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公开(公告)号：US20170122681A1
公开(公告)日：2017-05-04
申请号：US15278340
申请日：2016-09-28
发明人： Tomotsugu Aoyama , Akira Sugawara
IPC分类号： F28F21/08 , C22C9/02 , B21B3/00 , H01L23/373 , H01L21/48 , C22F1/08 , H01L23/367
CPC分类号： F28F21/085 , B21B3/00 , B21B2003/005 , B21B2261/22 , C22C9/02 , C22F1/08 , H01L21/4878 , H01L23/367 , H01L23/3736
摘要： In a method for producing a heat radiating plate 20, the method containing the steps of: finish cold-rolling an annealed material to obtain a strip; causing the strip to wind in the shape of a coil to prepare a coil stock; unwinding the coil stock by means of an uncoiler 10 to obtain a strip 12; causing the strip 12 to pass through a gap between the rolls of a leveler 14 to correct the shape thereof; progressively feeding the corrected strip 12 to a progressive die 18 via a feeder 16 to progressively press-working the strip 12 to produce a heat radiating plate 20, the finish cold-rolling is carried out so that a ratio of the Vickers hardness HV after the finish cold-rolling to the Vickers hardness HV before the finish cold-rolling is not less than 1.2, and the corrected strip 12 is allowed to bend due to its own weight between the leveler 14 and the feeder 16 so that the minimum value of deflection (L1−L0) is 0.5 to 2.0 m assuming that L0 is a distance between a roll at the last sending side of the leveler 14 and a roll at the first entrance side of the feeder 16 and that L1 is the length of the strip 12 between the roll at the last sending side of the leveler 14 and the roll at the first entrance side of the feeder 16.
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12.发明授权Cu-Ni-Co-Si based copper alloy sheet material and method for producing the same 有权Cu-Ni-Co-Si系铜合金板材及其制造方法公开(公告)号：US09412482B2
公开(公告)日：2016-08-09
申请号：US14068256
申请日：2013-10-31
发明人： Toshiya Kamada , Takashi Kimura , Weilin Gao , Fumiaki Sasaki , Akira Sugawara
CPC分类号： H01B1/026 , C21D2201/05 , C21D2211/004 , C22C9/06 , C22F1/08
摘要： A Cu—Ni—Co—Si based copper alloy sheet material has second phase particles existing in a matrix, with a number density of ultrafine second phase particles is 1.0×109 number/mm2 or more. A number density of fine second phase particles is not more than 5.0×107 number/mm2. A number density of coarse second phase particles is 1.0×105 number/mm2 or more and not more than 1.0×106 number/mm2. The material has crystal orientation satisfying the following equation (1): I{200}/I0{200}≧3.0 (1) wherein I{200} represents an integrated intensity of an X-ray diffraction peak of the {200} crystal plane on the sheet material sheet surface; and I0{200} represents an integrated intensity of an X-ray diffraction peak of the {200} crystal plane in a pure copper standard powder sample.
摘要翻译： Cu-Ni-Co-Si系铜合金板材具有存在于基体中的第二相粒子，超细二次粒子的数量密度为1.0×10 9个/ mm 2以上。 细密度的第二相颗粒的密度不超过5.0×10 7个/ mm 2。 粗二次粒子的数密度为1.0×10 5个/ mm 2以上且1.0×10 6个/ mm 2以下。 该材料具有满足以下等式（1）的晶体取向：I {200} / I0 {200}≥3.0（1）其中I {200}表示{200}晶面的X射线衍射峰的积分强度 在片材表面上; I0 {200}表示纯铜标准粉末样品中{200}晶面的X射线衍射峰的积分强度。
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公开(公告)号：US20140291159A1
公开(公告)日：2014-10-02
申请号：US14351713
申请日：2012-10-18
发明人： Kentaro Arai , Hiroshi Miyazawa
IPC分类号： C25D17/06
CPC分类号： C25D17/06 , C25D5/022 , C25D7/0635 , C25D7/0671 , C25D7/0685 , C25D17/00
摘要： A partial plating device includes a drum jig which has a plurality of positioning pins provided on the outer peripheral surface thereof, and which feeds a metal member around the outer periphery thereof by engaging the metal member with the positioning pins; a rotating shaft which rotatably supports the drum jig, a jet unit that supplies plating liquid to the metal member, and a brake unit that reduces the circumferential speed of the drum jig, and which is fitted to the rotating shaft. A plating device and a partial plating method in which plating is not carried out on the first region of a metal member on the carrying-in side of the drum jig, but in which plating is carried out on the second region of a metal member on the carrying-out side.
