摘要:
Methods and systems for determining an adaptive crawl rate for a Web crawler based on historical publication data from a Web source are provided. A frequency of publication of the Web source is determined over a specified period of time, and an adaptive crawl rate is calculated using the frequency of publication. The Web crawler is then deployed at the calculated adaptive crawl rate.
摘要:
A chemical-mechanical planarization composition containing surface-modified abrasive particles such as silica where at least a portion of the surface of the particles has bound thereto a surface-modifying aluminum-containing stabilizer and fluoride that is used to polish semiconductor substrates. The use of a CMP slurry containing surface-modifying aluminum-containing stabilizer and fluoride bound to a silica abrasive provides high metal polishing rates relative to the removal rate of a dielectric.
摘要:
Methods, systems, and computer-storage media for improving the freshness, or the apparent freshness, of search results are described. In an embodiment, the first portion of search results presented on a search results page are based on responsiveness to the search query and a second portion of results describe only recently published documents that are responsive to the search query. In an embodiment, a more recent version of the document, which is not directly used to determine responsiveness, is used to build the caption for a search result. Another way to make search results appear fresh is to include a publication time within the search result caption. In one embodiment, the publication time is generated by calculating a point in time between when a document is first added to a search index and the previous time the search engine visited the site where the document was found.
摘要:
A composition and associated method for chemical mechanical planarization (or other polishing) are described. The composition contains an abrasive, benzenesulfonic acid compound, a per-compound oxidizing agent, and water. The composition affords tunability of removal rates for metal, barrier layer materials, and dielectric layer materials in metal CMP processes. The composition is particularly useful in conjunction with the associated method for metal CMP applications (e.g., step 2 copper CMP processes).
摘要:
A method and associated composition for chemical mechanical planarization of a chalcogenide-containing substrate (e.g., germanium/antimony/tellurium (GST)-containing substrate) are described. The composition and method afford low defect levels (e.g., scratches incurred during polishing) as well as low dishing and local erosion levels on the chalcogenide-containing substrate during CMP processing.
摘要:
A method of polishing a substrate surface containing silicon nitride and silicon oxide or silicon dioxide, comprising movably contacting the surface with a polishing pad and having a polishing composition disposed between the polishing pad and the surface, said polishing composition comprising 1) hydrous ceria abrasive; 2) polyvinylpyridine, vinyl pyridine copolymers, or both, and 3) water, wherein at 2 psi downpressure the silicon nitride removal rate is at least 500 angstroms per minute and the selectivity of silicon nitride to silicon oxide is at least 30.
摘要:
A low defectivity colloidal silica-based product slurry for use in chemical mechanical planarization (CMP) and an associated production method are described. The product slurry is produced using centrifugation of and optionally with addition of a surfactant to a starting colloidal silica (which can be a commercially available colloidal silica). The product slurry has substantially lower levels of soluble polymeric silicates than does the starting colloidal silica and affords lower defectivity levels when used in a slurry for CMP processing than does the starting colloidal silica.
摘要:
A composition and associated methods for chemical mechanical planarization (or other polishing) are described. The composition may comprise an abrasive and a dispersed hybrid organic/inorganic particle. The composition may further comprise an alkyne compound. Two different methods for chemical mechanical planarization are disclosed. In one method (Method A), the CMP slurry composition employed in the method comprises comprise an abrasive and a dispersed hybrid organic/inorganic particle. In another method (Method B), the CMP slurry composition employed in the method comprises comprise an abrasive and an alkyne compound. The composition may further comprise an oxidizing agent in which case the composition is particularly useful in conjunction with the associated methods (A and B) for metal CMP applications (e.g., tungsten CMP).
摘要:
A printing plate includes a substantially free gelatin free polymeric film which includes a coating layer of a polymer having at least one -POXY pendant group, pendant carboxyl groups and further comprises a sulphonated monomer, salt or derivative.
摘要翻译:印版包括基本上无明胶的聚合物膜,其包括具有至少一个-PO X Y侧基的聚合物的涂层,侧羧基,并且还包含磺化单体,盐或衍生物。
摘要:
An input circuit to a semiconductor device may selectively accept different voltage logic levels (e.g., TTL or CMOS) as selected by a preset selection signal. The selection signal activates an N-type or P-type transistor in the input circuit which alters the threshold switching voltage of the input circuit logic. By altering the input threshold voltage, both TTL and CMOS input signals may be correctly triggered. An additional circuitry may be provided to allow a low voltage circuit (e.g., 3.3 Volts) to be tolerant of higher voltage inputs (e.g., 5 Volts). An isolation transistor isolates the input of the circuit from the high voltage signal, while a pulldown transistor pulls a high logic, high voltage signal down to supply voltage level.