Abstract:
A vehicle lighting device is provided. The vehicle lighting device includes a main body and a connecting unit. The main body has an upper film, a lower film, a light guide filler, and at least one lower light-emitting element. The upper film has a setting area and a light-permeable layer at a center of the setting area. A distance spaced apart between an edge of the light-permeable layer and an edge of the setting region is no more than 5 cm. The at least one lower light-emitting element is embedded in the light guide filler arranged between the lower film and the upper film and is located on a part of the setting region defined by orthogonally projecting the lower conductive layer onto the setting region. The connecting unit can electrically connect to a control circuit to control the at least one lower light-emitting element.
Abstract:
A flexible circuit board includes a substrate and a circuit unit formed on the substrate. The substrate has two carrying segments and a connecting segment, and the two carrying segments are connected by the connecting segment. The circuit unit has a plurality of conductive lines and at least one connecting line, and each conductive line and the connecting line are separated from each other. The conductive lines are respectively formed on the two carrying segments, and the connecting line is formed on the connecting segment and the two carrying segments. Two opposite ends of each carrying segment are configured to connect with each other to form a tubular structure, and two opposite ends of the connecting line are configured to connect to two adjacent conductive lines respectively formed on the two tubular structures, thereby the circuit unit is formed as a coil.
Abstract:
A method of manufacturing a printed circuit board precursor includes the steps of providing a substrate. Then the surface of the substrate is catalyzed to form a catalytic layer by a catalyst. Subsequently, a conductive layer is formed and attached to the surface of the catalytic layer. Finally, a metal layer is electroplated on the conductive layer. A printed circuit board precursor includes a substrate having a surface. Specifically, the surface is catalytically treated to form a catalytic layer. The precursor also includes a conductive layer which is attached to and covers the catalytic layer and a metal layer which is disposed on the conductive layer.
Abstract:
A thin key structure includes a circuit module, a frame having has a retaining portion, an elastic member disposed on the circuit module and arranged in the frame, and a pressable module having a positioning sheet and a key. The positioning sheet has an assembling portion installed on the frame, a connecting portion, and an extending portion connecting there-between. The key has a key body fixed on the connecting portion and a stopping portion extended from the key body. The key body has a concaving portion aligning the extending portion. The stopping portion is movably arranged in the retaining portion. When non-center portion of the key body is pressed, part of the stopping portion, away from the pressed portion of the key body, abuts against the corresponding retaining portion for being a fulcrum, such that the pressed portion of the key body rotates to press the elastic member.
Abstract:
A keyboard device comprises: a main body, a cover and an interlocking unit. An outer surface of the main body has a keyboard pattern partitioned into protruding keypad structures by a plurality of shallow grooves. The cover extends from one side of the main body, can be bent toward and cover the keyboard pattern, and includes at least one fold line partitioning the cover into a support portion and a carrying portion. Two sides of the support portion respectively connect to the main body and the carrying portion. The carrying portion is free to be bent along the fold line. The holding unit is disposed on the carrying portion. When the holding unit is bent along the fold line and the lower edge of the interlocking unit moves toward the main body and abuts a stopper unit thereon, the holding unit is slanted with respect to the outer surface.
Abstract:
A thin key structure includes a circuit module, a frame having has a retaining portion, an elastic member disposed on the circuit module and arranged in the frame, and a pressable module having a positioning sheet and a key. The positioning sheet has an assembling portion installed on the frame, a connecting portion, and an extending portion connecting there-between. The key has a key body fixed on the connecting portion and a stopping portion extended from the key body. The key body has a concaving portion aligning the extending portion. The stopping portion is movably arranged in the retaining portion. When non-center portion of the key body is pressed, part of the stopping portion, away from the pressed portion of the key body, abuts against the corresponding retaining potion for being a fulcrum, such that the pressed portion of the key body rotates to press the elastic member.
Abstract:
The invention relates to a test strip. The test strip comprises an insulating sheet; a metallic circuit layer disposed on the insulating sheet, the metallic circuit layer including at least an electrode section; a sensing reagent layer provided on the electrode section; an intermediate layer disposed to cover the insulating sheet and the metallic circuit layer, the intermediate layer having an opening to expose the sensing reagent layer and the electrode section; and a cover disposed to cover the intermediate layer and the insulating sheet, and expose part of the metallic circuit layer, the cover having two holes corresponding to the opening. The test strip is provided in a combination of printing manner and chemical plating such as metallic ion replacement or electroless plating to form the metallic circuit layer readily so as to enhance the stability of resistance and the test accuracy.
Abstract:
A circuit board structure includes a circuit board and an adhesive layer. The circuit board has a first board surface and an opposite second board surface, and the first board surface defines a predetermined portion. The circuit board has a conductive circuit disposed on the first board surface and at least partially arranged on the predetermined portion. The adhesive layer is seamlessly formed on the predetermined portion of the first board surface of the circuit board, and the conductive circuit arranged on the predetermined portion is seamlessly covered by the adhesive layer. A surface of the adhesive layer arranged away from the circuit board is a planar bonding surface.
Abstract:
A thin key structure includes a supporting module, a circuit module disposed on the supporting module, a frame and a metal dome disposed on the circuit module, a pressable module, and a guiding portion. The supporting module has a supporting plate and a protrusion disposed on the supporting plate. The supporting plate has a plane defined therein, the plane defines a perpendicular central axis, and the protrusion is arranged on the central axis. The circuit module has a protruding segment formed by the protrusion. The metal dome is arranged in the frame, and has a contact portion arranged on the central axis. The guiding portion arranged on the central axis and is disposed between the contact portion and the pressable module. The metal dome is pressed by the guiding portion to move the contact portion along the central axis and selectively abuts the circuit module.
Abstract:
A method of manufacturing a printed circuit board precursor includes the steps of providing a substrate. Then the surface of the substrate is catalyzed to form a catalytic layer by a catalyst. Subsequently, a conductive layer is formed and attached to the surface of the catalytic layer. Finally, a metal layer is electroplated on the conductive layer. A printed circuit board precursor includes a substrate having a surface. Specifically, the surface is catalytically treated to form a catalytic layer. The precursor also includes a conductive layer which is attached to and covers the catalytic layer and a metal layer which is disposed on the conductive layer.