公开(公告)号：US20210323385A1

公开(公告)日：2021-10-21

申请号：US16852762

申请日：2020-04-20

Applicant: Michael SLAUGHTER

Inventor： Michael SLAUGHTER

IPC: B60H3/02 ,  B60H1/00 ,  B60H3/06

Abstract: A system and method for cooling an open air vehicle is provided. The system comprises a housing mounted on the vehicle configured to hold a water tank and a water filter. The system further comprises a water pump and one or more air blowers coupled to the water pump. The system further comprises a battery configured to supply power to the water pump and the one or more air blowers. The method comprises storing water in a water tank the water tank positioned within a housing on the vehicle. The method further comprises powering a water pump, via a battery, and pumping water from the water pump out of one or misting tips. The method further comprises providing one or more air blowers that distributes cold air and water coming out the misting tips.

公开(公告)号：US20070018336A1

公开(公告)日：2007-01-25

申请号：US11516097

申请日：2006-09-05

Applicant: Warren Farnworth ,  William Hiatt ,  Tim Murphy ,  John Caldwell ,  Michael Slaughter ,  David Hembree ,  Jamie Wanke

Inventor： Warren Farnworth ,  William Hiatt ,  Tim Murphy ,  John Caldwell ,  Michael Slaughter ,  David Hembree ,  Jamie Wanke

IPC: H01L23/48

CPC classification number: H01L24/06 ,  H01L21/563 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/73203 ,  H01L2224/73257 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2224/45099

Abstract: Stress and force management techniques for a semiconductor die to help compensate for stress within the semiconductor die and to help compensate for forces applied to the semiconductor die to minimize damage thereto.

Abstract translation: 用于半导体管芯的应力和力管理技术来帮助补偿半导体管芯内的应力，并帮助补偿施加到半导体管芯上的力以最小化对其的损害。

公开(公告)号：US20060197545A1

公开(公告)日：2006-09-07

申请号：US11415335

申请日：2006-05-01

Applicant: John Caldwell ,  Mark Tverdy ,  Michael Slaughter

Inventor： John Caldwell ,  Mark Tverdy ,  Michael Slaughter

IPC: G01R31/02

CPC classification number: G01R1/0483 ,  G01R31/2893

Abstract: Test sockets, test systems, and methods for testing microfeature devices with a substrate and a plurality of conductive interconnect elements projecting from the substrate. In one embodiment, a test socket includes a support surface and a plurality of apertures in the support surface corresponding to at least some of the interconnect elements of the microfeature device. The individual apertures extend through the test socket and are sized to receive a portion of one of the interconnect elements so that the substrate is spaced apart from the support surface when the microfeature device is received in the test socket. In one aspect of this embodiment, the individual apertures have a cross-sectional dimension less than a cross-sectional dimension of the interconnect elements so that the apertures receive only a portion of the corresponding interconnect element.

Abstract translation: 测试插座，测试系统和用于利用衬底和从衬底突出的多个导电互连元件来测试微特征器件的方法。 在一个实施例中，测试插座包括支撑表面和支撑表面中对应于微特征装置的至少一些互连元件的多个孔。 单独的孔延伸穿过测试插座，并且其尺寸被设计成接收互连元件中的一个的一部分，使得当微特征装置被接收在测试插座中时，基板与支撑表面间隔开。 在该实施例的一个方面，单个孔具有小于互连元件的横截面尺寸的横截面尺寸，使得孔仅接收相应互连元件的一部分。

公开(公告)号：US06858453B1

公开(公告)日：2005-02-22

申请号：US09416368

申请日：1999-10-12

Applicant: David J. Corisis ,  Tracy Reynolds ,  Michael Slaughter ,  Daniel Cram ,  Leland R. Nevill

Inventor： David J. Corisis ,  Tracy Reynolds ,  Michael Slaughter ,  Daniel Cram ,  Leland R. Nevill

IPC: G01R1/04 ,  G01R31/28 ,  H01L23/495 ,  H01L23/544 ,  H05K3/30 ,  G01R31/26 ,  H01L21/00 ,  H01L21/44 ,  H01L21/48 ,  H01L21/66

