公开(公告)号：US06808640B2

公开(公告)日：2004-10-26

申请号：US10077422

申请日：2002-02-14

Applicant: Frank Fischer ,  Wilhelm Frey

Inventor： Frank Fischer ,  Wilhelm Frey

IPC: B81C100

CPC classification number: B81B3/0008 ,  B81B3/0086 ,  B81B2201/0235 ,  B81C2201/112

Abstract: A method for manufacturing a micromechanical part, having a plurality of components that move with respect to one another, from a substrate, with a conductive coating being applied to at least one facing surface of the plurality of components that move with respect to one another.

Abstract translation: 一种用于制造具有多个相对于彼此移动的部件的微机械部件的方法，其中导电涂层被施加到相对于彼此移动的多个部件的至少一个相对表面。

公开(公告)号：US20040136044A1

公开(公告)日：2004-07-15

申请号：US10699410

申请日：2003-10-31

Inventor： Seth A. Miller ,  Simon Joshua Jacobs

IPC: G02B026/08

CPC classification number: G02B26/0841 ,  B81B3/0005 ,  B81B3/0083 ,  B81B2201/042 ,  B81C1/0096 ,  B81C2201/112 ,  G02B1/115 ,  Y10S359/90

Abstract: A micromechanical device having a deflectable member which contacts a stationary member. An antireflective coating is applied to portions of the micromechanical device to limit undesired reflection from the device. A passivation or lubrication layer is applied to the device to reduce stiction between the deflectable member and the stationary member. An insulator layer is utilized between the antireflective coating and the lubrication layer to prevent photoelectric-induced breakdown of the lubrication layer.

Abstract translation: 一种具有接触固定构件的偏转构件的微机械装置。 将抗反射涂层施加到微机械装置的部分以限制来自装置的不期望的反射。 钝化或润滑层被施加到该装置上以减少可偏转构件与固定构件之间的粘连。 在抗反射涂层和润滑层之间使用绝缘体层以防止润滑层的光电引起的击穿。

公开(公告)号：US06753037B2

公开(公告)日：2004-06-22

申请号：US09886781

申请日：2001-06-21

Applicant: Seth Miller ,  Vincent C. Lopes ,  Michael F. Brenner

Inventor： Seth Miller ,  Vincent C. Lopes ,  Michael F. Brenner

IPC: B05D312

CPC classification number: G02B26/0841 ,  B81B3/0005 ,  B81B2201/042 ,  B81C1/0096 ,  B81C2201/112

Abstract: A method for coating free-standing micromechanical devices using spin-coating. A solution with high solids loading but low viscosity can penetrate the free areas of a micromachined structure. Spinning this solution off the wafer or die results in film formation over the devices without the expected damage from capillary action. If an organic polymer is used as the solid component, the structures may be re-released by a traditional ash process. This method may be used as a process in the manufacture of micromechanical devices to protect released and tested structures, and to overcome stiction-related deformation of micromechanical devices associated with wet release processes.

Abstract translation: 使用旋涂法涂布独立的微机械装置的方法。 具有高固体负载但低粘度的溶液可以渗透微加工结构的自由区域。 将该溶液从晶片或模具上旋转导致器件上的膜形成，而没有毛细管作用的预期损坏。 如果使用有机聚合物作为固体组分，则结构可以通过传统的灰分过程再释放。 该方法可以用作制造微机械装置以保护释放和测试结构的过程，并且克服与湿释放过程相关的微机械装置的与静电相关的变形。

公开(公告)号：US20030146464A1

公开(公告)日：2003-08-07

申请号：US10072656

申请日：2002-02-07

Applicant: Superconductor Technologies, Inc.

Inventor： Eric M. Prophet

IPC: H01L027/108 ,  H01L029/76 ,  H01L029/94 ,  H01L031/119

CPC classification number: B81B3/001 ,  B81C2201/112 ,  H01L29/66181

Abstract: The present invention alleviates stiction between a suspended beam or microstructure and an underlying substrate by providing a patterned passivation layer on the substrate underneath the beam. The passivation layer is patterned to provide a substrate surface that differs substantially from the bottom surface of the beam. The difference between these two surfaces reduces the potential contact area between the beam and the substrate when the beam is pulled down, thereby reducing adhesive forces between the beam and the substrate and reducing the likelihood of stiction. In one embodiment, the passivation layer is patterned to form a substrate surface comprising a plurality of protuberances. In another embodiment, the passivation layer is patterned to form a substrate surface having a mesh pattern.

