PROTECTIVE CLOTHING
    181.
    发明申请

    公开(公告)号:US20220167688A1

    公开(公告)日:2022-06-02

    申请号:US17617123

    申请日:2020-04-14

    Abstract: Provided is a protective clothing comprising a pair of sleeve parts and a body part, wherein one of the pair of sleeve parts comprises a part A covering an elbow joint of a wearer's right arm at the time of wearing the protective clothing, wherein the other one of the pair of sleeve parts comprises a part B covering an elbow joint of the wearer's left arm at the time of wearing the protective clothing, wherein the body part comprises a part C covering the wearer's greater pectoral muscle at the time of wearing the protective clothing, wherein the protective clothing has a first fabric having an air permeability of 30 cm3/cm2/sec or more and a second fabric having a bending resistance of 80 mm or less, wherein the first fabric is arranged on the part C and has a laminated structure of a first spunbonded non-woven fabric and a first melt-blown non-woven fabric, and wherein the second fabric is arranged on the part A and the part B and has a laminated structure of a second spunbonded non-woven fabric and a second melt-blown non-woven fabric.

    Resin composition
    182.
    发明授权

    公开(公告)号:US11347146B2

    公开(公告)日:2022-05-31

    申请号:US16329441

    申请日:2017-08-30

    Abstract: The present invention is a resin composition including (a) a resin, (b) an antioxidizing agent, and (d) a crosslinking agent, wherein the resin composition is characterized by the following: the resin (a) is formed of one or more kinds of resins selected from among polyimide precursor, polyamide, polyimide, polybenzoxazole, and copolymers thereof; and the crosslinking agent (d) includes a phenolic hydroxyl group in one molecule, and also includes a substituent group having a molecular weight of 40 or more at both ortho positions of the phenolic hydroxyl group. Provided is the resin composition by which obtained is a pattern-cured film that enables fine patterns to be obtained, that exhibits excellent in-plane pattern uniformity while being curable at a low temperature of 250° C. or less, and that retains high extensibility and high adhesion with metal wires even after a reliability evaluation which is an actual-use accelerated test.

    FIBER-REINFORCED RESIN BASE MATERIAL

    公开(公告)号:US20220162408A1

    公开(公告)日:2022-05-26

    申请号:US17441930

    申请日:2020-03-17

    Abstract: A fiber-reinforced resin base material includes continuous reinforcing fibers or a reinforcing fiber base material in which discontinuous fibers are dispersed, the continuous reinforcing fibers or a reinforcing fiber base material being impregnated with a polyphenylene sulfide resin composition, wherein the fiber-reinforced resin base material has a glass-transition temperature, as measured by the DMA method (bending mode), of 115° C. or higher.

    METHOD OF MANUFACTURING CATHETER AND CATHETER MANUFACTURED BY THE METHOD

    公开(公告)号:US20220160422A1

    公开(公告)日:2022-05-26

    申请号:US17440864

    申请日:2020-03-27

    Abstract: A method of producing a catheter includes a step of arranging a lead wire in the lumen of a thermoplastic outer-layer tube such that the lead wire extends in the longitudinal direction of the outer-layer tube; a step of exposing one end of the lead wire out of an opening of the outer-layer tube; a step of joining the one end of the lead wire exposed out of the opening with the inner wall of a ring electrode; a step of covering the opening of the outer-layer tube with the ring electrode; an step of inserting a thermoplastic inner-layer tube in the lumen of the outer-layer tube; and an integrating step of heating the outer-layer tube and the inner-layer tube to integrate the outer-layer and the inner-layer tubes to form an electrode tip such that the lead wire is interlaminarly embedded and fixed between the outer-layer and the inner-layer tubes.

    n-TYPE SEMICONDUCTOR ELEMENT, METHOD FOR PRODUCING n-TYPE SEMICONDUCTOR ELEMENT, WIRELESS COMMUNICATION DEVICE, AND PRODUCT TAG

    公开(公告)号:US20220158098A1

    公开(公告)日:2022-05-19

    申请号:US17441349

    申请日:2020-03-06

    Abstract: An object of the present invention is to provide a n-type semiconductor element having improved n-type semiconductor characteristics and excellent stability with a convenient process, where the n-type semiconductor element includes: a substrate; a source electrode, a drain electrode, and a gate electrode; a semiconductor layer in contact with the source electrode and the drain electrode; a gate insulating layer for insulating the semiconductor layer from the gate electrode; and a second insulating layer positioned on the opposite side of the semiconductor layer from the gate insulating layer and in contact with the semiconductor layer, where the semiconductor layer contains nanocarbon, and the second insulating layer contains (a) a compound with an ionization potential in vacuum of 7.0 eV or less, and (b) a polymer.

    PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN SHEET, METHOD FOR PRODUCING HOLLOW STRUCTURE, AND ELECTRONIC COMPONENT

    公开(公告)号:US20220155684A1

    公开(公告)日:2022-05-19

    申请号:US17442236

    申请日:2020-03-18

    Abstract: A photosensitive resin composition according to the present invention is a photosensitive resin composition comprising (a) an alkali-soluble polyimide, (b) an unsaturated bond-containing compound, (c) a thermally crosslinkable compound, (d-1) a photobleaching photopolymerization initiator having the structure represented by general formula (1), and (d-2) a photopolymerization initiator having the structure represented by general formula (1) and having a molar extinction coefficient at a wavelength of 405 nm of at least 1000 L/(mol·cm). (In general formula (1), R1 represents a halogen atom, hydroxy group, carboxy group, nitro group, cyano group, —NR3R4, C1-20 monovalent hydrocarbon group, C1-20 acyl group, or C1-20 alkoxy group, and R3 and R4 each independently represent a hydrogen atom or C1-10 alkyl group, provided that at least a portion of the hydrogen atoms in the hydrocarbon group, acyl group, and alkoxy group may be substituted by a halogen atom, hydroxy group, carboxy group, nitro group, cyano group, or —NR3R4, and a hydrocarbon group present in the hydrocarbon group, in the acyl group, or in the alkoxy group may be interrupted by an ether bond, thioether bond, ester bond, thioester bond, amide bond, or urethane bond. R2 represents a C1-5 alkyl group. The symbol * in the formula indicates bonding with a neighboring group via the * moiety.) The photosensitive resin composition according to the present invention is also a photosensitive resin composition comprising (a) an alkali-soluble polyimide, (b) an unsaturated bond-containing compound, (c) a thermally crosslinkable compound, and (d) at least two species of oxime ester-type photopolymerization initiators. The photosensitive resin composition according to the present invention enables a high-sensitivity, high-quality photographic patterning of the cap portion of a hollow structure. A photosensitive resin sheet that uses the photosensitive resin composition according to the present invention is useful for application to the cap of the hollow structure of an electronic component that includes a hollow structure.

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