Abstract:
A gate oxide film is formed on a surface of a semiconductor substrate. A tunnel insulating film having a thickness smaller than that of the gate insulating film is formed in a portion thereof corresponding to a tunnel region. A first silicon film having a low impurity concentration is formed on the gate insulating film. A second silicon film having an impurity concentration higher than that of the first silicon film is formed on the first silicon film so as to be connected thereto. A third silicon film is formed on the second silicon film through an insulating film. The second and third silicon films are formed into floating and control gates, respectively, thereby forming a semiconductor memory device.
Abstract:
A process for producing a semiconductor device of the type having a semiconductor substrate; a semiconductor layer disposed on the semiconductor substrate; a first element formed in a region of the semiconductor layer and having a perimeter including a bottom; a second element formed in another region of the semiconductor layer; an insulating layer surrounding the perimeter of the first element, for electrically insulating and separating the first element from the second element and the semiconductor substrate; an electrical shield layer disposed between the insulating layer and the first element, surrounding the perimeter of the first element, and adapted to a reference electric potential applied thereto, for shielding the first element from an electrical fluctuation of the semiconductor substrate caused by the second element; and an electrode for applying the reference electric potential to the electrical shield layer.
Abstract:
A semiconductor layer is disposed on a semiconductor substrate and a first element is formed in a region of the semiconductor layer. A second element is formed in another region of the semiconductor layer. An insulating layer surrounds the perimeter of the first element, for electrically insulating and separating the first element from the second element and the semiconductor substrate. An electrical shield layer surrounds the perimeter of the first element, and is adapted to a reference electric potential applied thereto, for shielding the first element from an electrical fluctuation of the semiconductor substrate caused by the second element. An electrode is provided for applying the reference electric potential to the electrical shield layer.
Abstract:
Herein disclosed is a semiconductor pressure sensor and a method of manufacture. The sensor includes a plate having a recess in its main surface. A diaphragm has a lower surface therof bonded to a first main surface of the plate and formed so as to have an upper surface having no holes therein. A piezoresistive layer is formed so as to be in contact with the diaphragm and is positioned so as to be at least partially over the recess. The resistance of the piezoresistive layer provides an indication of pressure applied to the diaphragm. The manufacturing method includes forming a piezoresistive layer of a single crystal substrate in a diaphragm without any recrystallization.
Abstract:
Disclosed is a semiconductor device which comprises a substrate, an insulating film formed at a predetermined region in the substrate or on the main surface of the substrate, a polycrystalline semiconductor layer formed on at least the insulating film, a single crystal semiconductor layer formed on at least the polycrystalline semiconductor layer, an isolation region formed to extend from the top main surface of the single crystal semiconductor layer to at least the surface of the insulating film, through the polycrystalline semiconductor layer, to electrically isolate a portion formed in the single crystal semiconductor layer surrounded by the isolation region from another portion formed in the single crystal semiconductor layer and not surrounded by the isolation region, at least a semiconductor device formed within the portion surrounded by the isolation region. This semiconductor device has an additional characteristics in that another semiconductor device using another main surface of the substrate as the electrode is provided on the surface of the substrate and the single cyrstal semiconductor layer, and the polycrystalline semiconductor layer serves to terminate the electric line of force emitted from the substrate, and therefore, the single crystal semiconductor layer mounted on the polycrystalline semiconductor layer is not affected by the electric line of force. Consequently, a semiconductor device which can operate effectively without being influenced by variations of the electric potential in the substrate can be obtained, and further, an intelligent type power device can be formed in which the power semiconductor device and the semiconductor device controlling the power device are formed in the same substrate but are completely isolated from each other.
Abstract:
In a MIS transistor device, a gate electrode is formed on a first conductivity-type well region formed in a semiconductor substrate. By implanting impurities with the gate electrode and an element-isolating region made up of a field insulating film as a mask, an N-type diffusion layer having a higher impurity concentration than the first conductivity-type well region is formed on the sides of the gate electrode. A second conductivity-type diffusion layer of a first impurity concentration higher than the N-type diffusion layer is formed with a smaller width than the N-type diffusion layer in the N-type diffusion layer formed on one side of the gate electrode. A second conductivity-type diffusion layer of a second high concentration is formed with a smaller width than the N-type diffusion layer in the N-type diffusion layer formed on the other side of the gate electrode.
Abstract:
An automotive abnormality forecasting and warning method and system for issuing a voice and visual alarm when a signal representing the condition of an automotive inspection item exceeds a predetermined value, which comprise steps of calculating the cooling water temperature change rate in variable cycles, determining a calculation cycle corresponding to the detected water temperature and the calculated change rate from a memory storing the cooling water temperature, water-temperature-change rate and calculation cycle in a predetermined relation, judging whether the detected water temperature and the calculated change rate are in a predetermined water overheat region, and issuing a voice alarm on an overheating trend in response to more than a predetermined number of the judging operations.