Abstract:
A MOS technology power device comprises a semiconductor material layer of a first conductivity type, a plurality of elementary functional units, a first insulating material layer placed above the semiconductor material layer and a conductive material layer placed above the first insulating material layer. Each elementary functional unit includes an elongated body region of a second conductivity type formed in the semiconductor material layer. Each elementary functional unit further includes a first elongated window in the conductive material layer extending above the elongated body region. Each elongated body region includes a source region doped with dopants of the first conductivity type, intercalated with a portion of the elongated body region wherein no dopant of the first conductivity type are provided. The MOS technology power device further includes a second insulating material layer disposed above the conductive material layer and disposed along elongated edges of the first elongated window. The second insulating material layer includes a second elongated window extending above each elongated body region. The second insulating material layer seals the edges of the conductive material layer from a source metal layer disposed over the second insulating material layer. The source metal layer contacts each body region and each source region through each second elongated window along the length of the elongated body region.
Abstract:
A process for the manufacturing of an integrated circuit having DMOS-technology power devices and non-volatile memory cells provides for forming respective laterally displaced isolated semiconductor regions, electrically insulated from each other and from a common semiconductor substrate, inside which the devices will be formed; forming conductive gate regions for the DMOS-technology power devices and for the memory cells over the respective isolated semiconductor regions. Inside the isolated semiconductor regions for the DMOS-technology power devices, channel regions extending under the insulated gate regions are formed. The channel regions are formed by an implantation of a dopant along directions tilted of a prescribed angle with respect to a direction orthogonal to a top surface of the integrated circuit, in a dose and with an energy such that the channel regions are formed directly after the implantation of the dopant without performing a thermal diffusion at a high temperature of the dopant.
Abstract:
The present invention is a monolithically integrated programmable device having elementary modules connected electrically by means of memory cells of the flash type, which cells allow the signal paths between signal lines of the elementary modules to be programmed and re-programmed. Preferably, the flash memory cells are Fowler-Nordheim Effect cells.
Abstract:
In a storage device of the multi-level type, comprising a plurality of memory cells addressable through an address input each cell being adapted for storing more than one binary information element in a MOS transistor which has a control gate, and a floating gate for storing electrons to modify the threshold voltage of the transistor, and comprising a circuit enabling a Direct Memory Access (DMA) mode for directly accessing the memory cells from outside the device, the memory cells are programmed in the direct memory access mode by controlling, from outside the device, the amount of charge stored into the floating gate of each transistor.
Abstract:
In a switched operational amplifier including a differential input stage and at least a second output stage, the compensation capacitor commonly required to couple the output node of the second stage with the respective output node of the input differential stage of the amplifier is associated with a switching circuit. The switching circuit is controlled by the same control phase that enables/disables the amplifier for interrupting the connection between the compensation capacitor (CC) and the output node of the differential input stage during a phase in which the amplifier is disabled for reducing the switch-on time. Notably the differential input stage of the operational amplifier remains always active and only the second output stage is switched on and off.
Abstract:
A timing circuit for reading from a device comprising multi-level non-volatile memory cells, which circuit comprises a single programmable delay block connected to an input terminal for memory address line transition signals. The delay block drives a counter which feedback controls the discharge through a combinational logic circuit connected to the output terminal of the programmable delay block. A logic output circuit, connected to the output terminal of the delay block and to the counter, generates the timing signals.
Abstract:
The present invention relates to an integrated circuit adapted to perform the function of a diode of the DIAC type, the circuit having an input terminal and an output terminal. The circuit includes a first input transistor having a first terminal connected to a fixed voltage reference, a second terminal, and a control terminal coupled to the input terminal of the circuit. The circuit further includes second and third transistors in a current mirror configuration, each having a first terminal for coupling to the input terminal of the circuit, and a second terminal, and associated control terminals connected together and coupled to the second terminal of the first input transistor, the second terminal of the second transistor being connected to the control terminal of the first transistor. Finally, the circuit includes a fourth output transistor connected, with first and second terminals, between the output terminal and the input terminal of the circuit, the fourth output transistor also having a control terminal connected to the second terminal of the third transistor.
Abstract:
A read circuit for semiconductor memory cells, comprising first and second active elements coupled to a supply line via at least a first switch, wherein the first and second active elements are respectively connected, at first and second circuit nodes, respectively, to a first transistor through which the active elements are coupled to a ground. These first and second circuit nodes are also connected to ground through first and second capacitive elements, respectively, each having a switch connected in parallel to the capacitive element.
Abstract:
A process for the formation of a device edge morphological structure for protecting and sealing peripherally an electronic circuit integrated in a major surface of a substrate of semiconductor material includes formation above an intermediate process structure of a dielectric multilayer comprising a layer of amorphous planarizing material. The process also includes the partial removal of the dielectric multilayer so as to create at least one peripheral termination of the multilayer in the device edge morphological structure. Removal of the dielectric multilayer requires that the peripheral termination thereof be located in a zone of the intermediate process structure relatively higher than the level of the major surface, if compared with adjacent zones of the intermediate structure itself at least internally toward the circuit and in so far as to the device edge morphological structure.
Abstract:
A staircase adaptive voltage generator circuit comprising a first capacitor connected between a first voltage reference and an output operational amplifier, through first and second switches, respectively. The terminals of the capacitor are also connected to a second voltage reference through third and fourth switches, respectively. A second capacitor, in series with a fifth switch, is connected in parallel to the first capacitor.