Abstract:
A conductive pattern film substrate and manufacturing method for combining two anisotropic materials, namely a patterned body and a film layer, without assistance from an intermediate layer. The method includes producing a thermal spraying source for performing a heating operation on a film material to prepare the film material for thermal spraying or semi-thermal spraying and thereby decompose the film material into film particles; and spraying the film particles to a pattern layer disposed on the body and having the pattern by the thermal spraying source to form the film layer having the film particle on the pattern layer, thereby enabling the body to embody electrical characteristics of the pattern.
Abstract:
An apparatus and methods for securely forwarding data packets at a data switching node in a data transport network is provided. The data switching node maintains a switching database of switching entries. Each switching entry has a modification protection feature preventing its modification when activated. Dynamic topology discovery of data network nodes can be disabled via topology discovery control flags associated with individual physical communications ports of the data switching node. Unknown destination flood data traffic is not replicated to physical communications ports having topology discovery disabled or specifying the suppression of replication of such unknown destination data traffic thereto. The advantages are derived from a data switching node being enabled to operate concurrently in friendly and hostile environments while detecting, preventing and reporting incidences of hostile MAC ADDR attacks.
Abstract:
A cooling door assembly includes a frame and a cooling door coupled to the frame. The cooling door includes one or more heat exchangers. The frame is configured to mount to the back of a server rack or other electronics enclosure in such a manner that the cooling door opens to allow access to the electronics servers within the server rack while maintaining a fluidic connection to an external cooling system. The frame is coupled to the external cooling system and the cooling door includes swivel joints configured to provide a fluid path between the cooling door and the frame. In this manner, the frame remains in a fixed position, while the cooling door is configured to rotate relative to the frame so as to open and close, while maintaining the fluid path through the swivel joint.
Abstract:
A foldable bed includes a plurality of connecting bars, a plurality of support bars, and a plurality of stand units. Each of the stand units includes two pivotally connected support legs each having a first end provided with an upper support portion, a second end provided with a lower support portion, and a middle section provided with a pivot portion. Each of the stand units further includes two clamping brackets each mounted on the respective support leg, and two vibration absorbers each mounted in the respective clamping bracket. Thus, when the two support legs are expanded, each of the vibration absorbers on one of the support legs abuts the pivot portion of the other one of the support legs so that the support legs are combined solidly and stably so as to enhance the structural strength of each of the stand units.
Abstract:
A slide cover for enclosing a region comprising an active region on a slide is provided. A slide cover and a slide are also provided. A slide cover for enclosing a region comprising an active region on a slide, where the slide is placed in a clamshell slide holder is also provided.
Abstract:
A new method to form an integrated circuit device is achieved. The method comprises providing a substrate. A sacrificial layer is formed overlying the substrate. The sacrificial layer is patterned to form temporary vertical spacers where conductive bonding locations are planned. A conductive layer is deposited overlying the temporary vertical spacers and the substrate. The conductive layer is patterned to form conductive bonding locations overlying the temporary vertical spacers. The temporary vertical spacers are etched away to create voids underlying the conductive bonding locations.
Abstract:
A cooling door assembly includes a frame and a cooling door coupled to the frame. The cooling door includes one or more heat exchangers. The frame is configured to mount to the back of a server rack or other electronics enclosure in such a manner that the cooling door opens to allow access to the electronics servers within the server rack while maintaining a fluidic connection to an external cooling system. The frame is coupled to the external cooling system and the cooling door includes swivel joints configured to provide a fluid path between the cooling door and the frame. In this manner, the frame remains in a fixed position, while the cooling door is configured to rotate relative to the frame so as to open and close, while maintaining the fluid path through the swivel joint.
Abstract:
A cooling door assembly includes a frame and a cooling door coupled to the frame. The cooling door includes one or more heat exchangers. The frame is configured to mount to the back of a server rack or other electronics enclosure in such a manner that the cooling door opens to allow access to the electronics servers within the server rack while maintaining a fluidic connection to an external cooling system. The frame is coupled to the external cooling system and the cooling door includes swivel joints configured to provide a fluid path between the cooling door and the frame. In this manner, the frame remains in a fixed position, while the cooling door is configured to rotate relative to the frame so as to open and close, while maintaining the fluid path through the swivel joint.
Abstract:
A patch having a notch therein and a tie coupled thereto is used to provide a closure for a garment, such as a gown. The notch is formed along an edge of the patch, and the tie is coupled to the patch such that it is positioned to extend across and beyond the notch. The notch acts to disperse tension on the patch when tension is applied to the tie. A gown having a notched patch is also disclosed.
Abstract:
In some embodiments, the present disclosure relates to systems, compositions, and methods for treating a microarray. The compositions include a superwetting agent. The methods include contacting the microarray with an aqueous mixture including the superwetting agent after a hybridization step. Kits for carrying out the methods are also provided.