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11.发明授权Method for forming electrical contact to the optical coating of an infrared detector using conductive epoxy 失效使用导电环氧树脂与红外检测器的光学涂层形成电接触的方法
公开(公告)号：US5552326A
公开(公告)日：1996-09-03
申请号：US397706
申请日：1995-03-01
IPC分类号： H01L21/60 , H01L31/0224 , H01L31/18 , H01L21/58
CPC分类号： H01L31/022408 , H01L24/11 , H01L2224/13099 , H01L2924/01013 , H01L2924/01022 , H01L2924/01033 , H01L2924/01038 , H01L2924/01056 , H01L2924/01077 , H01L2924/01079 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/19041
摘要： This is a system and method of forming an electrical contact to the optical coating of an infrared detector using conductive epoxy. The method may comprise: forming thermal isolation trenches 22 and bias contact vias 23 in a substrate 20; depositing a trench filler 24 in the thermal isolation trenches 22; depositing conductive epoxy 50 into the bias contact vias 23; replanarizing; depositing a common electrode layer 31 over the thermal isolation trenches 22 and vias 23; depositing an optical coating 26 above the common electrode layer 31; mechanically polishing a backside of the substrate 20 to expose the trench filler 24 and conductive epoxy 50; depositing a contact metal 34 on the backside of the substrate 20; etching the contact metal 34 and the trench filler 24 to form pixel mesas of the contact metal 34 and the substrate 20.
摘要翻译： 这是使用导电环氧树脂形成与红外检测器的光学涂层的电接触的系统和方法。 该方法可以包括：在衬底20中形成热隔离沟槽22和偏置接触通孔23; 在热隔离槽22中沉积沟槽填料24; 将导电环氧树脂50沉积到偏压接触通孔23中; 补充; 在热隔离槽22和通孔23上沉积公共电极层31; 在公共电极层31上沉积光学涂层26; 机械抛光衬底20的背面以暴露沟槽填料24和导电环氧树脂50; 在衬底20的背面沉积接触金属34; 蚀刻接触金属34和沟槽填料24以形成接触金属34和基板20的像素台面。
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公开(公告)号：US5426304A
公开(公告)日：1995-06-20
申请号：US182865
申请日：1994-01-13
CPC分类号： H01L37/02
摘要： In an exemplary thermal imaging system (20, 120, 220 and 320), a thermal isolation structure (50 and 150) is disposed on an integrated circuit substrate (70 and 170) for electrically connecting and mechanically bonding a corresponding focal plane array (30, 130, and 230) of thermal sensors (40, 140, and 240). Each mesa-type structure (52, 54 and 152) includes at least one mesa conductor (56, 58, 156 and 158) that extends from the top of the mesa-type structure (52, 54 and 152) to an adjacent contact pad (72 and 74). The mesa conductors (56, 58, 156 and 158) provide both biasing voltage (V.sub.B) for the respective thermal sensor (40 and 240) and a signal flowpath (V.sub.s) for the respective thermal sensor (40 and 240). The mesa conductors (56, 58, 156 and 158) may be used to provide biasing voltage (V.sub.B) to either a single ferroelectric element (242 and 243) having a void space (277 and 279) or a pair of ferroelectric elements (42 and 44). When the focal plane array (30, 130 and 230) is bonded to the corresponding array of mesa-type structures (52, 54 and 152), a thermally isolated, but electrically conductive path is provided between electrodes (43 and 45) of the thermal sensor (40 and 240) and the corresponding contact pad (72 and 172) of the integrated circuit substrate (70 and 74).
