Abstract:
A non-volatile memory device includes an array of memory cells organized into a plurality of array sectors, with each array sector being singularly addressable through an array wordline. An array of reference cells is addressable through a reference wordline. A respective voltage ramp generator is provided for each array sector for generating a voltage ramp on an array wordline for reading a memory cell therein, and is provided for each array of reference cells for generating a voltage ramp on a reference wordline for a reference cell therein. A respective row decoding circuit is coupled between each respective volage ramp generator and corresponding reference wordline or array wordline. A current generator generates a current to be injected on a circuit node in a selected array sector and on a circuit node of the array of reference cells to produce on the circuit nodes a voltage ramp similar to the generated voltage ramp. A respective local ramp generating circuit is prtovided for each array sector and for the array of reference cells, and delivering a charge current based upon a capacitance of the circuit nodes of the corresponding addressed array wordline or reference wordline, towards the respective row decoder of the wordline.
Abstract:
A non-volatile memory electronic device is integrated on a semiconductor with an architecture including at least one memory matrix organized in rows or word lines and columns or bit lines of memory cells. The matrix is divided into at least a first and a second memory portions having a different access speed. The first and second memory portions may share the structures of the bit lines which correspond to one another and one by one and are electrically interrupted by controlled switches placed between the first and the second portions.
Abstract:
A phase-change memory device, wherein memory cells form a memory array arranged in rows and columns. The memory cells are formed by a MOS selection device and a phase-change region connected to the selection device. The selection device is formed by first and second conductive regions which extend in a semiconductor substrate and are spaced from one another via a channel region, and by an isolated control region connected to a respective row and overlying the channel region. The first conductive region is connected to a connection line extending parallel to the rows, the second conductive region is connected to the phase-change region, and the phase-change region is connected to a respective column. The first connection line is a metal interconnection line and is connected to the first conductive region via a source-contact region made as point contact and distinct from the first connection line.
Abstract:
A memory device has an array of memory cells. A column decoder is configured to address the memory cells. A charge-pump supply circuit generates a boosted supply voltage for the column decoder. A connecting stage is arranged between the supply circuit and the column decoder. The connecting stage switches between a high-impedance state and a low-impedance state, and is configured to switch into the high-impedance state in given operating conditions of the memory device, in particular during a reading step.
Abstract:
A method manufactures a non-volatile memory device on a semiconductor substrate that includes a matrix of memory cells and associated circuitry. The method includes: forming a filling dielectric layer on the whole substrate until gates of the cells and a conductive layer of the circuitry are completely covered, removing the dielectric layer until upper portions of the gates of the cells and the conductive layer are exposed, defining a plurality of gate electrodes of the transistors of the circuitry in the conductive layer, and forming source and drain regions of the transistors of the circuitry in the substrate. The method also comprises: forming spacers on side walls of gate electrodes of the transistors of the circuitry, and forming a silicide layer on the electrodes of the cells, on the gate electrodes of the transistors of the circuitry and on the source and drain regions of the transistors of said circuitry.
Abstract:
A memory cell includes a memory element and a selection element coupled to said memory element. The selection element includes a first junction portion, having a first type of conductivity, and a second junction portion, having a second type of conductivity and forming a rectifying junction with the first junction portion. The first junction portion and the second junction portion are made of materials selected in the group consisting of: chalcogenides and conducting polymers.
Abstract:
A Design Failure Mode Effect Analysis (DFMEA) method analyzes faults and failures in the design phase of electronic devices. A data-entry mask is used for recording some information concerning the performed analysis and a portion of the recording form is displayed to a user in an electronic display format. The method detects and records past design problems and their corresponding solutions, by a DFMEA method using the data-entry mask form; associates keywords in a database with each problem; associates data concerning each of the design problems, in the same database, including information concerning past fails occurred in similar applications; detects major changes and/or innovations, as well as any improved block or part of a new device with respect to other devices, thereby postulating possible new problems introduced by the new device; and records the new problems and their possible solutions, by the DFMEA method and using the form.
Abstract:
A crosspoint memory includes a shared address line. The shared address line may be coupled to cells above and below the address line in one embodiment. Voltage biasing may be utilized to select one cell, and to deselect another cell. In this way, each cell may be made up of a selection device and a crosspoint memory element in the same orientation. This may facilitate manufacturing and reduce costs in some embodiments.
Abstract:
A method for controlling the power factor of a power supply line is described, the method using a power factor control cell connected to the power supply line. Advantageously according to the invention, the power factor control is performed by adjusting the turn-on and turn-off time of a bipolar transistor comprised in the power factor control cell. A cell for controlling the power factor of a power supply line is also described, of the type comprising a first and a second input terminals, a first and a second output terminals, the first input terminal being connected to the first output terminal by means of the series of an inductor and a diode, connected to each other in correspondence with an internal circuit node and the second input terminal and the second output terminal being connected to each other. Advantageously according to the invention, the control cell comprises a bipolar transistor inserted between the internal circuit node and the second input terminal and having a control terminal receiving a control signal derived from a signal having an elementary alternated trend.
Abstract:
A semiconductor memory device is provided. The semiconductor memory device includes a memory matrix having a plurality of memory cells arranged according to a plurality of rows and a plurality of columns and a plurality of bit lines, each bit line being associated with at least one respective column of said plurality. The semiconductor memory device further includes a bit line selection structure for selecting at least one among said bit lines and a voltage clamping circuit structure adapted to cause the clamping at a prescribed voltage of unselected bit lines adjacent and capacitively coupled to a selected bit line during a read operation.