公开(公告)号：US20070153092A1

公开(公告)日：2007-07-05

申请号：US11306635

申请日：2006-01-05

Applicant: Chin-Tien Yang ,  Yu-Sheng Cheng ,  Yu-Min Chen ,  Cheng-Hung Weng ,  Hung-Jen Chen ,  Ruei-Shiang Lin ,  Hui-Shan Chen ,  Yi-Shiuan Hsu ,  Sheng-Chia Lee ,  I-Hao Chan ,  Yi-Jen Cheng ,  Chi-Ming Lin ,  Chan-Sheng Lin

Inventor： Chin-Tien Yang ,  Yu-Sheng Cheng ,  Yu-Min Chen ,  Cheng-Hung Weng ,  Hung-Jen Chen ,  Ruei-Shiang Lin ,  Hui-Shan Chen ,  Yi-Shiuan Hsu ,  Sheng-Chia Lee ,  I-Hao Chan ,  Yi-Jen Cheng ,  Chi-Ming Lin ,  Chan-Sheng Lin

IPC: H04N5/225

CPC classification number: H04N5/232 ,  G08B13/19626 ,  G08B13/19628 ,  G08B13/1963 ,  H04N5/23238 ,  H04N7/183

Abstract: A video camera apparatus for whole space monitoring is provided, which includes a lens module having a plurality of lenses, a calculation unit, and a processing unit. The lens module captures images from different directions and generates a plurality of image data, then outputs the image data to the calculation unit. The calculation unit calculates the received image data and outputs the image data to the processing unit. The processing unit compresses the image data according to the output of the calculation unit and outputs the compressed image data to the host apparatus.

Abstract translation: 提供一种用于全空间监视的摄像机装置，其包括具有多个透镜的透镜模块，计算单元和处理单元。 镜头模块从不同方向拍摄图像，并生成多个图像数据，然后将图像数据输出到计算单元。 计算单元计算接收到的图像数据并将该图像数据输出到处理单元。 处理单元根据计算单元的输出压缩图像数据，并将压缩图像数据输出到主机设备。

公开(公告)号：US20130284500A1

公开(公告)日：2013-10-31

申请号：US13455364

申请日：2012-04-25

Applicant: Jun-Chung Hsu ,  Chi-Ming Lin ,  Tso-Hung Yeh ,  Ya-Hsiang Chen

Inventor： Jun-Chung Hsu ,  Chi-Ming Lin ,  Tso-Hung Yeh ,  Ya-Hsiang Chen

IPC: H05K1/03 ,  H05K1/02

CPC classification number: H05K3/388 ,  H05K3/381 ,  H05K2203/0307

Abstract: A laminate circuit board structure from button up including a substrate, a circuit metal layer, a nanometer plating layer and a cover layer is disclosed. The nanometer plating layer is smooth a thickness of 5-40 nm, and can be directly forming on the outer surface of the circuit metal layer or manufactured by firstly forming the nanometer plating layer on a preforming substrate, then pressing the substrate against the nanometer plating layer, and finally removing the preforming substrate. The junction adhesion between the nanometer plating layer and the cover layer or the substrate is improved by chemical bonding. Therefore it does not need to roughen the circuit metal layer or reserve circuit width for compensation such that the density of the circuit increases and much more dense circuit can be implemented in the substrate with the same area.

Abstract translation: 公开了一种按钮的层叠电路板结构，包括基板，电路金属层，纳米电镀层和覆盖层。 纳米电镀层的光滑厚度为5-40nm，可以直接形成在电路金属层的外表面上，或者通过首先在预成型基板上形成纳米镀层，然后将衬底压在纳米电镀上 层，最后除去预成型基板。 通过化学键合可以改善纳米镀层与覆盖层或衬底之间的结合性。 因此，不需要粗糙化电路金属层或补偿电路宽度，使得电路的密度增加，并且可以在具有相同面积的基板中实现更加密集的电路。

公开(公告)号：US20110139314A1

公开(公告)日：2011-06-16

申请号：US12776607

申请日：2010-05-10

Applicant: Cheng-En Ho ,  Chi-Ming Lin

Inventor： Cheng-En Ho ,  Chi-Ming Lin

IPC: B23K31/02 ,  B23K1/20

CPC classification number: B23K1/20 ,  B23K1/0016 ,  B23K1/008 ,  B23K2101/42 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/11848 ,  H01L2224/11849 ,  H01L2224/13111 ,  H01L2924/14 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method for inhibiting the growth of a nickel-copper-tin intermetallic (i.e. (Ni,Cu)3Sn4) layer at the (Cu,Ni)6Sn5/nickel interface of a solder joint is described as follows. A Sn—Ag—Cu solder alloy with a Cu-content of 0.5˜1 weight percent (wt. %) is provided. The solder alloy is disposed on a surface finish of a soldering pad, having a nickel-based metallization layer. A material of the solder alloy further includes palladium. The solder alloy is joined with the surface finish, so as to form the solder joint containing palladium that enables to inhibit the growth of the undesired (Ni,Cu)3Sn4 layer between the (Cu,Ni)6Sn5 and nickel in the subsequent use at temperatures ranging from 100° C. to 180° C.