摘要翻译： 在示例性热成像系统（20,120,220和320）中，热隔离结构（50和150）设置在集成电路衬底（70和170）上，用于电连接和机械地结合相应的焦平面阵列（30 ，130和230）热传感器（40,140和240）。 每个台面型结构（52,54和152）包括从台面型结构（52,54和152）的顶部延伸到相邻接触垫的至少一个台面导体（56,58,156和158） （72和74）。 台面导体（56,58,156和158）为相应的热传感器（40和240）提供偏压（VB）和相应的热传感器（40和240）的信号流路（Vs）。 台面导体（56,58,156和158）可用于向具有空隙空间（277和279）或一对铁电元件（42）的单个铁电元件（242和243）提供偏置电压（VB） 和44）。 当焦平面阵列（30,130和230）被结合到相应的台面型结构（52,54和152）阵列时，热隔离但是导电的路径被提供在电极（43和45）之间 热传感器（40和240）以及集成电路基板（70和74）的相应接触焊盘（72和172）。
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公开(公告)号：US5370301A
公开(公告)日：1994-12-06
申请号：US177038
申请日：1994-01-04
申请人： James F. Belcher , Gary W. Andrews
发明人： James F. Belcher , Gary W. Andrews
CPC分类号： H01L21/67144 , H01L24/75 , H01L24/81 , H01L2224/8121 , H01L2224/81801 , H01L2924/01013 , H01L2924/01033 , H01L2924/01038 , H01L2924/01042 , H01L2924/01049 , H01L2924/0105 , H01L2924/01056 , H01L2924/01073 , H01L2924/01074 , H01L2924/01077 , H01L2924/01082 , H01L2924/014 , H01L2924/14
摘要： A bonding apparatus (40) is provided for use in coupling a first substrate (20) with flip chip type interconnections (24) to a second substrate (22) having matching flip chip type interconnections (26). The bonding apparatus (40) includes a pedestal assembly (50) which may be used to align and couple the first substrate (20) with the second substrate (22) and transport the substrates (20 and 22) from the bonding apparatus (40) to a heater assembly (110). Magnetic force is used to maintain the alignment of the first substrate (20) with the second substrate (22) during temperature cycling within the heater assembly. The pedestal assembly (50) includes a magnet slidably disposed on the exterior of the pedestal assembly (50). For some applications, the magnet (60) may be formed from one or more permanent magnets. For other applications, magnet (60) may be formed from one or more electromagnets.
摘要翻译： 提供了一种用于将第一衬底（20）与倒装芯片型互连（24）耦合到具有匹配倒装芯片型互连（26）的第二衬底（22）的接合装置（40）。 接合装置（40）包括可用于将第一基板（20）与第二基板（22）对准和联接并将基板（20和22）从接合装置（40）传送的基座组件（50） 到加热器组件（110）。 在加热器组件内的温度循环期间，使用磁力来保持第一基板（20）与第二基板（22）的对准。 基座组件（50）包括可滑动地设置在基座组件（50）的外部上的磁体。 对于一些应用，磁体（60）可以由一个或多个永磁体形成。 对于其它应用，磁体（60）可以由一个或多个电磁体形成。
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公开(公告)号：US6083557A
公开(公告)日：2000-07-04
申请号：US958918
申请日：1997-10-28
IPC分类号： C23C14/06 , G01J5/20 , G01J5/34 , H01L27/146 , C23C16/00
CPC分类号： C23C14/06 , G01J5/20 , G01J5/34 , H01L27/1465
摘要： This is a system and method of forming a conductive polymer optical coating on an infrared detection system. The apparatus may include an upper vacuum chamber, a shutter assembly mounted inside the upper vacuum chamber, a substrate holder disposed inside the shutter assembly, wherein the shutter assembly is capable of shielding or exposing the substrate to the upper vacuum chamber, an orifice connected to the upper vacuum chamber for control of a flow rate for the upper vacuum chamber, a first mechanical pump system connected to the orifice, a lower vacuum chamber connected to the upper vacuum chamber on a side opposite the shutter assembly, an electron beam assembly for providing a low-melting-point electrical conductor vapor, disposed inside the lower vacuum chamber, wherein the electron beam assembly is directed toward the shutter assembly in the upper vacuum chamber, a second mechanical pump system and a cryopump connected to the lower vacuum chamber, a polymer generation chamber for providing polymer vapor, connected to the upper vacuum chamber on a side perpendicular to the shutter assembly, a vaporizer surrounding a first portion of the polymer generation chamber, a pyrolysis furnace surrounding a second portion of the polymer generation chamber, and a post pyrolysis heater surrounding a third portion of the polymer generation chamber.
