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    Lead plate with a mounting portion being heavier than its joint portion
    183.
    发明授权
    Lead plate with a mounting portion being heavier than its joint portion 有权
    引导板，其安装部分比其接合部分重

    公开(公告)号：US08216005B2

    公开(公告)日：2012-07-10

    申请号：US13344831

    申请日：2012-01-06

    Applicant: Bong-Young Kim ,  Young-Ho Kim

    Inventor： Bong-Young Kim ,  Young-Ho Kim

    IPC: H01R9/24

    CPC classification number: H05K3/3426 ,  H01M2/0404 ,  H01M2/22 ,  H01M10/052 ,  H05K3/3405 ,  H05K2201/1034 ,  H05K2201/10757 ,  H05K2201/1084 ,  Y02P70/613

    Abstract: A lead plate for connecting a printed circuit board (PCB) of a secondary battery to an bare cell includes a mounting portion connected to the PCB, a joint portion connected to the bare cell, a surface area of the joint portion facing the bare cell being smaller than a surface area of the mounting portion facing the PCB, and a step portion connecting the mounting portion and the joint portion to each other.

    Abstract translation: 用于将二次电池的印刷电路板（PCB）连接到裸电池的引线板包括连接到PCB的安装部分，连接到裸电池的接合部分，与裸电池相对的接合部分的表面区域 小于面向PCB的安装部分的表面积，以及将安装部分和接合部分彼此连接的台阶部分。

    TRANSFORMER CAPABLE OF MAINTAINING HEIGHT
    184.
    发明申请
    TRANSFORMER CAPABLE OF MAINTAINING HEIGHT 有权
    变压器能维持高度

    公开(公告)号：US20120169446A1

    公开(公告)日：2012-07-05

    申请号：US13286220

    申请日：2011-11-01

    Applicant: Hsiang-Yi TSENG ,  Ching-Hsiang TIEN ,  Yi-Lin CHEN ,  Hsin-Wei Tsai ,  Chun-Song MING

    Inventor： Hsiang-Yi TSENG ,  Ching-Hsiang TIEN ,  Yi-Lin CHEN ,  Hsin-Wei Tsai ,  Chun-Song MING

    IPC: H01F27/29

    CPC classification number: H05K1/182 ,  H01F27/292 ,  H01F2027/2819 ,  H05K3/306 ,  H05K2201/09072 ,  H05K2201/1003 ,  H05K2201/10424 ,  H05K2201/10757 ,  H05K2201/2036

    Abstract: A transformer capable of maintaining its height is provided. The transformer is formed on a circuit board having a receiving hole. The transformer comprises a winding module, two magnetic core modules contacting and holding the winding module, a plurality of pins and at least one supporting means. The winding module comprises a winding baseboard and a winding pillar where a winding structure is formed thereon. The winding pillar is received in the receiving hole. Each of the pins comprises a first bent part separating the corresponding pin into a first portion connected to the winding baseboard and a second portion connected to the circuit board around the receiving hole. The supporting means is formed between the first portion of at least one of the pins and the circuit board to contact the first portion and the circuit board to maintain the distance between them.

    Abstract translation: 提供能够保持其高度的变压器。 变压器形成在具有接收孔的电路板上。 该变压器包括一个绕组模块，两个磁芯模块，其接触和保持绕组模块，多个销和至少一个支撑装置。 绕组模块包括绕组基板和在其上形成绕组结构的绕组柱。 卷绕柱被容纳在接收孔中。 每个销包括将相应的销分成连接到绕组基板的第一部分的第一弯曲部分和连接到接收孔周围的电路板的第二部分。 支撑装置形成在至少一个销和电路板的第一部分之间以接触第一部分和电路板以保持它们之间的距离。

    PACKAGING BOARD
    185.
    发明申请
    PACKAGING BOARD 有权
    包装板

    公开(公告)号：US20120145436A1

    公开(公告)日：2012-06-14

    申请号：US13209062

    申请日：2011-08-12

    Applicant: Yukinori KITA

    Inventor： Yukinori KITA

    IPC: H05K1/00

    CPC classification number: H05K3/306 ,  H01R43/0256 ,  H05K3/02 ,  H05K3/3447 ,  H05K2201/10295 ,  H05K2201/10303 ,  H05K2201/10424 ,  H05K2201/10757 ,  H05K2201/10818

    Abstract: A packaging board of the type having board terminals soldered on a printed board and including an insulation support member made of a resin disposed on a printed board having tubular support portions configured to receive board terminals, visual recognition windows configured for visually recognizing soldering portions of the board terminals inserted into the printed board through the windows, and engaging portions that engage the board terminals and define insertion amounts of the board terminals.

