公开(公告)号：US20110139314A1

公开(公告)日：2011-06-16

申请号：US12776607

申请日：2010-05-10

Applicant: Cheng-En Ho ,  Chi-Ming Lin

Inventor： Cheng-En Ho ,  Chi-Ming Lin

IPC: B23K31/02 ,  B23K1/20

CPC classification number: B23K1/20 ,  B23K1/0016 ,  B23K1/008 ,  B23K2101/42 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/11848 ,  H01L2224/11849 ,  H01L2224/13111 ,  H01L2924/14 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method for inhibiting the growth of a nickel-copper-tin intermetallic (i.e. (Ni,Cu)3Sn4) layer at the (Cu,Ni)6Sn5/nickel interface of a solder joint is described as follows. A Sn—Ag—Cu solder alloy with a Cu-content of 0.5˜1 weight percent (wt. %) is provided. The solder alloy is disposed on a surface finish of a soldering pad, having a nickel-based metallization layer. A material of the solder alloy further includes palladium. The solder alloy is joined with the surface finish, so as to form the solder joint containing palladium that enables to inhibit the growth of the undesired (Ni,Cu)3Sn4 layer between the (Cu,Ni)6Sn5 and nickel in the subsequent use at temperatures ranging from 100° C. to 180° C.

Abstract translation: 焊接接头的（Cu，Ni）6Sn5 /镍界面处的镍 - 铜 - 锡 - 金属间化合物（即（Ni，Cu）3Sn4）层的生长抑制方法如下所述。 提供Cu含量为0.5〜1重量％（重量％）的Sn-Ag-Cu焊料合金。 焊料合金设置在具有镍基金属化层的焊盘的表面光洁度上。 焊料合金的材料还包括钯。 焊料合金与表面光洁度相结合，以形成含钯的焊点，其能够抑制（Cu，Ni）6 Sn 5和镍之间不期望的（Ni，Cu）3 Sn 4层在随后的使用中的生长 温度范围从100°C到180°C

公开(公告)号：US08092621B2

公开(公告)日：2012-01-10

申请号：US12776607

申请日：2010-05-10

Applicant: Cheng-En Ho ,  Chi-Ming Lin

Inventor： Cheng-En Ho ,  Chi-Ming Lin

IPC: B23K38/28 ,  B23K31/02

CPC classification number: B23K1/20 ,  B23K1/0016 ,  B23K1/008 ,  B23K2101/42 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/11848 ,  H01L2224/11849 ,  H01L2224/13111 ,  H01L2924/14 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method for inhibiting the growth of a nickel-copper-tin intermetallic (i.e. (Ni,Cu)3Sn4) layer at the (Cu,Ni)6Sn5/nickel interface of a solder joint is described as follows. A Sn—Ag—Cu solder alloy with a Cu-content of 0.5˜1 weight percent (wt. %) is provided. The solder alloy is disposed on a surface finish of a soldering pad, having a nickel-based metallization layer. A material of the solder alloy further includes palladium. The solder alloy is joined with the surface finish, so as to form the solder joint containing palladium that enables to inhibit the growth of the undesired (Ni,Cu)3Sn4 layer between the (Cu,Ni)6Sn5 and nickel in the subsequent use at temperatures ranging from 100° C. to 180° C.

Abstract translation: 焊接接头的（Cu，Ni）6Sn5 /镍界面处的镍 - 铜 - 锡 - 金属间化合物（即（Ni，Cu）3Sn4）层的生长抑制方法如下所述。 提供Cu含量为0.5〜1重量％（重量％）的Sn-Ag-Cu焊料合金。 焊料合金设置在具有镍基金属化层的焊盘的表面光洁度上。 焊料合金的材料还包括钯。 焊料合金与表面光洁度相结合，以形成含钯的焊点，其能够抑制（Cu，Ni）6 Sn 5和镍之间不期望的（Ni，Cu）3 Sn 4层在随后的使用中的生长 温度范围从100°C到180°C