Abstract translation: 本发明通过在光束下方的衬底上提供图案化的钝化层来减轻悬挂梁或微结构和下层衬底之间的粘结。 钝化层被图案化以提供基本上与梁的底表面不同的衬底表面。 这两个表面之间的差异减小了当光束被拉下时光束和基板之间的潜在接触面积，从而减小光束与基板之间的粘合力，并降低粘结的可能性。 在一个实施例中，钝化层被图案化以形成包括多个突起的衬底表面。 在另一个实施例中，对钝化层进行图案化以形成具有网格图案的衬底表面。

公开(公告)号：US20020086101A1

公开(公告)日：2002-07-04

申请号：US10036611

申请日：2001-12-31

Inventor： Simon Joshua Jacobs

IPC: B05D001/02

CPC classification number: B81C1/0096 ,  B05D1/60 ,  B05D5/083 ,  B81B3/0005 ,  B81C2201/0181 ,  B81C2201/112

Abstract: A method and apparatus for delivering a fine mist of a lubricant to a micromechanical device. A mixture 402 of a lubricant and a diluent carrier fluid is held in a supply reservoir 404. The mixture is forced through a nebulizer tip 406 to produce a fine aerosol. A particle selector 408 removes large droplets from the aerosol as the aerosol passes. The aerosol travels a distance through a delivery conduit 410 while the diluent carrier fluid evaporates from the nebulized droplets. The evaporation removes the vast majority of the diluent carrier fluid from the droplets, greatly reducing the size of the lubricant droplets. The evaporated aerosol enters a deposition chamber 412 and is deposited on a micromechanical device 414. The micromechanical devices may be lubricated in wafer form, in which case the lubricant aerosol will lubricate an entire wafer of micromechanical devices at one time. One embodiment produces an aerosol having a mean droplet size of less than 10 microns. Evaporation of the diluent carrier fluid reduces this droplet size to 10-500 nm by the time the lubricant is deposited on the micromechanical devices. The preceding abstract is submitted with the understanding that it only will be used to assist in determining, from a cursory inspection, the nature and gist of the technical disclosure as described in 37 C.F.R. null 1.72(b). In no case should this abstract be used for interpreting the scope of any patent claims.

Abstract translation: 一种用于将微细油雾润滑剂输送到微机械装置的方法和装置。 润滑剂和稀释剂载体流体的混合物402被保持在供应容器404中。混合物被迫通过雾化器尖端406以产生细小的气溶胶。 颗粒选择器408随着气溶胶通过而从气溶胶中去除大​​的液滴。 气雾剂通过输送管道410行进一段距离，同时稀释剂载体流体从喷雾的液滴中蒸发。 蒸发从液滴中除去大部分稀释剂载体流体，大大减小了润滑剂液滴的尺寸。 蒸发的气溶胶进入沉积室412并沉积在微机械装置414上。微机械装置可以以晶片形式润滑，在这种情况下，润滑剂气溶胶将一次润滑整个微机械装置的晶片。 一个实施例产生具有小于10微米的平均液滴尺寸的气溶胶。 润滑剂沉积在微机械装置上时，稀释剂载体流体的蒸发将该液滴尺寸减小到10-500nm。 提交上述摘要的理解是，它只会用于协助从粗略检查中确定37 C.F.R.描述的技术披露的性质和要点。 §1.72（b）。 在任何情况下，本摘要不得用于解释任何专利权利要求的范围。

公开(公告)号：US06192757B1

公开(公告)日：2001-02-27

申请号：US09457200

申请日：1999-12-06

Applicant: Robert W. K. Tsang ,  Theresa A. Core ,  Steven J. Sherman ,  A. Paul Brokaw

Inventor： Robert W. K. Tsang ,  Theresa A. Core ,  Steven J. Sherman ,  A. Paul Brokaw

IPC: G01P15125

CPC classification number: B81C1/00246 ,  B81B3/001 ,  B81C1/00214 ,  B81C1/0092 ,  B81C99/0035 ,  B81C2201/112 ,  B81C2203/0735 ,  B81C2203/0742 ,  G01P15/0802 ,  G01P15/125 ,  G01P15/131 ,  G01P2015/0814

Abstract: A monolithic capacitance-type microstructure includes a semiconductor substrate, a plurality of posts extending from the surface of the substrate, a bridge suspended from the posts, and an electrically-conductive, substantially stationary element anchored to the substrate. The bridge includes an element that is laterally movable with respect to the surface of the substrate. The substantially stationary element is positioned relative to the laterally movable element such that the laterally movable element and the substantially stationary element form a capacitor. Circuitry is disposed on the substrate and operationally coupled to the movable element and the substantially stationary element for processing a signal based on a relative positioning of the movable element and the substantially stationary element. A method for fabricating the microstructure and the circuitry is disclosed.