    Abstract translation: 一种具有板端子的封装板，其焊接在印刷电路板上，并且包括由设置在印刷电路板上的树脂构成的绝缘支撑部件，所述绝缘支撑部件设置在具有用于容纳电路板端子的管状支撑部分的印刷电路板上， 板端子通过窗口插入印刷电路板，以及接合部分，其接合电路板端子并限定电路板端子的插入量。

    Method for manufacturing leads
    186.
    发明授权
    Method for manufacturing leads 失效
    生产线的方法

    公开(公告)号：US08196291B2

    公开(公告)日：2012-06-12

    申请号：US11979487

    申请日：2007-11-05

    Applicant: Deepak K. Pai

    Inventor： Deepak K. Pai

    IPC: H01R43/00

    CPC classification number: H05K3/3426 ,  H01L21/4821 ,  H01R43/16 ,  H05K2201/10689 ,  H05K2201/10757 ,  H05K2201/10946 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/49121 ,  Y10T29/4913

    Abstract: A system method for manufacturing leads is provided. The method includes providing a conductive sheet, shaping the conductive sheet into at least two opposing longitudinal strips and a plurality of interposing strips, masking lateral sides and a center of the plurality of interposing strips, covering the exposed surface with a conductor and severing the conductive sheet at least along center mask. The plurality of interposing strips are preferably flexible and configurable into desired shapes for potential future attachment to an integrated circuit.

    Abstract translation: 提供一种用于制造引线的系统方法。 该方法包括提供导电片，将导电片成形为至少两个相对的纵向条和多个插入条，掩蔽多个插入条的横向侧和中心，用导体覆盖暴露的表面并切断导电 至少沿中心面膜。 多个插入条优选地是柔性的并且可配置成期望的形状，用于将来可能连接到集成电路。

    Socket assembly for fixing an IC on a circuit plate
    187.
    发明授权
    Socket assembly for fixing an IC on a circuit plate 有权
    用于将IC固定在电路板上的插座组件

    公开(公告)号：US08105093B2

    公开(公告)日：2012-01-31

    申请号：US12949824

    申请日：2010-11-19

    Applicant: Xue-Feng Zhang ,  Feng-Hao Ku ,  Yu-Feng Xia

    Inventor： Xue-Feng Zhang ,  Feng-Hao Ku ,  Yu-Feng Xia

    IPC: H01R12/01

    CPC classification number: H05K3/301 ,  H05K2201/0311 ,  H05K2201/10325 ,  H05K2201/10689 ,  H05K2201/10757

    Abstract: An exemplary socket assembly includes a circuit plate and a socket mounted on the circuit plate for fixing an IC. The socket includes a first fixing member and a second fixing member. The first fixing member includes installed portions, elastic connecting portions, and a first buckling portion, the elastic connecting portions interconnects the electric portions and the first buckling portion. The second fixing member includes electric portions, elastic connecting portions, and a second buckling portion, and the elastic connecting portions interconnect the electric portions and the second buckling portion. Wherein when the IC is attached to the socket, the first buckling portion and the second buckling portion are initially disengaged from each other, pins of the IC is electrically connected with the electric portions, the first buckling portion and the second buckling portion are brought together with the elastic connecting portions elastically deforming, and the first buckling portion and the second buckling portion are locked together and hold the IC in the socket.