摘要翻译： 局部电镀装置包括滚筒夹具，该滚筒夹具具有设置在其外周面上的多个定位销，并且通过使金属构件与定位销接合而将金属构件周向地供给金属构件; 可旋转地支撑滚筒夹具的旋转轴，向金属构件供应电镀液体的喷射单元，以及减小滚筒夹具的圆周速度并且安装在旋转轴上的制动单元。 电镀装置和部分电镀方法，其中在滚筒夹具的承载侧的金属构件的第一区域上不进行电镀，但是在金属构件的第二区域上进行电镀 执行方面。
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公开(公告)号：US20140248809A1
公开(公告)日：2014-09-04
申请号：US14351586
申请日：2012-10-10
CPC分类号： H01R13/02 , H01R13/03 , H01R13/187 , H01R43/16 , Y10T29/49224
摘要： In a fitting type connecting terminal having male and female terminals, each of which has a tin plating layer formed on an electrically conductive base material, a surface of a contact portion of one of the male and female terminals with the other thereof has a plurality of grooves or recessed portions which are spaced from each other in longitudinal directions, and the grooves or recessed portions are formed so as to satisfy d≦b, d≦a≦L and a+c≦L assuming that the width of each of the grooves or recessed portions is a (μm), the depth thereof being b (μm), the distance between two of the grooves or recessed portions adjacent to each other in the longitudinal directions being c (μm), the sliding distance producible between the male terminal and the female terminal in a state that the male terminal is fitted into and fixed to the female terminal being L (μm), and the maximum grain size of the oxide of abrasion powder producible due to sliding between the male terminal and the female terminal being d (μm).
摘要翻译： 在具有阳，阴端子的配合型连接端子中，每个具有形成在导电基材上的镀锡层，其中一个阳，阴端子的一个接触部分的表面与另一个具有多个 凹槽或凹部在纵向上彼此间隔开，并且凹槽或凹部形成为满足d＆nlE; b，d＆nlE; a＆nlE; L和a + c＆nlE; L，假设每个凹槽的宽度 或凹部为（μm），其深度为b（μm），在长度方向上彼此相邻的两个槽或凹部之间的距离为c（μm），在公端子之间产生的滑动距离 并且在母端子嵌入并固定到母端子的状态下的母端子为L（μm），并且由于阳端子之间的滑动而可生产的磨损粉末的氧化物的最大晶粒尺寸 女性终端为d（μm）。
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公开(公告)号：US20140083671A1
公开(公告)日：2014-03-27
申请号：US14036551
申请日：2013-09-25
发明人： Satoru Ideguchi , Hideyo Osanai , Hirotaka Kotani
IPC分类号： F28F21/08
CPC分类号： F28F21/08 , H01L21/4871 , H01L21/4882 , H01L23/367 , H01L23/3672 , H01L23/3677 , H01L23/3733 , H01L23/3735 , H01L2924/0002 , H01L2924/00
摘要： A heat radiating plate 10 of a metal material includes a flat plate portion 10a, a large number of columnar protruding portions 10b which protrude from one major surface of the flat plate portion and which are integrated with the flat plate portion, and a reinforcing plate member 12 of a material, which has a higher melting point than that of the flat plate portion and columnar protruding portions and which is arranged in a region, which is arranged in the flat plate portion and which is close to one major surface of the flat plate portion, the reinforcing member passing through the flat plate portion to extend in directions substantially parallel to the one major surface of the flat plate portion and having end faces exposed to the outside, the whole surface of the reinforcing member except for the end faces being bonded directly to the flat plate portion.