Abstract translation: 单片电容型微结构包括半导体衬底，从衬底的表面延伸的多个柱，悬置在柱上的桥，以及锚定到衬底的导电的，基本上固定的元件。 该桥包括相对于基板的表面可横向移动的元件。 基本上固定的元件相对于横向可移动元件定位，使得横向可移动元件和基本上固定的元件形成电容器。 电路布置在基板上并且可操作地耦合到可移动元件和基本上静止的元件，用于基于可移动元件和基本上静止的元件的相对定位来处理信号。 公开了一种用于制造微结构和电路的方法。

公开(公告)号：US5512374A

公开(公告)日：1996-04-30

申请号：US239497

申请日：1994-05-09

Applicant: Robert M. Wallace ,  Steven A. Henck ,  Douglas A. Webb

Inventor： Robert M. Wallace ,  Steven A. Henck ,  Douglas A. Webb

IPC: G02B26/08 ,  B81B3/00 ,  B81C1/00 ,  C08G65/00 ,  C09D171/00 ,  C09D171/02 ,  B32B27/00

CPC classification number: B81C1/0096 ,  B81B3/0005 ,  C08G65/007 ,  C09D171/02 ,  B81C2201/112 ,  Y10T428/31544 ,  Y10T428/31699

Abstract: A micro-mechanical device (10) includes relatively movable elements (11, 17) which contact or engage and which thereafter stick or adhere. A perfluoropolyether (PFPE) film (31) is applied to the contacting or engaging portions of the elements (11,17) to ameliorate or eliminate such sticking or adhesion.

Abstract translation: 微机械装置（10）包括相对可移动的元件（11,17），其接触或接合，然后粘结或粘附。 将全氟聚醚（PFPE）膜（31）施加到元件（11,17）的接触或接合部分以改善或消除这种粘附或粘附。

公开(公告)号：US5331454A

公开(公告)日：1994-07-19

申请号：US823580

申请日：1992-01-16

Applicant: Larry J. Hornbeck

Inventor： Larry J. Hornbeck

IPC: B81B3/00 ,  C23C16/44 ,  G02B26/08 ,  G02B26/02

CPC classification number: B81B3/0005 ,  B81C1/0096 ,  G02B26/0841 ,  B81B2201/042 ,  B81C2201/112 ,  B82Y10/00 ,  B82Y30/00

Abstract: It is possible to use an oriented monolayer to limit the Van der Waals forces between two elements by passivation. An oriented monolayer (34) is formed upon the landing electrode (10) of a spatial light modulator element. When the element is activated and deflects to come in contact with the landing electrode, the oriented monolayer decreases the Van der Waals forces and prevents the element from sticking to the electrode.

Abstract translation: 可以使用取向的单层通过钝化来限制两个元件之间的范德华力。 在空间光调制元件的着陆电极（10）上形成定向单层（34）。 当元件被激活并且偏转以与着陆电极接触时，取向的单层减小范德华力，并防止元件粘附到电极。

公开(公告)号：US12054382B2

公开(公告)日：2024-08-06

申请号：US18308950

申请日：2023-04-28

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Hsi-Cheng Hsu ,  Kuo-Hao Lee ,  Jui-Chun Weng ,  Ching-Hsiang Hu ,  Ji-Hong Chiang ,  Lavanya Sanagavarapu ,  Chia-Yu Lin ,  Chia-Chun Hung ,  Jia-Syuan Li ,  Yu-Pei Chiang

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/0005 ,  B81C1/00968 ,  B81C2201/112 ,  B81C2201/115

Abstract: A micro-electromechanical-system (MEMS) device may be formed to include an anti-stiction polysilicon layer on one or more moveable MEMS structures of a device wafer of the MEMS device to reduce, minimize, and/or eliminate stiction between the moveable MEMS structures and other components or structures of the MEMS device. The anti-stiction polysilicon layer may be formed such that a surface roughness of the anti-stiction polysilicon layer is greater than the surface roughness of a bonding polysilicon layer on the surfaces of the device wafer that are to be bonded to a circuitry wafer of the MEMS device. The higher surface roughness of the anti-stiction polysilicon layer may reduce the surface area of the bottom of the moveable MEMS structures, which may reduce the likelihood that the one or more moveable MEMS structures will become stuck to the other components or structures.

公开(公告)号：US11873215B2

公开(公告)日：2024-01-16

申请号：US17684317

申请日：2022-03-01

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Enri Duqi ,  Marco Del Sarto ,  Lorenzo Baldo

IPC: B81C1/00 ,  B81B3/00 ,  B81C99/00

CPC classification number: B81C1/00325 ,  B81B3/0018 ,  B81C99/0005 ,  B81C2201/112

Abstract: A MEMS device formed by a substrate, having a surface; a MEMS structure arranged on the surface; a first coating region having a first Young's modulus, surrounding the MEMS structure at the top and at the sides and in contact with the surface of the substrate; and a second coating region having a second Young's modulus, surrounding the first coating region at the top and at the sides and in contact with the surface of the substrate. The first Young's modulus is higher than the second Young's modulus.