Functional Polymeric Phase Change Materials
    11.
    发明申请
    Functional Polymeric Phase Change Materials 审中-公开
    功能聚合相变材料

    公开(公告)号:US20100012883A1

    公开(公告)日:2010-01-21

    申请号:US12174609

    申请日:2008-07-16

    Abstract: A composition comprising a functional polymeric phase change material, the functional polymeric phase change material carrying at least one reactive function, wherein the reactive function is capable of forming at least a first electrovalent bond. In certain embodiments, the reactive function is capable of forming at least a first electrovalent bond with a second material. In other embodiments, the functional polymeric phase change material comprises at least one crystallizable section and may also comprise a backbone chain and a plurality of side chains, wherein the plurality of side chains form the crystallizable section.

    Abstract translation: 一种组合物,其包含功能聚合物相变材料,所述官能聚合物相变材料携带至少一种反应性官能团,其中所述反应性官能团能够形成至少第一电价键。 在某些实施方案中,反应性功能能够与第二材料形成至少第一电价键。 在其它实施方案中,官能聚合物相变材料包含至少一个可结晶部分,并且还可以包含主链和多个侧链,其中多个侧链形成可结晶部分。

    Method for the Production of a Composite Material or a Precursor Product for the Production of a Composite Material
    12.
    发明申请
    Method for the Production of a Composite Material or a Precursor Product for the Production of a Composite Material 审中-公开
    用于生产复合材料或用于生产复合材料的前体产品的方法

    公开(公告)号:US20080264594A1

    公开(公告)日:2008-10-30

    申请号:US12083519

    申请日:2006-10-26

    Abstract: The invention relates to a method for the production of a starting product for the production of a composite material having a metallic matrix phase and a reinforcement phase, with the following steps: Providing an extruder device having a die (4), Feeding the metallic matrix phase in a first portion of the extruder device, Transport of the metallic matrix phase in the direction of the die (4), Feeding reinforcement particles forming the reinforcement phase in the region of a second portion of the extruder device, Producing a mixture formed from the reinforcement particles and the at least partially melted on metallic matrix phase and further transport of the mixture through the die (4).

    Abstract translation: 本发明涉及一种用于生产具有金属基体相和增强相的复合材料的起始产品的方法,其具有以下步骤:提供具有模具(4)的挤出机装置,将金属基体 在挤出机装置的第一部分中相转移,在模具(4)的方向上运输金属基体相,在挤出机装置的第二部分的区域中形成加强相的进料增强颗粒,产生由 增强颗粒和至少部分地熔融在金属基体相上,并进一步输送混合物通过模头(4)。

    ARTICLES HAVING ENHANCED REVERSIBLE THERMAL PROPERTIES AND ENHANCED MOISTURE WICKING PROPERTIES TO CONTROL HOT FLASHES
    13.
    发明申请
    ARTICLES HAVING ENHANCED REVERSIBLE THERMAL PROPERTIES AND ENHANCED MOISTURE WICKING PROPERTIES TO CONTROL HOT FLASHES 审中-公开
    具有增强的可逆热性能和增强水分性能的文章来控制热水

    公开(公告)号:US20080233368A1

    公开(公告)日:2008-09-25

    申请号:US12051772

    申请日:2008-03-19

    Abstract: A coated article for providing a phased response to rapid temperature changes, comprises a substrate and a coating disposed on a portion of the substrate. The coating comprises a polymeric material, a first temperature regulating material having a transition temperature between 22° C. and 50° C. and disposed within a first plurality of microcapsules, and a second temperature regulating material having a transition temperature between 25° C. and 45° C. and disposed within a second plurality of microcapsules. The first temperature regulating material and the second temperature regulating material are dispersed in the polymeric material. The coating includes a plurality of regions of discontinuity formed by the coating that create exposed portions of the substrate to provide improved flexibility and air permeability to the coated article and wherein the coating provides a buffered response to rapid temperature changes.

    Abstract translation: 用于提供对快速温度变化的相位响应的涂覆制品包括基底和设置在基底的一部分上的涂层。 该涂层包括聚合材料,第一温度调节材料,其转变温度在22℃至50℃之间并且设置在第一多个微胶囊内,第二温度调节材料的转变温度在25℃之间。 和45℃,并且设置在第二多个微胶囊内。 第一温度调节材料和第二温度调节材料分散在聚合材料中。 涂层包括由涂层形成的多个不连续区域,其产生衬底的暴露部分,以提供涂覆制品的改进的柔性和透气性,并且其中涂层提供对快速温度变化的缓冲响应。

    Polymeric composites having enhanced reversible thermal properties and methods of forming thereof
    18.
    发明申请
    Polymeric composites having enhanced reversible thermal properties and methods of forming thereof 审中-公开
    具有增强的可逆热性质的聚合物复合材料及其形成方法

    公开(公告)号:US20050208286A1

    公开(公告)日:2005-09-22

    申请号:US11078656

    申请日:2005-03-11

    Abstract: Polymeric composites and methods of manufacturing polymeric composites are described. In one embodiment, a set of microcapsules containing a phase change material are mixed with a dispersing polymeric material to form a first blend. The dispersing polymeric material has a latent heat of at least 40 J/g and a transition temperature in the range of 0° C. to 50° C. The first blend is processed to form a polymeric composite. The polymeric composite can be formed in a variety of shapes, such as pellets, fibers, flakes, sheets, films, rods, and so forth. The polymeric composite can be used as is or incorporated in various articles where a thermal regulating property is desired.

    Abstract translation: 描述聚合物复合材料和制备聚合物复合材料的方法。 在一个实施方案中,将含有相变材料的一组微胶囊与分散聚合物材料混合以形成第一共混物。 分散聚合物材料具有至少40J / g的潜热和0℃至50℃范围内的转变温度。将第一共混物加工形成聚合复合材料。 聚合物复合材料可以形成为各种形状,例如颗粒,纤维,薄片,薄片,薄膜,棒等。 聚合物复合材料可以原样使用或并入其中需要热调节性能的各种制品中。

    Systems structures and materials for electronic device cooling
    20.
    发明授权
    Systems structures and materials for electronic device cooling 有权
    用于电子设备冷却的系统结构和材料

    公开(公告)号:US08587945B1

    公开(公告)日:2013-11-19

    申请号:US13559739

    申请日:2012-07-27

    Abstract: An electronic device having one or more components that generate heat during operation includes a structure for temperature management and heat dissipation. The structure for temperature management and heat dissipation comprises a heat transfer substrate having a surface that is in thermal communication with the ambient environment and a temperature management material in physical contact with at least a portion of the one or more components of the electronic device and at least a portion of the heat transfer substrate. The temperature management material comprises a polymeric phase change material having a latent heat of at least 5 Joules per gram and a transition temperature between 0° C. and 100° C., and a thermal conductive filler.

    Abstract translation: 具有在运行中产生热量的一个或多个部件的电子设备包括用于温度管理和散热的结构。 用于温度管理和散热的结构包括具有与周围环境热连通的表面的传热基板和与电子设备的一个或多个部件的至少一部分物理接触的温度管理材料, 至少一部分传热基板。 温度管理材料包括具有至少5焦耳/克的潜热和0℃至100℃之间的转变温度和导热填料的聚合物相变材料。

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