摘要翻译： 这是在红外检测系统上形成导电聚合物光学涂层的系统和方法。 该设备可以包括上真空室，安装在上真空室内部的活门组件，设置在活门组件内部的衬底保持器，其中活门组件能够将衬底屏蔽或暴露于上真空室， 用于控制上真空室的流量的上真空室，连接到孔的第一机械泵系统，在与快门组件相对的一侧连接到上真空室的下真空室，用于提供 设置在下部真空室内的低熔点电导体蒸汽，其中电子束组件指向上部真空室中的活门组件，第二机械泵系统和连接到下部真空室的低温泵， 用于提供聚合物蒸气的聚合物产生室，在垂直于活门的一侧连接到上真空室 包括围绕聚合物产生室的第一部分的蒸发器，围绕聚合物产生室的第二部分的热解炉和围绕聚合物产生室的第三部分的后裂解加热器。
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公开(公告)号：US6080987A
公开(公告)日：2000-06-27
申请号：US958955
申请日：1997-10-28
IPC分类号： G01J5/08 , H01L27/146
CPC分类号： G01J5/02 , G01J5/022 , G01J5/024 , G01J5/08 , G01J5/0853 , H01L27/1462 , H01L27/1465 , H01L27/1469 , G01J5/046
摘要： This is a novel conductive-polymer optical coating for infrared detection and method of making the same. The system may comprise an integrated circuit substrate itself comprising a plurality of mesas and comprising via connections on an upper portion of each of the mesas. The system further comprises a plurality of backside electrical contacts bonded to the via connections, a plurality of infrared-sensitive pixels overlying the electrical contacts, and a conductive-polymer optical coating overlying and electrically connecting the pixels. A method of forming an embodiment of the present invention may comprise forming a conductive-polymer optical coating over a substrate, forming a contact metal on a backside of the substrate, and processing the contact metal, the substrate and the common electrode to form capacitor pixels of the contact metal, the substrate and the corresponding portion of the optical coating.
摘要翻译： 这是用于红外检测的新型导电聚合物光学涂层及其制造方法。 该系统可以包括集成电路基板本身，其包括多个台面并且包括每个台面的上部上的通孔连接。 该系统还包括多个粘合到通孔连接的背面电触点，覆盖电触点的多个红外敏感像素和覆盖并电连接像素的导电聚合物光学涂层。 形成本发明的实施例的方法可以包括在衬底上形成导电聚合物光学涂层，在衬底的背面形成接触金属，以及处理接触金属，衬底和公共电极以形成电容器像素 的接触金属，基底和光学涂层的相应部分。
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公开(公告)号：US5792377A
公开(公告)日：1998-08-11
申请号：US460281
申请日：1995-06-02
摘要： An array of thermal sensitive elements (16) may be formed from a pyroelectric substrate (46) having an infrared absorber and common electrode assembly (18) attached thereto. A first layer of electrically conductive contacts (60) is formed to define in part masked (61) and unmasked (68) regions of the substrate (46). A second layer of electrically conductive contacts (62) may be formed on the first layer of contacts (60). A mask layer (66) is formed to encapsulate the exposed portions of the second layer of contacts (62). The unmasked regions (68) are exposed to an etchant (70) and irradiated to substantially increase the reactivity between the unmasked regions (68) and the etchant (70) such that during irradiation, the etchant (70) removes the unmasked regions (68) substantially faster than the first layer of contacts (60) and the mask layer (66).
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公开(公告)号：US5705041A
公开(公告)日：1998-01-06
申请号：US225601
申请日：1994-04-07
CPC分类号： H01L37/02 , C23C14/021
摘要： A method of improving the responsivity of a pyroelectric device including providing a pyroelectric element of less than maximum theoretical density having holes therein extending to a surface of the element and having contaminants at the surface (22), cleaning the contaminants from the surface and metallizing the surface prior to contaminant reformation on the surface. The pyroelectric element is preferably a ferroelectric element and preferably barium strontium titanate. The step of cleaning can be by oxygen plasma, acid etch or a combination thereof. When the combination of cleaning steps is used, the step of cleaning comprises etching the surface and then oxygen cleaning the surface.
摘要翻译： 一种提高热电装置的响应度的方法，包括提供小于最大理论密度的热电元件，其中具有孔，其中延伸到元件的表面并在表面（22）处具有污染物，从表面清洁污染物并金属化 表面污染物重新形成前的表面。 热电元件优选为铁电元件，优选为钛酸钡锶。 清洁的步骤可以是氧等离子体，酸蚀刻或其组合。 当使用清洁步骤的组合时，清洁步骤包括蚀刻表面，然后对表面进行氧气清洁。
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公开(公告)号：US5653892A
公开(公告)日：1997-08-05
申请号：US587260
申请日：1996-01-16
申请人： James F. Belcher , Robert A. Owen
发明人： James F. Belcher , Robert A. Owen
摘要： A novel reticulated array comprises islands of ceramic (e.g. BST 40) which are fabricated from novel materials using unique methods of patterning. A front side optical coating (e.g. transparent metal layer 44, transparent organic layer 46 and conductive metallic layer 48) is elevated above the substrate between the ceramic islands. This allows additional material (e.g. polyimide 38) between the optical coating and the substrate above the regions where cavities are to be etched. Etching of the cavities (72) is performed from the back side of the substrate without damaging the front side optical coating. Novel fabrication methods also provide for the convenient electrical and mechanical bonding of each of the massive number of ceramic islands to a signal processor substrate (e.g. Si 80) containing a massive array of sensing circuits.