CPC classification number: G01R31/2851 ,  G01R1/0408 ,  G01R31/2884 ,  H01L23/4951 ,  H01L23/544 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/49171 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/303 ,  H05K2201/10568 ,  H05K2201/10689 ,  H05K2201/10696 ,  H05K2203/167 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: An integrated circuit is provided having an alignment feature integral with the lead frame. The integrated circuit includes a lead frame coupled with a semiconductor die, and is partially encapsulated in insulating material. The lead frame has the alignment feature therein. The alignment feature includes a cut out on the lead frame taking the form of a semicircle, protuberance, apertures, or slots. Alternatively, the alignment feature includes a removably coupled tab. After testing of the integrated circuit has been completed, the alignment tab is removed from the integrated circuit. The alignment feature can also be provided on a heat spreader which is attached to a side of or within the lead frame package.

Abstract translation: 提供了具有与引线框一体的对准特征的集成电路。 集成电路包括与半导体管芯耦合的引线框架，并部分封装在绝缘材料中。 引线框架具有其中的对准特征。 对准特征包括在引线框架上切割出半圆形，突起，孔或槽的形式。 或者，对准特征包括可移除地耦合的突片。 集成电路测试完成后，对准标签从集成电路中取出。 对准特征也可以设置在附着于引线框架封装的一侧或内部的散热器上。

公开(公告)号：US07863924B2

公开(公告)日：2011-01-04

申请号：US12644185

申请日：2009-12-22

Applicant: Michael Slaughter ,  Christie Dyan Larson

Inventor： Michael Slaughter ,  Christie Dyan Larson

IPC: G01R31/26 ,  G01R31/28 ,  G01R31/02

CPC classification number: G01R31/2893 ,  G01R1/0441

Abstract: Pusher assemblies for use in microelectronic device testing systems and methods for using such pusher assemblies are disclosed herein. One particular embodiment of such a pusher assembly comprises a plate having a first side and a second side opposite the first side. An engagement assembly is removably coupled to the second side of the plate and positioned to contact a microfeature device being tested. The pusher assembly can include an urging member proximate the first side of the plate and configured to move the engagement assembly toward the device being tested. The pusher assembly can also include a heat transfer unit carried by the first side of the plate. In several embodiments, the pusher assembly can further include a plurality of pins carried by the engagement assembly such that the pins extend through the plate and engage the urging member to restrict axial movement of the urging member toward the device being tested.

Abstract translation: 用于微电子器件测试系统的推动器组件和用于使用这种推动器组件的方法在此公开。 这种推动器组件的一个具体实施例包括具有与第一侧相对的第一侧和第二侧的板。 接合组件可移除地联接到板的第二侧并且定位成接触被测试的微型特征装置。 推动器组件可以包括邻近板的第一侧的推动构件，并且构造成使接合组件朝向被测试的装置移动。 推动器组件还可以包括由板的第一侧承载的传热单元。 在几个实施例中，推动器组件还可以包括由接合组件承载的多个销，使得销延伸穿过板并接合推动构件以限制推动构件朝着被测试装置的轴向运动。

公开(公告)号：US06836003B2

公开(公告)日：2004-12-28

申请号：US09819874

申请日：2001-03-28

Applicant: David J. Corisis ,  Tracy Reynolds ,  Michael Slaughter ,  Daniel Cram ,  Leland R. Nevill ,  Jerrold L. King

Inventor： David J. Corisis ,  Tracy Reynolds ,  Michael Slaughter ,  Daniel Cram ,  Leland R. Nevill ,  Jerrold L. King

IPC: H01L23495

CPC classification number: G01R31/2851 ,  G01R1/0408 ,  G01R31/2884 ,  H01L23/4951 ,  H01L23/544 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/49171 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/303 ,  H05K2201/10568 ,  H05K2201/10689 ,  H05K2201/10696 ,  H05K2203/167 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: An integrated circuit is provided having an alignment feature integral with the lead frame. The integrated circuit includes a lead frame coupled with a semiconductor die, and is partially encapsulated in insulating material. The lead frame has the alignment feature therein. The alignment feature includes a cut out on the lead frame taking the form of a semicircle, protuberance, apertures, or slots. Alternatively, the alignment feature includes a removably coupled tab. After testing of the integrated circuit has been completed, the alignment tab is removed from the integrated circuit. The alignment feature can also be provided on a heat spreader which is attached to a side of or within the lead frame package.

