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公开(公告)号：US10432167B2
公开(公告)日：2019-10-01
申请号：US15088814
申请日：2016-04-01
Applicant: Intel Corporation
Inventor： Adel A. Elsherbini , Feras Eid , Baris Bicen , Telesphor Kamgaing , Vijay K. Nair , Johanna M. Swan , Georgios C. Dogiamis , Valluri R. Rao
Abstract: Embodiments of the invention include a piezoelectric resonator which includes an input transducer having a first piezoelectric material, a vibrating structure coupled to the input transducer, and an output transducer coupled to the vibrating structure. In one example, the vibrating structure is positioned above a cavity of an organic substrate. The output transducer includes a second piezoelectric material. In operation the input transducer causes an input electrical signal to be converted into mechanical vibrations which propagate across the vibrating structure to the output transducer.
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公开(公告)号：US20190198961A1
公开(公告)日：2019-06-27
申请号：US16329587
申请日：2016-09-30
Applicant: Intel Corporation
Inventor： Aleksandar Aleksov , Georgios C. Dogiamis , Telesphor Kamgaing , Sasha N. Oster , Adel A. Elsherbini , Shawna M. Liff , Johanna M. Swan , Brandon M. Rawlings , Richard J. Dischler
CPC classification number: H01P3/16 , H01P3/122 , H01P11/002 , H01P11/006 , H01Q9/045 , H04L67/10
Abstract: A method of forming a waveguide comprises forming an elongate waveguide core including a dielectric material; and arranging a conductive sheet around an outside surface of the dielectric core to produce a conductive layer around the waveguide core.
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公开(公告)号：US10326211B2
公开(公告)日：2019-06-18
申请号：US15453327
申请日：2017-03-08
Applicant: Intel Corporation
Inventor： Telesphor Kamgaing , Adel Elsherbini
Abstract: Embodiments described herein generally relate to phased array antenna systems or packages and techniques of making and using the systems and packages. A phased array antenna package may include a distributed phased array antenna comprising (1) a plurality of antenna sub-arrays, which may each include a plurality of antennas, (2) a plurality of Radio Frequency Dies (RFDs), each of the RFDs located proximate and electrically coupled by a trace of a plurality of traces to a corresponding antenna sub-array of the plurality of antenna sub-arrays, and (3) wherein each trace of the plurality of traces configured to electrically couple an antenna of the plurality of antennas to the RFD located proximate the antenna, wherein each trace of the plurality of traces is configured to transmit millimeter wave (mm-wave) radio signals, and wherein the plurality of traces are each of a substantially uniform length.
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公开(公告)号：US10263346B2
公开(公告)日：2019-04-16
申请号：US15197531
申请日：2016-06-29
Applicant: INTEL CORPORATION
Inventor： Telesphor Kamgaing , Adel A. Elsherbini
IPC: H01Q21/29 , H01Q3/24 , H01Q3/26 , H01Q15/08 , H01Q21/06 , H01Q23/00 , H01Q25/00 , H01P11/00 , H01Q1/50 , H01Q1/36
Abstract: Embodiments of the present disclosure are directed to a single-package communications device that includes an antenna module with a plurality of independently selectable arrays of antenna elements. The antenna elements of the different arrays may send and/or receive data signals over different ranges of signal angles. The communications device may further include a switch module to separately activate the individual arrays. In some embodiments, a radio frequency (RF) communications module may be included in the package of the communications device. In some embodiments, the RF communications module may be configured to communicate over a millimeter-wave (mm-wave) network using the plurality of arrays of antenna elements.
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公开(公告)号：US10256286B2
公开(公告)日：2019-04-09
申请号：US15589981
申请日：2017-05-08
Applicant: INTEL CORPORATION
Inventor： Andreas Duevel , Telesphor Kamgaing , Valluri R. Rao , Uwe Zillmann
IPC: H01F5/00 , H01F27/06 , G09G5/00 , H01L49/02 , H01F7/06 , H01L23/48 , H01L23/522 , H01F17/00 , H01L21/768 , H01L27/06 , H01L27/08
Abstract: A three-dimensional inductor is formed in an integrated circuit die using conductive through-body-vias which pass through the body of the die and contact one or more metal interconnect layers on the front side of the die and terminate on the back side of the die. In another embodiment, the through-body-vias may pass through a dielectric material disposed in a plug in the body of the die. In yet another aspect, a transformer may be formed by coupling multiple inductors formed using through-body-vias. In still another aspect, a three-dimensional inductor may include conductors formed of stacks of on chip metallization layers and conductive through-layer-vias disposed in insulation layers between metallization layers. Other embodiments are described.
