝缘层上形成含有氢的氮化物绝缘层。 通过第四热处理,至少向第二氧化物半导体层和氧化物绝缘层之间的界面供应氢。