Abstract translation: 提供了具有与引线框一体的对准特征的集成电路。 集成电路包括与半导体管芯耦合的引线框架，并部分封装在绝缘材料中。 引线框架具有其中的对准特征。 对准特征包括在引线框架上切割出半圆形，突起，孔或槽的形式。 或者，对准特征包括可移除地耦合的突片。 集成电路测试完成后，对准标签从集成电路中取出。 对准特征也可以设置在附着于引线框架封装的一侧或内部的散热器上。

公开(公告)号：US06246108B1

公开(公告)日：2001-06-12

申请号：US09374176

申请日：1999-08-12

Applicant: David J. Corisis ,  Tracy Reynolds ,  Michael Slaughter ,  Daniel Cram ,  Leland R. Nevill ,  Jerrold L. King

Inventor： David J. Corisis ,  Tracy Reynolds ,  Michael Slaughter ,  Daniel Cram ,  Leland R. Nevill ,  Jerrold L. King

IPC: H01L2348

CPC classification number: G01R31/2851 ,  G01R1/0408 ,  G01R31/2884 ,  H01L23/4951 ,  H01L23/544 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/49171 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/303 ,  H05K2201/10568 ,  H05K2201/10689 ,  H05K2201/10696 ,  H05K2203/167 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: An integrated circuit is provided having an alignment feature integral with the lead frame. The integrated circuit includes a lead frame coupled with a semiconductor die, and is partially encapsulated in insulating material. The lead frame has the alignment feature therein. The alignment feature includes a cut out on the lead frame taking the form of a semi-circle, protuberance, apertures, or slots. Alternatively, the alignment feature includes a removably coupled tab. After testing of the integrated circuit has been completed, the alignment tab is removed from the integrated circuit. The alignment feature can also be provided on a heat spreader which is attached to a side of or within the lead frame package.

Abstract translation: 提供了具有与引线框一体的对准特征的集成电路。 集成电路包括与半导体管芯耦合的引线框架，并部分封装在绝缘材料中。 引线框架具有其中的对准特征。 对准特征包括在引线框架上切割成半圆形，突起，孔或槽的形式。 或者，对准特征包括可移除地耦合的突片。 集成电路测试完成后，对准标签从集成电路中取出。 对准特征也可以设置在附着于引线框架封装的一侧或内部的散热器上。

公开(公告)号：US6048744A

公开(公告)日：2000-04-11

申请号：US929843

申请日：1997-09-15

Applicant: David J. Corisis ,  Tracy Reynolds ,  Michael Slaughter ,  Daniel Cram ,  Leland R. Nevill ,  Jerrold L. King

Inventor： David J. Corisis ,  Tracy Reynolds ,  Michael Slaughter ,  Daniel Cram ,  Leland R. Nevill ,  Jerrold L. King

IPC: G01R1/04 ,  G01R31/28 ,  H01L23/495 ,  H01L23/544 ,  H05K3/30 ,  G01R31/26 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L21/66

CPC classification number: G01R31/2851 ,  H01L23/4951 ,  H01L23/544 ,  H05K3/303 ,  G01R1/0408 ,  G01R31/2884 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/49171 ,  H01L2224/85399 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H05K2201/10568 ,  H05K2201/10689 ,  H05K2201/10696 ,  H05K2203/167 ,  Y02P70/613

Abstract: An integrated circuit is provided having an alignment feature integral with the lead frame. The integrated circuit includes a lead frame coupled with a semiconductor die, and is partially encapsulated in insulating material. The lead frame has the alignment feature therein. The alignment feature includes a cut out on the lead frame taking the form of a semi-circle, protuberance, apertures, or slots. Alternatively, the alignment feature includes a removably coupled tab. After testing of the integrated circuit has been completed, the alignment tab is removed from the integrated circuit. The alignment feature can also be provided on a heat spreader which is attached to a side of or within the lead frame package.

Abstract translation: 提供了具有与引线框一体的对准特征的集成电路。 集成电路包括与半导体管芯耦合的引线框架，并部分封装在绝缘材料中。 引线框架具有其中的对准特征。 对准特征包括在引线框架上切割成半圆形，突起，孔或槽的形式。 或者，对准特征包括可移除地耦合的突片。 集成电路测试完成后，对准标签从集成电路中取出。 对准特征也可以设置在附着于引线框架封装的一侧或内部的散热器上。