公开(公告)号：US20130284500A1

公开(公告)日：2013-10-31

申请号：US13455364

申请日：2012-04-25

Applicant: Jun-Chung Hsu ,  Chi-Ming Lin ,  Tso-Hung Yeh ,  Ya-Hsiang Chen

Inventor： Jun-Chung Hsu ,  Chi-Ming Lin ,  Tso-Hung Yeh ,  Ya-Hsiang Chen

IPC: H05K1/03 ,  H05K1/02

CPC classification number: H05K3/388 ,  H05K3/381 ,  H05K2203/0307

Abstract: A laminate circuit board structure from button up including a substrate, a circuit metal layer, a nanometer plating layer and a cover layer is disclosed. The nanometer plating layer is smooth a thickness of 5-40 nm, and can be directly forming on the outer surface of the circuit metal layer or manufactured by firstly forming the nanometer plating layer on a preforming substrate, then pressing the substrate against the nanometer plating layer, and finally removing the preforming substrate. The junction adhesion between the nanometer plating layer and the cover layer or the substrate is improved by chemical bonding. Therefore it does not need to roughen the circuit metal layer or reserve circuit width for compensation such that the density of the circuit increases and much more dense circuit can be implemented in the substrate with the same area.

Abstract translation: 公开了一种按钮的层叠电路板结构，包括基板，电路金属层，纳米电镀层和覆盖层。 纳米电镀层的光滑厚度为5-40nm，可以直接形成在电路金属层的外表面上，或者通过首先在预成型基板上形成纳米镀层，然后将衬底压在纳米电镀上 层，最后除去预成型基板。 通过化学键合可以改善纳米镀层与覆盖层或衬底之间的结合性。 因此，不需要粗糙化电路金属层或补偿电路宽度，使得电路的密度增加，并且可以在具有相同面积的基板中实现更加密集的电路。

公开(公告)号：US06661032B2

公开(公告)日：2003-12-09

申请号：US10179212

申请日：2002-06-26

Applicant: Hsiang-Chih Meng ,  Li-Ching Ma ,  Chi-Ming Lin

Inventor： Hsiang-Chih Meng ,  Li-Ching Ma ,  Chi-Ming Lin

IPC: H01L3300

CPC classification number: H01L25/167 ,  H01L23/62 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A LED package structure having an electro-static protective diode, the structure is disclosed. The structure comprises: an electro-static protective diode having an n-type electrode mounted on a lampstand by a conductive paste layer, so that it forms an electrical connecting with a positive leadfame. A LED having a p-type and an n-type electrode positioned on one side and a bottom on the other side of the LED mounted by an insulating layer atop the p-type electrode of the electro-static protective diode. Next a first conductive wire connects between the p-type electrode of the LED and the positive leadframe. A second conductive wire, connects the n-type electrode of the LED with the negative leadframe. A third conductive wire connects the p-type electrode of the electro-static protection diode to the negative electrode of the leadframe. Transparent resin is finally used to form a dome-shaped package.

公开(公告)号：US20130255858A1

公开(公告)日：2013-10-03

申请号：US13437933

申请日：2012-04-03

Applicant: Jun-Chung Hsu ,  Chi-Ming Lin ,  Tso-Hung Yeh ,  Ya-Hsiang Chen

Inventor： Jun-Chung Hsu ,  Chi-Ming Lin ,  Tso-Hung Yeh ,  Ya-Hsiang Chen

IPC: B32B38/10 ,  B32B38/08

CPC classification number: H05K3/282 ,  H05K1/0366 ,  H05K3/103 ,  H05K3/146 ,  H05K3/16 ,  H05K3/202 ,  H05K3/244 ,  H05K3/381 ,  H05K3/384 ,  H05K2201/0376 ,  H05K2201/09227 ,  H05K2203/0152 ,  H05K2203/0278 ,  H05K2203/072 ,  Y10T156/10

Abstract: A method of manufacturing a laminate circuit board is disclosed. The method includes forming a metal layer on a substrate, patterning the metal layer to form a circuit metal layer, forming a nanometer plating layer with a thickness of 5 to 40 nm over the circuit metal layer, and forming a cover layer covering the substrate and the nanometer plating layer with improved adhesion by chemical bonding to form the laminate circuit board. Another method includes forming the circuit metal layer and the nanometer plating layer on a preforming substrate, pressing the preforming substrate against a substrate to push the circuit metal layer and the nanometer plating layer into the substrate, and removing the preforming substrate. By the present invention, the density of circuit is increased and much denser circuit can be implemented on the substrate with the same area.