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Patent Agency Ranking
公开(公告)号：US10211970B2
公开(公告)日：2019-02-19
申请号：US15475827
申请日：2017-03-31
Applicant: INTEL CORPORATION
Inventor： Telesphor Kamgaing , Georgios C. Dogiamis , Sasha N. Oster
IPC: H04B10/00 , H04L7/00 , H04L7/033 , H04B10/61 , H04B10/548
Abstract: The present disclosure is directed to systems and methods for communicating between rack mounted devices disposed in the same or different racks separated by distances of less than a meter to a few tens of meters. The system includes a CMOS first mm-wave engine that includes mm-wave transceiver circuitry, mm-wave MODEM circuitry, power distribution and control circuitry, and a mm-wave waveguide connector. The CMOS first mm-wave engine communicably couples to a CMOS second mm-wave engine that also includes mm-wave transceiver circuitry, mm-wave MODEM circuitry, power distribution and control circuitry, and a mm-wave waveguide connector. In some implementations, at least a portion of the mm-wave transceiver circuitry may be fabricated using III-V semiconductor manufacturing methods. The use of mm-wave communication techniques beneficially improves data integrity and increases achievable datarates, and reduces power costs.
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公开(公告)号：US10147997B2
公开(公告)日：2018-12-04
申请号：US15445618
申请日：2017-02-28
Applicant: INTEL CORPORATION
Inventor： Telesphor Kamgaing
Abstract: A high performance antenna incorporated on a microelectronic substrate by forming low-loss dielectric material structures in the microelectronic substrates and forming the antenna on the low-loss dielectric material structures. The low-loss dielectric material structures may be fabricated by forming a cavity in a build-up layer of the microelectronic substrate and filling the cavity with a low-loss dielectric material.
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公开(公告)号：US20180191049A1
公开(公告)日：2018-07-05
申请号：US15394990
申请日：2016-12-30
Applicant: INTEL CORPORATION
Inventor： Telesphor Kamgaing , Georgios C. Dogiamis , Sasha N. Oster
Abstract: Radio frequency (RF) data transfer between components in rack mounted systems is facilitated through the use of dielectric waveguides and millimeter Wave (mm-Wave) transceivers. A signal generator provides one or more data signals to a serializer/deserializer (SERDES) which serializes a plurality of parallel data signals to produce a single, serialized, signal containing data from each of the input signals to the SERDES. A mm-Wave die upconverts the serialized signal to a mm-Wave signal and a mm-Wave launcher launches the signal into the dielectric waveguide. At the receiving end the process is reversed such that the mm-Wave signal is first downconverted and passed through a SERDES to provide the original one or more signals to a recipient signal generator. Some or all of the components may be formed directly in the semiconductor package.
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公开(公告)号：US09921640B2
公开(公告)日：2018-03-20
申请号：US13631092
申请日：2012-09-28
Applicant: INTEL CORPORATION
Inventor： Uwe Zillmann , Andre Schaefer , Ruchir Saraswat , Telesphor Kamgaing , Paul B. Fischer , Guido Droege
CPC classification number: G06F1/3296 , H01L2924/0002 , H05K1/0262 , H05K1/165 , Y02D10/172 , Y10T29/4913 , H01L2924/00
Abstract: Magnetically enhanced inductors integrated with microelectronic devices at chip-level. In embodiments, magnetically enhanced inductors include a through substrate vias (TSVs) with fill metal to carry an electrical current proximate to a magnetic layer disposed on a substrate through which the TSV passes. In certain magnetically enhanced inductor embodiments, a TSV fill metal is disposed within a magnetic material lining the TSV. In certain magnetically enhanced inductor embodiments, a magnetically enhanced inductor includes a plurality of interconnected TSVs disposed proximate to a magnetic material layer on a side of a substrate. In embodiments, voltage regulation circuitry disposed on a first side of a substrate is integrated with one or more magnetically enhanced inductors utilizing a TSV passing through the substrate. In further embodiments, integrated circuitry on a same substrate as the magnetically enhanced inductor, or on another substrate stacked thereon, completes the VR and/or is powered by the VR circuitry.
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公开(公告)号：US09647636B1
公开(公告)日：2017-05-09
申请号：US15088825
申请日：2016-04-01
Applicant: Intel Corporation
Inventor： Adel A. Elsherbini , Telesphor Kamgaing , Feras Eid , Vijay K. Nair , Georgios C. Dogiamis , Johanna M. Swan , Valluri R. Rao
CPC classification number: G06K7/10297 , G06K7/10316 , G06K19/0672 , G06K19/0675 , H03H9/30
Abstract: Embodiments of the invention include delay line circuitry that is integrated with an organic substrate. Organic dielectric material and a plurality of conductive layers form the organic substrate. The delay line circuitry includes a piezoelectric transducer to receive a guided electromagnetic wave signal and to generate an acoustic wave signal to be transmitted with an acoustic transmission medium. An acoustic reflector is communicatively coupled to the acoustic transmission medium. The acoustic reflector receives a plurality of acoustic wave signals from the acoustic transmission medium and reflects acoustic wave signals to the piezoelectric transducer using the acoustic transmission medium. The transducer converts the reflected acoustic signals into electromagnetic waves which are then transmitted back through the antenna and decoded by the reader.
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