Device fabrication method for a non-volatile memory device used for non-overlapping implant
    181.
    发明授权
    Device fabrication method for a non-volatile memory device used for non-overlapping implant 有权
    用于非重叠植入物的非易失性存储器件的器件制造方法

    公开(公告)号:US06300200B1

    公开(公告)日:2001-10-09

    申请号:US09750081

    申请日:2000-12-29

    Applicant: Ching-Yu Chang

    Inventor: Ching-Yu Chang

    CPC classification number: H01L27/1126 H01L27/112

    Abstract: A method of fabricates a non-volatile ROM device on a semiconductor substrate with a plurality of parallel buried bit lines, a gate oxide layer above the substrate and word lines formed above the gate oxide layer comprises: forming a dielectric layer over the word lines and gate oxide layer, forming and pattern first photoresist layer over the dielectric layer, etching the dielectric layer, stripping the first photoresist layer, forming and pattern second photoresist layer over the dielectric layer to develop an opening area for ion implantation, ion implanting a code implant dopant through the opening area down into the substrate and stripping the second photoresist layer.

    Abstract translation: 一种在具有多个并行掩埋位线的半导体衬底上制造非易失性ROM器件的方法,在衬底上方的栅氧化层和形成在栅氧化层上方的字线​​包括:在字线之上形成介电层, 栅极氧化物层,在电介质层上形成和图案化第一光致抗蚀剂层,蚀刻电介质层,剥离第一光致抗蚀剂层,在电介质层上形成和图案化第二光致抗蚀剂层,以形成用于离子注入的开口区域, 掺杂剂通过开口区域向下进入衬底并剥离第二光致抗蚀剂层。

    Apparatus and method for developing process
    182.
    发明授权
    Apparatus and method for developing process 有权
    开发过程的装置和方法

    公开(公告)号:US09256133B2

    公开(公告)日:2016-02-09

    申请号:US13548557

    申请日:2012-07-13

    Applicant: Ching-Yu Chang

    Inventor: Ching-Yu Chang

    CPC classification number: G03F7/3021 G03F7/30

    Abstract: An apparatus includes at least two tanks, at least two pumps, at least one nozzle, and a chuck. The apparatus provides multiple developers with different polarities during a developing process to target portions of a latent resist profile having different polarities, and thus different solubility. This apparatus also allows a mixture of two developers to be used for the resist film developing. A polarity of the mixture is adjustable by controlling a ratio of one pump flow rate to another pump flow rate and further controlling the resist pattern profile.

    Abstract translation: 一种装置包括至少两个罐,至少两个泵,至少一个喷嘴和卡盘。 该装置在显影过程中提供具有不同极性的多个显影剂,以靶向具有不同极性的潜像抗蚀剂图案的部分,因此具有不同的溶解度。 该装置还允许将两种显影剂的混合物用于抗蚀剂膜显影。 通过控制一个泵流量与另一个泵流量的比率并进一步控制抗蚀剂图形轮廓,可以调节混合物的极性。

    Cut-mask patterning process for fin-like field effect transistor (FinFET) device
    183.
    发明授权
    Cut-mask patterning process for fin-like field effect transistor (FinFET) device 有权
    鳍状场效应晶体管(FinFET)器件的切割掩模图案化工艺

    公开(公告)号:US09236267B2

    公开(公告)日:2016-01-12

    申请号:US13369818

    申请日:2012-02-09

    Abstract: A method for patterning a plurality of features in a non-rectangular pattern, such as on an integrated circuit device, includes providing a substrate including a surface with a plurality of elongated protrusions, the elongated protrusions extending in a first direction. A first layer is formed above the surface and above the plurality of elongated protrusions, and patterned with an end cutting mask. The end cutting mask includes two nearly-adjacent patterns with a sub-resolution feature positioned and configured such that when the resulting pattern on the first layer includes the two nearly adjacent patterns and a connection there between. The method further includes cutting ends of the elongated protrusions using the pattern on the first layer.

    Abstract translation: 用于图案化非矩形图案中的多个特征的方法,例如在集成电路器件上,包括提供包括具有多个细长突起的表面的基底,所述细长突起沿第一方向延伸。 第一层形成在多个细长突起的表面上方和上方,并用端部切割掩模图案化。 末端切割掩模包括两个几乎相邻的图案,其具有定位和配置的次分辨率特征,使得当第一层上的所得图案包括两个近似相邻的图案时,以及其间的连接。 该方法还包括使用第一层上的图案切割细长突起的端部。

    Lithography material and lithography process
    184.
    发明授权
    Lithography material and lithography process 有权
    光刻材料和光刻工艺

    公开(公告)号:US09122164B2

    公开(公告)日:2015-09-01

    申请号:US13111534

    申请日:2011-05-19

    Applicant: Ching-Yu Chang

    Inventor: Ching-Yu Chang

    CPC classification number: G03F7/2041 G03F7/0046

    Abstract: An immersion lithography resist material comprising a matrix polymer having a first polarity and an additive having a second polarity that is substantially greater than the first polarity. The additive may have a molecular weight that is less than about 1000 Dalton. The immersion lithography resist material may have a contact angle that is substantially greater than the contact angle of the matrix polymer.