    Abstract translation: 示例性插座组件包括电路板和安装在电路板上用于固定IC的插座。 插座包括第一固定构件和第二固定构件。 第一固定构件包括安装部分，弹性连接部分和第一弯曲部分，弹性连接部分将电气部分和第一屈曲部分互连。 第二固定构件包括电气部分，弹性连接部分和第二弯曲部分，并且弹性连接部分将电气部分和第二屈曲部分互连。 其中当IC连接到插座时，第一屈曲部分和第二弯曲部分最初彼此分离，IC的引脚与电气部分电连接，第一弯曲部分和第二弯曲部分被聚集在一起 其中弹性连接部分弹性变形，并且第一弯曲部分和第二弯曲部分被锁定在一起并将IC保持在插座中。

    Arrangement comprising a shunt resistor and method for producing an arrangement comprising a shunt resistor
    188.
    发明授权
    Arrangement comprising a shunt resistor and method for producing an arrangement comprising a shunt resistor 有权
    包括分流电阻器的装置和用于产生包括分流电阻器的装置的方法

    公开(公告)号：US08031043B2

    公开(公告)日：2011-10-04

    申请号：US11970661

    申请日：2008-01-08

    Applicant: Martin Schultz ,  Peter Kanschat

    Inventor： Martin Schultz ,  Peter Kanschat

    IPC: H01C7/10

    CPC classification number: H05K1/0203 ,  G01R1/203 ,  H01C1/014 ,  H01C1/08 ,  H01C1/14 ,  H01L2924/19107 ,  H05K1/0263 ,  H05K1/0268 ,  H05K3/328 ,  H05K2201/0209 ,  H05K2201/10022 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2203/0195 ,  H05K2203/0285 ,  H05K2203/049

    Abstract: The invention relates to an arrangement comprising a shunt resistor with at least an electrically conductive first connecting leg and an electrically conductive second connecting leg. A resistance area of the shunt resistor is electrically connected to the first connecting leg and to the second connecting leg. The arrangement further comprises a circuit carrier with a first metallization and a second metallization. The first connecting leg is directly joined to the first metallization and the second connecting leg is directly joined to the second metallization. The resistance area of the shunt resistor is in thermal contact with the thermally conductive substrate by use of a thermal filler arranged between the resistance area and the substrate, and/or by directly contacting the resistance area with the substrate.The invention further relates to a method for producing an arrangement with a shunt resistor and a circuit carrier.

    Abstract translation: 本发明涉及一种包括具有至少导电的第一连接腿和导电的第二连接腿的分流电阻器的装置。 分流电阻器的电阻区域电连接到第一连接腿部和第二连接腿部。 该装置还包括具有第一金属化和第二金属化的电路载体。 第一连接腿直接连接到第一金属化，第二连接腿直接连接到第二金属化。 分流电阻器的电阻区域通过使用布置在电阻区域和衬底之间的热填料和/或通过使电阻区域与衬底直接接触而与导热衬底热接触。 本发明还涉及一种用于产生具有分流电阻器和电路载体的装置的方法。

    Lead plate and protection circuit module having the same
    190.
    发明申请
    Lead plate and protection circuit module having the same 有权
    引线板和保护电路模块具有相同的功能

    公开(公告)号：US20110151730A1

    公开(公告)日：2011-06-23

    申请号：US12923563

    申请日：2010-09-28

    Applicant: Bong-Young Kim ,  Young-Ho Kim

    Inventor： Bong-Young Kim ,  Young-Ho Kim

    IPC: H01R13/02

    CPC classification number: H05K3/3426 ,  H01M2/0404 ,  H01M2/22 ,  H01M10/052 ,  H05K3/3405 ,  H05K2201/1034 ,  H05K2201/10757 ,  H05K2201/1084 ,  Y02P70/613

    Abstract: A lead plate for connecting a printed circuit board (PCB) of a secondary battery to an bare cell includes a mounting portion connected to the PCB, a joint portion connected to the bare cell, a surface area of the joint portion facing the bare cell being smaller than a surface area of the mounting portion facing the PCB, and a step portion connecting the mounting portion and the joint portion to each other.

    Abstract translation: 用于将二次电池的印刷电路板（PCB）连接到裸电池的引线板包括连接到PCB的安装部分，连接到裸电池的接合部分，与裸电池相对的接合部分的表面区域 小于面向PCB的安装部分的表面积，以及将安装部分和接合部分彼此连接的台阶部分。

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