Abstract:
A system and method for forming a resistor system is provided. An embodiment comprises a resistor formed in a U-shape. The resistor may comprise multiple layers of conductive materials, with a dielectric layer filling the remainder of the U-shape. The resistor may be integrated with a dual metal gate manufacturing process or may be integrated with multiple types of resistors.
Abstract:
A circuit board and a method for manufacturing the same are disclosed. The circuit board of the present invention comprises: a carrier board, wherein a first circuit layer is disposed on at least one surface of the carrier board, and the first circuit layer comprises plural conductive pads; a protein dielectric layer disposed on the surface of the carrier board and the first circuit layer, wherein the protein dielectric layer has plural openings to expose the conductive pads; and a second circuit layer disposed on a surface of the protein dielectric layer, wherein the second circuit layer comprises plural first conductive vias, and each first conductive via is correspondingly formed in the opening and electrically connects to the conductive pad.
Abstract:
Provided is a method and structure for utilizing advance channel substrate materials in semiconductor manufacturing. Advanced channel substrate materials such as germanium and Group III-V channel substrate materials, are advantageously utilized. One or more capping films including at least a nitride layer are formed over the channel substrate prior to patterning, ion implantation and the subsequent stripping and wet cleaning operations. With the capping layers intact during these operations, attack of the channel substrate material is prevented and the protective films are easily removed subsequently. The films are dimensioned in conjunction with the ion implantation operation to enable the desired dopant profile and concentration to be formed in the channel substrate material.
Abstract:
An improved solar cell module and a method of manufacturing the same are disclosed in the invention. The solar cell modules includes: a solar cell matrix, having a number of conductive wires, for transforming solar energy into electric energy to be outputted; a front sheet, formed on one side of the solar cell matrix, for passing solar light; a back sheet, formed on the other side of the solar cell matrix, for passing solar light; and an isolating cover, covering the solar cell matrix, for protecting the solar cell matrix from stress, humidity and heat. A number of holes are formed through the back sheet and the isolating cover, the conductive wires are soldered with insulated cables passing through the holes, and an adhesive is used to seal the hole and fix the cables.
Abstract:
In an embodiment, an oligoaniline exfoliating agent, as shown in Formula (I), is provided. In Formula (I), R is —H or —NH2, and n is 3 to 30. In another embodiment, exfoliated platelet-shaped clay including the oligoaniline exfoliating agent and a method for preparing the exfoliated platelet-shaped clay are provided.
Abstract:
A memory device comprises a memory array, a status register coupled with the memory array, and a security register coupled with the memory array and the status register. The memory array contains a number of memory blocks configured to have independent access control. The status register includes at least one protection bit indicative of a write-protection status of at least one corresponding block of the memory blocks that corresponds to the protection bit. The security register includes at least one register-protection bit. The register-protection bit is programmable to a memory-protection state for preventing a state change of at least the protection bit of the status register. The register-protection bit is configured to remain in the memory-protection state until the resetting of the memory device.
Abstract:
A sense amplifying method, applied in a memory having a memory cell and a reference cell, includes: charging the memory cell and the reference cell to have a cell current and a reference current, respectively; duplicating the cell current and the reference current to respectively generate a mirrored cell current via a first current path and a mirrored reference current via a second current path and equalizing a first voltage drop generated as the mirrored cell current flows by the first current path and a second voltage drop generated as the mirrored reference current flows by the second current path; and removing the equalization of the first voltage drop and the second voltage drop and adjusting first voltage drop and the second voltage drop according to a first current flowing by the first current path and a second current flowing by the second current path.
Abstract:
An output buffer circuit has a variable output drive strength, depending on a buffer enable signal. Multiple output buffer circuits have a variable combined output drive strength, depending on a set of buffer enable signals.
Abstract:
A method for executing the power on self test (POST) on the computer system and a method for updating the SMBIOS information partially are provided for a computer system with a first memory and a second memory, wherein the first memory comprises a first storage block and a second storage block. A user can previously set the specific SMBIOS information in the second storage block. And during the POST stage, the default SMBIOS information in the BIOS code loaded from the first storage block to the second memory will be partially updated according to the specific SMBIOS information set by the user. As a result, the purpose of using the appropriated SMBIOS information to initiate the computer system can be achieved.
Abstract:
A semiconductor structure comprising an SRAM/inverter cell and a method for forming the same are provided, wherein the SRAM/inverter cell has an improved write margin. The SRAM/inverter cell includes a pull-up PMOS device comprising a gate dielectric over the semiconductor substrate, a gate electrode on the gate dielectric wherein the gate electrode comprises a p-type impurity and an n-type impurity, and a stressor formed in a source/drain region. The device drive current of the pull-up PMOS device is reduced due to the counter-doping of the gate electrode.