摘要翻译： 金属材料的散热板10包括平板部分10a，从平板部分的一个主表面突出并与平板部分一体化的多个柱状突出部分10b，以及加强板部件 12，其具有比平板部分和柱状突出部分更高的熔点，并且布置在布置在平板部分中并且靠近平板的一个主表面的区域中 所述加强构件穿过所述平板部分，以在大致平行于所述平板部分的一个主表面的方向延伸并且具有暴露于外部的端面，除了所述端面之外的加强构件的整个表面被接合 直接到平板部分。
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公开(公告)号：US20240234240A9
公开(公告)日：2024-07-11
申请号：US18279089
申请日：2021-12-10
发明人： Koji KOBAYASHI
CPC分类号： H01L23/3735 , B22D19/02 , B22D19/04 , B22D21/007 , C22C21/00 , H01L21/4807 , C22C1/03
摘要： There is provided an aluminum-ceramic bonded substrate in which an aluminum plate comprising aluminum alloy is directly bonded to one surface of a ceramic substrate and an aluminum base plate comprising aluminum alloy is directly bonded to the other surface of the ceramic substrate, wherein the aluminum alloy is the aluminum alloy containing 0.05% by mass or more and 3.0% by mass or less of at least one element selected from nickel and iron in total amount, containing 0.01% by mass or more and 0.1% by mass or less of at least one element selected from titanium and zirconium in total amount, and containing 0% by mass or more and 0.05% by mass or less of at least one element selected from boron or carbon in total amount, with a balance being aluminum.
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公开(公告)号：US20240018680A1
公开(公告)日：2024-01-18
申请号：US18265096
申请日：2021-07-14
发明人： Yosuke SATO , Yutaro HIRAI , Kentaro ARAI
摘要： There is provided an Ag-coated material and its related technique, including a base material and an Ag film on the base material, the Ag film including alternately laminated at least three Ag layers with average crystal grain sizes different by three times or more.
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公开(公告)号：US20230046780A1
公开(公告)日：2023-02-16
申请号：US17790545
申请日：2020-06-10
发明人： Yukiya KATO , Hirotaka KOTANI , Tatsuhiro DOI , Takao TOMIYA , Hiroto NARIEDA
摘要： There is provided a composite plating material and a related technique thereof, the composite plating material including: a base material, and a composite plating layer on the base material, the composite plating layer comprising a composite material containing carbon particles and Sb in an Ag layer, with a carbon content of 6.0 mass % or more and a Sb content of 0.5 mass % or more.
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公开(公告)号：US20220162734A1
公开(公告)日：2022-05-26
申请号：US17602391
申请日：2020-01-30
摘要： There are provided an inexpensive copper alloy plate having excellent bending workability, excellent stress corrosion cracking resistance and excellent stress relaxation resistance while maintaining the high strength thereof, and a method for producing the same. The copper alloy plate has a chemical composition which contains 17 to 32% by weight of zinc, 0.1 to 4.5% by weight of tin, 0.5 to 2.5% by weight of silicon, 0.01 to 0.3% by weight of phosphorus and the balance being copper and unavoidable impurities, the total of the content of silicon and six times as much as the content of phosphorus being 1% by weight or more, the copper alloy plate having a crystal orientation wherein I{220}/I{420} in the range of from 2.5 to 8.0 assuming that the X-ray diffraction intensity on {220} crystal plane on the plate surface of the copper alloy plate is I{220} and that the X-ray diffraction intensity on {420} crystal plane thereon is I{420}.
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公开(公告)号：US20220136126A1
公开(公告)日：2022-05-05
申请号：US17511638
申请日：2021-10-27
发明人： Masaaki Higo , Satoru Ideguchi
摘要： A mask for partial plating capable of performing partial electroplating selectively on a prescribed portion on a surface of an electrically isolated metal member provided on an insulated board is provided. Methods for producing an insulated circuit board and using the mask for partial plating are also provided. The mask for partial plating includes an insulated sheet member having an opening corresponding to the portion to be plated, and a structure including a partial region on one surface in the thickness direction of the insulated sheet member being coated with one or plural conductive sheet members attached to the region. The conductive sheet member is adhered to the surface of the insulated sheet member, for example, with an adhesive or an adhesive member. The conductive sheet member may be engaged in a recessed portion formed on the surface of the insulated sheet member.
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