Abstract translation: 公开了一种制造叠层电路板的方法。 该方法包括在基板上形成金属层，图案化金属层以形成电路金属层，在电路金属层上形成厚度为5至40nm的纳米电镀层，并形成覆盖基板的覆盖层和 纳米电镀层通过化学键合具有改善的粘附性以形成层压电路板。 另一种方法包括在预成型基板上形成电路金属层和纳米电镀层，将预成型基板压靠在基板上，将电路金属层和纳米电镀层推入基板，以及去除预成形基板。 通过本发明，电路的密度增加，并且可以在具有相同面积的基板上实现更加密集的电路。

公开(公告)号：US20120130860A1

公开(公告)日：2012-05-24

申请号：US12950962

申请日：2010-11-19

Applicant: Clifford Akihiko Suzuki ,  Aayaz Bhorania ,  Rajesh Selvamani ,  Daniel Schonberg ,  Chi-Ming Lin ,  Jeffrey Johnson ,  John Mullally

Inventor： Clifford Akihiko Suzuki ,  Aayaz Bhorania ,  Rajesh Selvamani ,  Daniel Schonberg ,  Chi-Ming Lin ,  Jeffrey Johnson ,  John Mullally

IPC: G06Q30/00

CPC classification number: G06Q30/02 ,  G06Q30/0629

Abstract: Systems and techniques to provide an improved reputation scoring for products in an online storefront are described. A technique may include obtaining at least one objective measure and at least one subjective measure about a product in an online storefront; calculating a reputation level for the product from the subjective and objective measures; and displaying a listing for the product in the online storefront according to the reputation level. A technique may further include providing feedback to product developers about the reputation level of the product. Other embodiments are described and claimed.

Abstract translation: 描述了为在线店面提供改进的产品信誉评分的系统和技术。 技术可以包括在在线店面中获得关于产品的至少一个客观量度和至少一个主观度量; 从主观和客观的措施计算产品的声誉水平; 并根据信誉级别在线店面显示产品的列表。 技术可以进一步包括向产品开发者提供关于产品的声誉水平的反馈。 描述和要求保护其他实施例。

公开(公告)号：US07509406B2

公开(公告)日：2009-03-24

申请号：US10955688

申请日：2004-09-30

Applicant: Ralph Abdo ,  Jeffrey Allen Case ,  Chi-Ming Lin

Inventor： Ralph Abdo ,  Jeffrey Allen Case ,  Chi-Ming Lin

IPC: G06F15/173 ,  G06F15/16

CPC classification number: G06F21/105 ,  G06F2221/2135 ,  H04L67/306

Abstract: Systems, computer-program-products, and methods for managing terminal services (TS) accounts and sessions for online utilization of hosted applications are provided. A system is operative to monitor a supply of available TS accounts and create TS accounts in response to detecting that the supply of available TS accounts is below a minimum number. When a request to access a TS session is detected, the system provisions a TS account for the user to immediately access the TS session without entering credentials. The provisioned TS account provides access and is associated with a unique profile. The system is also operative to receive the request to access the hosted application and decrypt credentials generated for the user. A method involves reading a username assigned to a user requesting access, locating the TS account associated with the username, identifying the language associated with the TS account, and launching the hosted application in that language.

Abstract translation: 提供了系统，计算机程序产品和用于管理终端服务（TS）帐户和用于托管应用程序的在线利用的会话的方法。 响应于检测到可用TS帐户的供应低于最小数量，系统可操作以监视可用TS帐户的供应并创建TS帐户。 当检测到访问TS会话的请求时，系统为用户提供TS帐户，以立即访问TS会话而不输入凭据。 提供的TS帐户提供访问权限，并与唯一的配置文件相关联。 系统还可以接收访问托管的应用程序的请求并解密为用户生成的凭证。 一种方法包括读取分配给用户请求访问的用户名，找到与用户名关联的TS帐户，识别与TS帐户相关联的语言，以及启动该语言的托管应用程序。

公开(公告)号：US20070225086A1

公开(公告)日：2007-09-27

申请号：US11386839

申请日：2006-03-23

Applicant: Chi-Ming Lin

Inventor： Chi-Ming Lin

IPC: A63B53/00

CPC classification number: A63B53/04 ,  A63B53/0466 ,  A63B53/047 ,  A63B53/0487 ,  A63B60/00 ,  A63B60/52 ,  A63B60/54 ,  A63B2053/0416 ,  A63B2053/0437 ,  A63B2053/045 ,  A63B2053/0454 ,  A63B2053/0458 ,  A63B2209/00

Abstract: A golf club head includes a golf club head body and a complex plate. The golf club head body includes an assembling opening to mount the complex plate. The complex plate includes a base plate and a protrusion structure which are made of different metal material. The upraised protrusion structure has a buffer structure formed therein. The complex plate has an outer (front) surface and an inner (rear) surface opposite to the outer surface. The protrusion structure is disposed on the inner surface of the complex plate. In assembling operation, the complex plate is received in the assembling opening of the golf club head body so as to constitute the golf club head.

