Abstract:
A semiconductor integrated circuit includes first to eighth column selection transistors and ninth to twelfth column selection transistors. The ninth column selection transistor is connected to the first and second column selection transistors. The tenth column selection transistor is connected to the third and fourth column selection transistors. The eleventh column selection transistor is connected to the fifth and sixth column selection transistors. The twelfth column selection transistor is connected to the seventh and eighth column selection transistors. A first column selection line is connected to gates of the first, third, fifth and seventh column selection transistors. A second column selection line is connected to gates of the second, fourth, sixth and eighth column selection transistors. Third to sixth column selection lines are connected to gates of the ninth to twelfth column selection transistors, respectively.
Abstract:
A semiconductor integrated circuit device according to the present invention includes a booster circuit 1 for raising an external power supply voltage Vccext, a level detecting circuit 2 for detecting fluctuation in a stepped-up voltage Vccint2, an internal voltage generating circuit 3 for generating an internal voltage Vccint on the basis of the stepped-up voltage Vccint2, an address buffer 4, an address decoder 5, and a memory cell array 6 of an EEPROM structure. The level detecting circuit 2 includes a first level detecting part for performing level detection during a memory access state, and a second level detecting part for performing level detection during a stand-by state. During the stand-by state, the internal voltage generating circuit 3 short-circuits the stepped-up voltage Vccint2 and the internal voltage Vccint. The second level detecting part has lower power consumption than that of the first level detecting part, so that it is possible to reducing the power consumption during the stand-by state without lowering the driving voltage.
Abstract:
According to one embodiment, a memory system includes a first nonvolatile semiconductor memory, a second nonvolatile semiconductor memory and a controller. The first memory has memory cells and executes a first operation that is at least one of write, read, and erase operations with respect to the memory cells. The first operation includes a first sub-operation and a second-sub operation that consume a current which is equal to or higher than a predetermined current. The second memory has memory cells and executes a second operation that is at least one of write, read, and erase operations with respect to the memory cells. The second operation includes a third sub-operation and a fourth sub-operation that consume a current which is equal to or higher than the predetermined current. The controller controls the first operation and the second operation of the first memory and the second memory.
Abstract:
When performing a word line leak test to determine a leak state of the word lines, the control circuit applies, from the voltage control circuit to the word lines connected to the memory cell array written with test pattern data, voltages corresponding to the test pattern data. Thereafter, it switches the transfer transistors to a nonconductive state, thereby setting the word lines in a floating state. After a lapse of a certain time from switching of the transfer transistors to a nonconductive state, it activates the sense amplifier circuit to perform a read operation in the memory cell array. Then it compares a result of the read operation with an expectation value corresponding to the test pattern data.
Abstract:
A semiconductor storage device comprises: a sense amplifier circuit; a first data retaining circuit and a second data retaining circuit configured to retain data and threshold voltage information, the second data retaining circuit output the data and the threshold voltage information to the outside; and a control circuit configured to control operation. The sense amplifier circuit is configured to perform a data-read operation and a threshold-voltage-information read operation at the same time. The control circuit is configured to control read operations so that either one of the data or the threshold voltage information for which a read operation is finished earlier is output from the second data retaining circuit, and the other one of the data or the threshold voltage information for which a read operation is not finished yet is read from a memory cell array and retained in the first data retaining circuit.
Abstract:
A NAND type flash memory includes first to third memory cell transistors having current paths connected in series between one end of a current path of each of first and second selection transistors, and each having a control gate and a charge storage layer, the first and second memory cell transistors being adjacent to the first and second selection transistors, the third memory cell transistor being positioned between the first and second memory cell transistors, the third memory cell transistor holding data having not less than three bits, the first memory cell transistor holding 2-bit data in which middle and upper pages is written by skipping a lower page, and a lower page verify voltage being set when writing the middle page, and a middle page verify voltage is set when writing the upper page, changing a position of a threshold distribution of the first memory cell transistor.
Abstract:
First and second data retaining circuits retain data read from memory cell and threshold voltage information indicating where in one of plural threshold voltage distributions threshold voltage of memory cell is located. Calculation device executes calculations among data retained in first and second data retaining circuit and data read by sense amplifier.Control circuit executes first operation of reading data from adjoining memory cell connected to second word line adjoining first word line connected to selected memory cell and retaining the data in first data retaining circuit, and second operation of changing respective word line voltages applied to first word line for reading data or threshold voltage information among plural values and selecting one of plural data read out by the plural values based on data retained in first data retaining circuit. Third operation of externally outputting selected data is executed simultaneously with one of successive first and second operations.
Abstract:
A nonvolatile semiconductor memory device includes a nonvolatile memory which includes a block having a plurality of memory cell groups, each of the memory cell groups being electrically connected to a plurality of bit lines and electrically connected to a common word line, each memory cell being recordable of a plurality of bits, a first register which stores information obtained by correcting first data to be written to a first word line, and a control circuit which sets a set potential in the first register and writes the bits to a write target first memory cell at a time using the information in the first register, the set potential being obtained by subtracting, from a target potential to be finally set in the first memory cell, a potential increase which is generated by setting a potential in an unwritten second memory cell adjacent to the first memory cell.
Abstract:
The non-volatile semiconductor memory device has a circuit which maintains and holds the potentials of bit lines, and either ones of even-bit lines or odd-bit lines are connected to the circuit. When the bit line potential holding circuit is connected to even-bit lines and a block copy is performed, data is first outputted to the even-bit lines, and after the potential of the even-bit line is determined, the bit line potential holding circuit operates. Then, biasing of the potential of the even-bit lines is carried out by the bit line potential holding circuit, the potentials of the bit lines are maintained and held. At the same time, data is outputted to the odd-bit lines and the potentials of the odd-bit lines are determined. Then, a program voltage is supplied to a selected word line, and data is simultaneously written (programmed) in the memory cells connected to the even-bit lines, and the memory cells connected to the odd-bit lines.
Abstract:
A memory system includes a memory cell array, a bit line switch, first and second page buffers, a column switch, an error correction circuit, and control circuits. The second page buffer can swap data with the first page buffer. The control circuits controls the bit line switch and the first and second page buffers, sequentially reads, page by page, one or more pages from the mth (m is a positive integer) page to the nth (n is an integer greater than m) page of the first block in the memory cell array, controls the error correction circuit to perform error correction calculation by the error correction circuit, controls the first and second data buffers and the bit line switch, and controls to perform write in the second block in the erase state in the memory cell array.