    Abstract translation: 一种浸没式光刻抗蚀剂材料,包括具有第一极性的基质聚合物和具有基本上大于第一极性的第二极性的添加剂。 添加剂可以具有小于约1000道尔顿的分子量。 浸没式光刻抗蚀剂材料可具有基本上大于基质聚合物的接触角的接触角。

    Immersion lithography system using a sealed wafer bath
    185.
    发明授权
    Immersion lithography system using a sealed wafer bath 有权
    浸没光刻系统使用密封晶圆槽

    公开(公告)号:US09046789B2

    公开(公告)日:2015-06-02

    申请号:US13595734

    申请日:2012-08-27

    CPC classification number: G03F7/70866 G03F7/70341

    Abstract: Immersion lithography system and method using a sealed wafer bottom are described. One embodiment is an immersion lithography apparatus comprising a lens assembly comprising an imaging lens and a wafer stage for retaining a wafer beneath the lens assembly, the wafer stage comprising a seal ring disposed on a seal ring frame along a top edge of the wafer retained on the wafer stage, the seal ring for sealing a gap between an edge of the wafer and the wafer stage. The embodiment further includes a fluid tank for retaining immersion fluid, the fluid tank situated with respect to the wafer stage for enabling full immersion of the wafer retained on the wafer stage in the immersion fluid and a cover disposed over at least a portion of the fluid tank for providing a temperature-controlled, fluid-rich environment within the fluid tank fluid-rich environment within the fluid tank.

    Abstract translation: 描述了浸没光刻系统和使用密封晶片底部的方法。 一个实施例是一种浸没光刻设备,其包括透镜组件,该透镜组件包括成像透镜和用于将晶片保持在透镜组件下方的晶片台,晶片台包括沿着晶片的顶部边缘设置在密封环框架上的密封环, 晶片台,用于密封晶片边缘与晶片台之间的间隙的密封环。 该实施例还包括用于保持浸没流体的流体箱,相对于晶片台定位的流体箱,用于使保留在晶片台上的晶片完全浸没在浸没流体中,并且覆盖设置在流体的至少一部分上 罐,用于在流体箱内的流体槽流体富含环境内提供温度控制的,富含流体的环境。

    Patterning process for fin-like field effect transistor (finFET) device
    186.
    发明授权
    Patterning process for fin-like field effect transistor (finFET) device 有权
    鳍状场效应晶体管(finFET)器件的图案化处理

    公开(公告)号:US08741776B2

    公开(公告)日:2014-06-03

    申请号:US13368144

    申请日:2012-02-07

    CPC classification number: H01L21/845 G03F1/00 H01L21/823431

    Abstract: A method for patterning a plurality of features in a non-rectangular pattern on an integrated circuit device includes providing a substrate including a surface with a first layer and a second layer. Forming a plurality of elongated protrusions in a third layer above the first and second layers. Forming a first patterned layer over the plurality of elongated protrusions. The plurality of elongated protrusions are etched to form a first pattern of the elongated protrusions, the first pattern including at least one inside corner. Forming a second patterned layer over the first pattern of elongated protrusions and forming a third patterned layer over the first pattern of elongated protrusions. The plurality of elongated protrusions are etched using the second and third patterned layers to form a second pattern of the elongated protrusions, the second pattern including at least one inside corner.

    Abstract translation: 用于在集成电路器件上以非矩形图案形成多个特征的方法包括提供包括具有第一层和第二层的表面的衬底。 在第一层和第二层上方的第三层中形成多个细长突起。 在多个细长突起上形成第一图案层。 多个细长突起被蚀刻以形成细长突起的第一图案,第一图案包括至少一个内角。 在细长突起的第一图案上形成第二图案化层,并在细长突起的第一图案上形成第三图案化层。 使用第二和第三图案化层来蚀刻多个细长突起,以形成细长突起的第二图案,第二图案包括至少一个内角。

    Method and material for forming a double exposure lithography pattern
    187.
    发明授权
    Method and material for forming a double exposure lithography pattern 有权
    用于形成双曝光光刻图案的方法和材料

    公开(公告)号:US08658532B2

    公开(公告)日:2014-02-25

    申请号:US13599143

    申请日:2012-08-30

    Applicant: Ching-Yu Chang

    Inventor: Ching-Yu Chang

    Abstract: Various lithography methods are disclosed. An exemplary lithography method includes forming a first patterned silicon-containing organic polymer layer over a substrate by removing a first patterned resist layer, wherein the first patterned silicon-containing organic polymer layer includes a first opening having a first dimension and a second opening having the first dimension, the first opening and the second opening exposing the substrate; forming a second patterned silicon-containing organic polymer layer over the substrate by removing a second patterned resist layer, wherein a portion of the patterned second silicon-containing organic polymer layer combines with a portion of the first patterned silicon-containing organic polymer layer to reduce the first dimension of the second opening to a second dimension; and etching the substrate exposed by the first opening having the first dimension and the second opening having the second dimension.

