Supercritical developing for a lithographic process

    公开(公告)号:US20060141399A1

    公开(公告)日:2006-06-29

    申请号:US11025538

    申请日:2004-12-29

    CPC classification number: G03F7/322

    Abstract: A method of creating a resist image on a semiconductor substrate includes exposing a layer of photoresist on the semiconductor substrate and developing the exposed layer of photoresist using a first fluid including supercritical carbon dioxide and a base such as Tetra-Methyl Ammonium Hydroxide (TMAH). Additionally, the developed photoresist can be cleaned using a second fluid including supercritical carbon dioxide and a solvent such as methanol, ethanol, isopropanol, and xylene.

    Apparatus and method for immersion lithography
    12.
    发明申请
    Apparatus and method for immersion lithography 有权
    浸没式光刻装置及方法

    公开(公告)号:US20050253090A1

    公开(公告)日:2005-11-17

    申请号:US10844178

    申请日:2004-05-12

    CPC classification number: G03F7/70341

    Abstract: An immersion lithography system for semiconductor manufacturing provides a lens assembly that moves relative to a wafer surface and includes a nozzle and drain assembly that is coupled to, and moves along, the lens assembly. The nozzle and drain assemblies may be disposed circumferentially opposite each other about the lens or an annular ring may be provided that surrounds the lens and includes a plurality of selectable alternating nozzles and drains. The nozzle and drain assemblies may rotatably surround the lens. At least a portion of the wafer being patterned is immersed in a liquid provided by the nozzle assembly and a flow direction is controlled by manipulating the nozzle and drain assemblies. Flow direction may be advantageously directed outwardly to reduce particulate contamination.

    Abstract translation: 用于半导体制造的浸没式光刻系统提供了相对于晶片表面移动的透镜组件,并且包括联接到透镜组件并沿着透镜组件移动的喷嘴和排出组件。 喷嘴和排出组件可以围绕透镜周向地相对设置,或者可以设置围绕透镜的环形环,并且包括多个可选择的交替喷嘴和排水沟。 喷嘴和排出组件可旋转地围绕透镜。 将被图案化的晶片的至少一部分浸入由喷嘴组件提供的液体中,并且通过操纵喷嘴和排出组件来控制流动方向。 可以有利地向外指向流动方向以减少颗粒污染。

    High solids emulsions of elastomeric polymers
    13.
    发明授权
    High solids emulsions of elastomeric polymers 失效
    弹性体聚合物的高固含量乳液

    公开(公告)号:US06737473B2

    公开(公告)日:2004-05-18

    申请号:US09905664

    申请日:2001-07-13

    CPC classification number: C08J3/03

    Abstract: Water-continuous emulsion of elastomeric polymers are disclosed having a solids content of greater than 75%, an average particle size less than 5 &mgr;m, and having sufficient stability to produce a stable lower solids emulsion upon dilution with water comprising; an elastomeric polymer, surfactant, water, optional plasticizer, optional low molecular weight acid, and is essentially free of organic solvents. The water-continuous emulsions of elastomeric polymers can be prepared by; (I) forming a premix that is essentially free of organic solvents comprising an elastomeric polymer and surfactant, and optionally a plasticizer and low molecular weight acid, and (II) adding water to the premix with mixing to form a water continuous emulsion of the elastomeric polymer having a solids content of greater than 75%, an average particle size less than 5 &mgr;m, and having sufficient stability to produce a stable lower solids emulsion upon dilution with water.

    Abstract translation: 公开了弹性体聚合物的水连续乳液,其固体含量大于75%,平均粒度小于5μm,并且在用水稀释时具有足够的稳定性以产生稳定的低固体乳剂; 弹性体聚合物,表面活性剂,水,任选的增塑剂,任选的低分子量酸,并且基本上不含有机溶剂。 弹性聚合物的水连续乳液可以通过以下步骤制备: (I)形成基本上不含有弹性体聚合物和表面活性剂以及任选的增塑剂和低分子量酸的有机溶剂的预混物,和(II)将混合的水加入到预混合物中以形成弹性体的水连续乳液 固体含量大于75%的聚合物,平均粒度小于5μm,并且在用水稀释时具有足够的稳定性以产生稳定的低固体乳剂。

    Novel wafer repair method using direct-writing
    14.
    发明申请
    Novel wafer repair method using direct-writing 有权
    使用直写的新型晶圆修复方法

    公开(公告)号:US20060148109A1

    公开(公告)日:2006-07-06

    申请号:US11029992

    申请日:2005-01-05

    Abstract: A method of wafer repairing comprises identifying locations and patterns of defective regions in a semiconductor wafer; communicating the locations and patterns of defective regions to a direct-writing tool; forming a photoresist layer on the semiconductor wafer; locally exposing the photoresist layer within the defective regions using an energy beam; developing the photoresist layer on the semiconductor wafer; and wafer-processing the semiconductor wafer under the photoresist layer after exposing and developing.

    Abstract translation: 晶片修复的方法包括识别半导体晶片中的缺陷区域的位置和图案; 将缺陷区域的位置和图案传送到直写工具; 在半导体晶片上形成光致抗蚀剂层; 使用能量束将缺陷区域内的光致抗蚀剂层局部曝光; 在半导体晶片上显影光致抗蚀剂层; 并在曝光和显影之后将光致抗蚀剂层下方的半导体晶片进行晶片处理。

    Mask superposition for multiple exposures
    15.
    发明申请
    Mask superposition for multiple exposures 有权
    多重曝光的面膜叠加

    公开(公告)号:US20060139603A1

    公开(公告)日:2006-06-29

    申请号:US11317974

    申请日:2005-12-23

    Applicant: Burn Lin

    Inventor: Burn Lin

    CPC classification number: G03F7/70275 G03F7/70208 G03F7/70283

    Abstract: An exposure system includes a mask stage module adapted for holding a first mask and a second mask, wherein the first mask is configured for illumination by a first beam to form a transformed first beam having a first pattern from the first mask and the second mask is configured for illumination by a second beam to form a transformed second beam having a second pattern from the second mask. The exposure system also includes a beam combiner configured to combine the transformed first and second beams to form a resultant beam, wherein the resultant beam is projected into a substrate coated with a photoresist layer.