Abstract translation: 高尔夫球杆头包括高尔夫球杆头本体和复合板。 高尔夫球杆头本体包括安装复合板的组装开口。 复合板包括由不同金属材料制成的基板和突起结构。 提升的突起结构具有形成在其中的缓冲结构。 复合板具有与外表面相对的外（前）表面和内（后）表面。 突起结构设置在复合板的内表面上。 在组装操作中，复合板被容纳在高尔夫球杆头本体的组装开口中，以构成高尔夫球杆头。

公开(公告)号：US07448961B2

公开(公告)日：2008-11-11

申请号：US11386839

申请日：2006-03-23

Applicant: Chi-Ming Lin

Inventor： Chi-Ming Lin

IPC: A63B53/04

CPC classification number: A63B53/04 ,  A63B53/0466 ,  A63B53/047 ,  A63B53/0487 ,  A63B60/00 ,  A63B60/52 ,  A63B60/54 ,  A63B2053/0416 ,  A63B2053/0437 ,  A63B2053/045 ,  A63B2053/0454 ,  A63B2053/0458 ,  A63B2209/00

Abstract: A golf club head includes a golf club head body and a complex plate. The golf club head body includes an assembling opening to mount the complex plate. The complex plate includes a base plate and a protrusion structure which are made of different metal material. The upraised protrusion structure has a buffer structure formed therein. The complex plate has an outer (front) surface and an inner (rear) surface opposite to the outer surface. The protrusion structure is disposed on the inner surface of the complex plate. In assembling operation, the complex plate is received in the assembling opening of the golf club head body so as to constitute the golf club head.

Abstract translation: 高尔夫球杆头包括高尔夫球杆头本体和复合板。 高尔夫球杆头本体包括安装复合板的组装开口。 复合板包括由不同金属材料制成的基板和突起结构。 提升的突起结构具有形成在其中的缓冲结构。 复合板具有与外表面相对的外（前）表面和内（后）表面。 突起结构设置在复合板的内表面上。 在组装操作中，复合板被容纳在高尔夫球杆头本体的组装开口中，以构成高尔夫球杆头。

公开(公告)号：US20080059610A1

公开(公告)日：2008-03-06

申请号：US11512785

申请日：2006-08-30

Applicant: Chi-Ming Lin ,  Sheng Zhou ,  Durgesh Nandan ,  Jeffrey Lee Albertson

Inventor： Chi-Ming Lin ,  Sheng Zhou ,  Durgesh Nandan ,  Jeffrey Lee Albertson

IPC: G06F15/173 ,  G06F15/177 ,  G06F15/16

CPC classification number: G06F9/5061 ,  H04L41/0806 ,  H04L43/50

Abstract: Computing systems can be dynamically configured, allocated, and deployed based on user requirements. For example, a user can request a number of servers for dynamic configuration, allocation, and deployment. Embodiments provide a quick and efficient way for users to test code and programs, debug code and programs, and/or perform other configuration and testing operations using one or more computing systems, such as a cluster of servers. Reserved systems are dynamically configured with necessary code and/or content according to user requirements. The reserved cluster of systems can be returned to an available pool once a reservation expires, allowing the returned systems to be used for a subsequent reservation.

Abstract translation: 可以根据用户需求动态配置，分配和部署计算系统。 例如，用户可以请求多个服务器进行动态配置，分配和部署。 实施例为用户测试代码和程序，调试代码和程序，和/或使用一个或多个计算系统（如服务器集群）执行其他配置和测试操作提供了一种快速有效的方式。 保留的系统根据用户要求动态配置必要的代码和/或内容。 一旦保留到期，保留的系统集群可以返回到可用的池中，允许将返回的系统用于后续预留。