    Abstract translation: 公开了各种光刻方法。 示例性光刻方法包括通过去除第一图案化抗蚀剂层在衬底上形成第一图案化的含硅有机聚合物层,其中第一图案化含硅有机聚合物层包括具有第一尺寸的第一开口和具有第一开口的第二开口, 第一尺寸,第一开口和第二开口暴露衬底; 通过去除第二图案化的抗蚀剂层在衬底上形成第二图案化的含硅有机聚合物层,其中图案化的第二含硅有机聚合物层的一部分与第一图案化的含硅有机聚合物层的一部分结合以减少 第二开口的第一尺寸到第二尺寸; 并且蚀刻由具有第一尺寸的第一开口暴露的基板和具有第二尺寸的第二开口。

    APPARATUS AND METHOD FOR DEVELOPING PROCESS
    188.
    发明申请
    APPARATUS AND METHOD FOR DEVELOPING PROCESS 有权
    发展过程的装置和方法

    公开(公告)号:US20140017616A1

    公开(公告)日:2014-01-16

    申请号:US13548557

    申请日:2012-07-13

    Applicant: Ching-Yu Chang

    Inventor: Ching-Yu Chang

    CPC classification number: G03F7/3021 G03F7/30

    Abstract: An apparatus includes at least two tanks, at least two pumps, at least one nozzle, and a chuck. The apparatus provides multiple developers with different polarities during a developing process to target portions of a latent resist profile having different polarities, and thus different solubility. This apparatus also allows a mixture of two developers to be used for the resist film developing. A polarity of the mixture is adjustable by controlling a ratio of one pump flow rate to another pump flow rate and further controlling the resist pattern profile.

    Abstract translation: 一种装置包括至少两个罐,至少两个泵,至少一个喷嘴和卡盘。 该装置在显影过程中提供具有不同极性的多个显影剂,以靶向具有不同极性的潜像抗蚀剂图案的部分,因此具有不同的溶解度。 该装置还允许将两种显影剂的混合物用于抗蚀剂膜显影。 通过控制一个泵流量与另一个泵流量的比率并进一步控制抗蚀剂图案轮廓,可以调节混合物的极性。

    MATERIALS AND METHODS FOR IMPROVED PHOTORESIST PERFORMANCE
    189.
    发明申请
    MATERIALS AND METHODS FOR IMPROVED PHOTORESIST PERFORMANCE 有权
    改进光电性能的材料和方法

    公开(公告)号:US20140011133A1

    公开(公告)日:2014-01-09

    申请号:US13542160

    申请日:2012-07-05

    CPC classification number: G03F7/0045 G03F7/0163 G03F7/0382 G03F7/0392

    Abstract: A photosensitive material and methods of making a pattern on a substrate are disclosed. The photosensitive material includes a polymer that turns soluble to a developer solution after a chemically amplified reaction, and at least one chemical complex having a single diffusion length. The material includes at least one photo-acid generator (PAG) linked to at least one photo decomposable base (PDB) or quencher.

    Abstract translation: 公开了一种感光材料和在衬底上制作图案的方法。 感光材料包括在化学放大反应后可溶于显影剂溶液的聚合物,以及具有单个扩散长度的至少一种化学复合物。 该材料包括至少一种与至少一种可光分解碱(PDB)或猝灭剂连接的光酸产生剂(PAG)。

    Surface switchable photoresist
    190.
    发明授权
    Surface switchable photoresist 有权
    表面可切割光致抗蚀剂

    公开(公告)号:US08518628B2

    公开(公告)日:2013-08-27

    申请号:US11534289

    申请日:2006-09-22

    CPC classification number: G03F7/2041 G03F7/0382 G03F7/0392 G03F7/168

    Abstract: A material is provided for use in an immersion lithographic process of a semiconductor substrate. The material includes a photo-sensitive polymer configured to turn soluble to a base solution in response to reaction with an acid and at least one of either a base soluble polymer or an acid labile polymer. The base soluble polymer is configured to turn soluble to water in response to reaction with a developer solution. The acid labile polymer is configured to turn soluble to water after releasing a leaving group in reaction to the acid.

    Abstract translation: 提供了用于半导体衬底的浸没式光刻工艺中的材料。 该材料包括光敏聚合物,其被配置为响应于与酸和碱溶性聚合物或酸不稳定聚合物中的至少一种而发生反应而转化为碱溶液。 基础可溶性聚合物被配置为响应于与显影剂溶液的反应而使水溶解。 酸不稳定聚合物被配置成在释放离去基团以反应酸之后将其溶于水。

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