摘要翻译： 新颖的网状阵列包括使用独特的图案化方法由新型材料制成的陶瓷岛（例如BST 40）。 前面的光学涂层（例如，透明金属层44，透明有机层46和导电金属层48）在陶瓷岛之间的衬底上方升高。 这允许在要被蚀刻空腔的区域之间的光学涂层和衬底之间的附加材料（例如聚酰亚胺38）。 空腔（72）的蚀刻从基板的背面进行，而不会损伤前侧光学涂层。 新颖的制造方法还提供了将大量陶瓷岛中的每一个的便利的电和机械结合到包含大量感测电路阵列的信号处理器基板（例如，Si 80）。
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公开(公告)号：US5623158A
公开(公告)日：1997-04-22
申请号：US483771
申请日：1995-06-07
IPC分类号： H01L31/0216 , H01L31/0224 , H01L31/00 , H01L31/0232
CPC分类号： H01L31/022408 , H01L31/02161 , Y10S148/08 , Y10S148/135 , Y10S438/977
摘要： This is a system and method of forming an electrical contact to the optical coating of an infrared detector. The method may comprise: forming thermal isolation trenches 22 in a substrate 20; depositing a trench filler 24 in the thermal isolation trenches 22; depositing a common electrode layer 31 over the thermal isolation trenches 22; depositing an optical coating 26 above the common electrode layer 31; mechanically thinning the substrate to expose the trench filler 24; etching to remove the trench filler 24 in the bias contact area; depositing a contact metal 34 on the backside of the substrate 20, wherein the contact metal 34 connects to the common electrode layer 31 at bias contact areas 34 around a periphery of the thermal isolation trenches; and etching the contact metal 34 and the trench filler 24 to form pixel mesas of the contact metal 34 and the substrate 20. Bias contact vias 23 may be formed in the bias contact areas and then filled with bias contact metal 49. Alternately, the bias contact vias may also be filled with the contact metal 34. The thermal isolation trenches may be formed by laser vaporization, ion milling or other equivalent methods. In addition, an elevation layer may be formed between the optical coating and the substrate to provide greater tolerances for ion milling. The elevation layer may be filled with a trench filler and then removed after milling. Alternately, the elevation layer may be filled with a metal 49 to connect the bias contact metal to the common electrode in the bias contact areas.
摘要翻译： 这是形成与红外检测器的光学涂层的电接触的系统和方法。 该方法可以包括：在衬底20中形成热隔离沟槽22; 在热隔离槽22中沉积沟槽填料24; 在热隔离槽22上沉积公共电极层31; 在公共电极层31上沉积光学涂层26; 机械地使衬底变薄以暴露沟槽填料24; 蚀刻以去除偏压接触区域中的沟槽填料24; 在衬底20的背面沉积接触金属34，其中接触金属34在围绕热隔离沟槽的周边的偏置接触区域34处连接到公共电极层31; 并且蚀刻接触金属34和沟槽填充剂24以形成接触金属34和衬底20的像素台面。可以在偏置接触区域中形成偏置接触通孔23，然后用偏置接触金属49填充。或者，偏置 接触通孔也可以用接触金属34填充。热隔离沟槽可以通过激光蒸发，离子研磨或其它等效方法形成。 此外，可以在光学涂层和基板之间形成升高层，以提供更大的离子铣削公差。 仰角层可以填充沟槽填料，然后在研磨后除去。 或者，仰角层可以用金属49填充，以将偏置接触金属连接到偏置接触区域中的公共电极。
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公开(公告)号：US5607600A
公开(公告)日：1997-03-04
申请号：US381677
申请日：1995-01-31
申请人： James F. Belcher , Craig Osborn
发明人： James F. Belcher , Craig Osborn
摘要： An infrared sensing array 46 is coupled to a sensing integrated circuit structure 48, and then inter-pixel thermal isolation slots 62 are etched in the optical coating 32 of the infrared sensing array 46. An optional protective material 64 may be deposited over at least the sensing integrated circuit structure 48 for additional protection.
摘要翻译： 红外感测阵列46耦合到感测集成电路结构48，然后在红外感测阵列46的光学涂层32中蚀刻像素间隔热隔离槽62.可选的保护材料64可沉积在至少 感测集成电路结构48用于额外的保护。
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