Abstract:
A micro-electrical system, such as a lens stack for use in a scanning electron microscope, analysis tool, etc., comprises recesses and/or serrations that increase the surface path breakdown, thereby increasing reliability and enabling high voltage operations.
Abstract:
A charged particle beam apparatus in which an electrostatic lens is used as a main focusing element to obtain a subminiature high-sensitivity high-resolution SEM, a drift tube for an electron beam is located inside a column between an electron source and a sample, and a detector for secondary electrons is located inside the drift tube. This solves the problem associated with the provision of a secondary electron detector, which heretofore has been a bottleneck in making a subminiature high-resolution SEM column.
Abstract:
The present invention provides a new extractor for a micro-column and an alignment method of the aperture of the extractor and an electron emitter for a micro-column. Further, the present invention provides a measuring system, a method for measuring, and an alignment method using the principle of the alignment.
Abstract:
There is provided a multi-charged beam lens constituted by stacking, via fiber chips serving as insulator members along the optical path of a charged beam, a plurality of electrodes having a charged beam passing region where a plurality of charged beam apertures are formed. The electrodes have shield apertures between the charged beam passing region and the fiber chips. A conductive shield extends through the shield apertures without contacting the electrodes, and cuts off a straight path which connects the charged beam passing region and the fiber chips serving as insulator members. This prevents the influence of charge-up of the insulator members on an electron beam in the multi-charged beam lens.
Abstract:
A microcolumn including a plurality of beam modification components coupled to an assembly substrate, wherein the plurality of beam modification components includes: (1) an extractor component; (2) a first focusing electrode component; (3) a first anode component; (4) a first deflector component; (5) a second focusing electrode component; (6) a second deflector component; (7) a third focusing electrode component; (8) a third deflector component; (9) a second anode component; (10) a fourth focusing electrode component; and (11) a third anode component. The beam modification components may be ordered on the substrate in this sequence or other sequences.
Abstract:
An electron beam exposure apparatus for exposing a wafer with a plurality of electron beams includes a multi-axis electron lens having a plurality of lens openings operable to converge the electron beams independently of each other, the plurality of lens openings having different shapes.
Abstract:
An electron beam exposure apparatus for exposing a wafer includes: a multi-axis electron lens operable to converge a plurality of electron beams independently of each other; and a lens-intensity adjuster including a substrate provided to be substantially parallel to the multi-axis electron lens, and a lens-intensity adjusting unit operable to adjust the lens intensity of the multi-axis electron lens applied to the electron beams passing through the lens openings, respectively.
Abstract:
An electron beam exposure apparatus for exposing a wafer with a plurality of electron beams includes a multi-axis electron lens having a plurality of lens openings operable to converge the electron beams independently of each other, the plurality of lens openings having different shapes.
Abstract:
A charged particle-beam microcolumn, which for example may be used for charged particle microscopy, with a T-shape configuration has a relatively narrow base structure supporting the beam forming charged particle optical column. The narrow base structure permits the T-shaped microcolumn and sample to be positioned at an angle other than normal with respect to each other, which allows generation of three-dimensional-like images of the sample surface. Thus, the incidence angle of the charged particle beam generated by the T-shaped microcolumn may be varied while a short working distance is maintained. A conventional secondary/backscattered charged particle detector may be used because the reflected angle of the charged particles allows a charged particle detector to be separated from the T-shaped microcolumn. Further, the small size of the T-shaped microcolumn permits observation of different parts of a large stationary sample by moving the T-shaped microcolumn with respect to the sample. Moreover, multiple T-shaped microcolumns may be arrayed to improve throughput.
Abstract:
An electron beam imaging system is described wherein a sharp-tip electron source is biased to produce an electron flow and a conductive target is placed in the path of the electron flow. A planar, electrostatic lens is positioned in the electron flow path and between the electron source and target. The lens includes an aperture; at least a first conductive plane that is biased less negative than the electron source; and one or more conductive planes separated by dielectric layers. A secondary electron detector is formed on the surface of the electrostatic lens that is closest to the conductive target, whereby the lens may be positioned close to the target and still not obstruct secondary electrons emitted from the target from impinging on the secondary electron detector.