Abstract translation: 焊接接头的（Cu，Ni）6Sn5 /镍界面处的镍 - 铜 - 锡 - 金属间化合物（即（Ni，Cu）3Sn4）层的生长抑制方法如下所述。 提供Cu含量为0.5〜1重量％（重量％）的Sn-Ag-Cu焊料合金。 焊料合金设置在具有镍基金属化层的焊盘的表面光洁度上。 焊料合金的材料还包括钯。 焊料合金与表面光洁度相结合，以形成含钯的焊点，其能够抑制（Cu，Ni）6 Sn 5和镍之间不期望的（Ni，Cu）3 Sn 4层在随后的使用中的生长 温度范围从100°C到180°C

公开(公告)号：US06661032B2

公开(公告)日：2003-12-09

申请号：US10179212

申请日：2002-06-26

Applicant: Hsiang-Chih Meng ,  Li-Ching Ma ,  Chi-Ming Lin

Inventor： Hsiang-Chih Meng ,  Li-Ching Ma ,  Chi-Ming Lin

IPC: H01L3300

CPC classification number: H01L25/167 ,  H01L23/62 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A LED package structure having an electro-static protective diode, the structure is disclosed. The structure comprises: an electro-static protective diode having an n-type electrode mounted on a lampstand by a conductive paste layer, so that it forms an electrical connecting with a positive leadfame. A LED having a p-type and an n-type electrode positioned on one side and a bottom on the other side of the LED mounted by an insulating layer atop the p-type electrode of the electro-static protective diode. Next a first conductive wire connects between the p-type electrode of the LED and the positive leadframe. A second conductive wire, connects the n-type electrode of the LED with the negative leadframe. A third conductive wire connects the p-type electrode of the electro-static protection diode to the negative electrode of the leadframe. Transparent resin is finally used to form a dome-shaped package.

公开(公告)号：US20130255858A1

公开(公告)日：2013-10-03

申请号：US13437933

申请日：2012-04-03

Applicant: Jun-Chung Hsu ,  Chi-Ming Lin ,  Tso-Hung Yeh ,  Ya-Hsiang Chen

Inventor： Jun-Chung Hsu ,  Chi-Ming Lin ,  Tso-Hung Yeh ,  Ya-Hsiang Chen

IPC: B32B38/10 ,  B32B38/08

CPC classification number: H05K3/282 ,  H05K1/0366 ,  H05K3/103 ,  H05K3/146 ,  H05K3/16 ,  H05K3/202 ,  H05K3/244 ,  H05K3/381 ,  H05K3/384 ,  H05K2201/0376 ,  H05K2201/09227 ,  H05K2203/0152 ,  H05K2203/0278 ,  H05K2203/072 ,  Y10T156/10

Abstract: A method of manufacturing a laminate circuit board is disclosed. The method includes forming a metal layer on a substrate, patterning the metal layer to form a circuit metal layer, forming a nanometer plating layer with a thickness of 5 to 40 nm over the circuit metal layer, and forming a cover layer covering the substrate and the nanometer plating layer with improved adhesion by chemical bonding to form the laminate circuit board. Another method includes forming the circuit metal layer and the nanometer plating layer on a preforming substrate, pressing the preforming substrate against a substrate to push the circuit metal layer and the nanometer plating layer into the substrate, and removing the preforming substrate. By the present invention, the density of circuit is increased and much denser circuit can be implemented on the substrate with the same area.

Abstract translation: 公开了一种制造叠层电路板的方法。 该方法包括在基板上形成金属层，图案化金属层以形成电路金属层，在电路金属层上形成厚度为5至40nm的纳米电镀层，并形成覆盖基板的覆盖层和 纳米电镀层通过化学键合具有改善的粘附性以形成层压电路板。 另一种方法包括在预成型基板上形成电路金属层和纳米电镀层，将预成型基板压靠在基板上，将电路金属层和纳米电镀层推入基板，以及去除预成形基板。 通过本发明，电路的密度增加，并且可以在具有相同面积的基板上实现更加密集的电路。