    Abstract translation: 曝光系统包括适于保持第一掩模和第二掩模的掩模台模块,其中第一掩模被配置为由第一光束照明以形成具有来自第一掩模的第一图案的变换的第一光束,而第二掩模是 被配置为由第二光束照明以形成具有来自第二掩模的第二图案的变换的第二光束。 曝光系统还包括光束组合器,其被配置为组合变换的第一和第二光束以形成合成光束,其中所得到的光束投射到涂覆有光致抗蚀剂层的基板中。

    System and method for processing masks with oblique features
    17.
    发明申请
    System and method for processing masks with oblique features 有权
    用倾斜特征处理掩模的系统和方法

    公开(公告)号:US20050164098A1

    公开(公告)日:2005-07-28

    申请号:US10765531

    申请日:2004-01-27

    Abstract: A method and system is disclosed for processing one or more oblique features on a mask or reticle substrate. After aligning the mask or reticle substrate with a predetermined reference system, an offset angle of a feature to be processed on the mask or reticle substrate with regard to either the horizontal or vertical reference direction of the predetermined reference system is determined. The mask or reticle substrate is rotated in a predetermined direction by the offset angle; and the feature on the mask or reticle substrate is processed using the predetermined reference system wherein the feature is processed in either the horizontal or vertical reference direction thereof.

    Abstract translation: 公开了一种用于处理掩模或掩模版基板上的一个或多个倾斜特征的方法和系统。 在掩模或掩模版基板与预定的参考系统对准之后,确定相对于预定参考系的水平或垂直参考方向在掩模或掩模版基板上要处理的特征的偏移角。 掩模或掩模版基板沿预定方向旋转偏移角; 并且使用预定的参考系统处理掩模或掩模版基板上的特征,其中特征在水平或垂直参考方向上被处理。

    Multiple mask step and scan aligner
    18.
    发明申请
    Multiple mask step and scan aligner 失效
    多个掩模步骤和扫描对准器

    公开(公告)号:US20050012914A1

    公开(公告)日:2005-01-20

    申请号:US10918863

    申请日:2004-08-16

    Applicant: Burn Lin

    Inventor: Burn Lin

    CPC classification number: G03F7/70283 G03F7/70358 G03F7/70466 G03F9/7076

    Abstract: A new optical lithographic exposure apparatus is described. The apparatus may comprise, for example, a lithographic stepper or scanner. A wafer stage comprises a means of supporting a semiconductor wafer. A mask stage comprises a means of holding a first mask and a second mask and maintaining a fixed relative position between the first mask and the second mask. The mask stage may further comprise an independent means of aligning each mask. A light source comprises a means to selectively shine actinic light through one of the first mask and the second mask. An imaging lens is capable of focusing the actinic light onto the semiconductor wafer. A step and scan method using the mask stage is provided. A first mask and a second mask are loaded into a mask stage of an optical lithographic exposure apparatus. The first mask and the second mask are aligned. The first mask is scanned. The wafer is then stepped. The second mask is scanned. By repeating this sequence across the wafer twice, the patterns of the first mask and the second mask are thereby superimposed in every field. The photoresist layer is developed to thereby create the patterning in the manufacture of the integrated circuit device.

    Abstract translation: 描述了一种新的光刻曝光设备。 该装置可以包括例如光刻步进器或扫描器。 晶片台包括支撑半导体晶片的装置。 掩模台包括保持第一掩模和第二掩模并保持第一掩模和第二掩模之间的固定相对位置的装置。 掩模台还可以包括对准每个掩模的独立装置。 光源包括选择性地通过第一掩模和第二掩模之一照射光化光的装置。 成像透镜能够将光化学光聚焦到半导体晶片上。 提供了使用掩模阶段的步骤和扫描方法。 第一掩模和第二掩模被加载到光刻曝光设备的掩模级中。 第一个掩模和第二个掩模对齐。 第一个掩模被扫描。 然后将晶片加工成台阶。 第二个面罩被扫描。 通过跨晶片重复该序列两次,因此第一掩模和第二掩模的图案在每个场中叠加。 显影光致抗蚀剂层,从而在集成电路器件的制造中形成图案化。

    Silicone vesicles
    19.
    发明授权
    Silicone vesicles 失效
    硅胶囊

    公开(公告)号:US08012387B2

    公开(公告)日:2011-09-06

    申请号:US12339154

    申请日:2008-12-19

    Applicant: Shaow Burn Lin

    Inventor: Shaow Burn Lin

    Abstract: A process for preparing a vesicle composition based upon mixing an organopolysiloxane having at least one hydrophilic substituent group, a water miscible solvent, and water is disclosed. The vesicle compositions produced by the method are useful in various personal, household, and health care applications.

    Abstract translation: 公开了一种基于混合具有至少一个亲水性取代基的有机聚硅氧烷,水混溶性溶剂和水来制备囊泡组合物的方法。 通过该方法生产的囊泡组合物可用于各种个人,家庭和医疗保健应用。

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