Abstract:
An apparatus for calculating a normalized correlation coefficient used as a similarity evaluation measure by using image data values of pixels in a template image and image data values of pixels in a subimage, included in a search image, corresponding to the template image, has a memory that stores image data values of pixels in the search image and calculating means that calculate a sum of image data values of pixels in the template image and a sum of image data values of pixels in the first rectangular region in the search image or a sum of squares of image data values of pixels in the template image and a sum of squares of image data values of pixels in the first rectangular region in the search image. Normalized correlation coefficient calculating means calculate a normalized correlation coefficient on the basis of the sum of image data values of pixels in the template image and the sum of image data values of pixels in the first rectangular region in the search image, or the sum of squares of image data values of pixels in the template image and the sum of squares of image data values of pixels in the first rectangular region in the search image.
Abstract:
An optical fiber composite insulator includes an insulator body in which a through hole having a substantially radially circular cross section is provided, a plurality of optical fibers passed through the through hole, and an organic insulating material gas-tightly sealing the optical fibers in the through hole, wherein a diameter of the through hole is not more than 13 mm, the optical fibers are located inside a hypothetical circle drawn on any plane orthogonal to an axis of the through hole and having a center coaxial with that of the through hole, the hypothetical circle having a diameter equal to 95% of that of the through hole, and a distance between any optical fibers is set at not less than 0.1 mm.
Abstract:
The first and second flip-flop circuits are connected in series included within a combinational logic for carrying out a delay test. The first and second flip-flop circuits are provided with control pins, system clock pins, scan clock pins, system data pins and scan data pins, respectively. A delay time propagated from the first flip-flop circuit to the second flip-flop circuit through the path of the combinational logic to be tested is measured by detecting an input time to the first flip-flop circuit by the system clock signal to the first flip-flop circuit in response to an input signal to the control pins and a time stored in the second flip-flop circuit corresponding to output system data from the first flip-flop circuit. By measuring the delay time, whether the combinational logic is normal or abnormal is detected.
Abstract:
The present invention is a template matching processing device capable of evaluating a similarity degree which supports even a case of intensive morphological change between a design image and a photographic image. In the template matching processing device, matching processing between the design image and the photographic image is performed, a partial design image is obtained by clipping a portion having the highest correlation (step 101), and processing for deforming the photographic image in accordance with the clipped design image (steps 102 to 105) is performed, so that correlation between the deformed image obtained and the design image is taken to be set as the similarity degree.
Abstract:
It is an object of the present invention to provide a semiconductor inspection apparatus capable of well carrying out position alignment and correctly determining whether the position alignment has been carried out successfully or has ended in a failure without operator interventions even if an inspected image is an image having few characteristics as is the case with a repetitive pattern or the inspected image is an image having a complicated shape.The semiconductor inspection apparatus includes means for imaging a shape on a wafer or on an exposure mask; means for storing an image inspected by the imaging means; means for storing design data of the semiconductor circuit corresponding to a position on the wafer or on the exposure mask which are to be imaged by the imaging means; means for storing a design-data image obtained as a result of converting the design data into an image; means for generating a design-data ROI image by converting an interest drawing region found from a relative crude-density relation of a shape included in the design-data image into an image; and a position alignment section configured to carry out position alignment on the inspected image and the design-data image. The semiconductor inspection apparatus makes use of the design-data ROI image in order to identify a position at which the inspected image and the design-data image match each other or compute the degree of coincidence.
Abstract:
An evaluation value indicative of the extent of lines in each direction is calculated for a pre-processed image in which 0s are filled in and extended in the lateral direction of the inputted image and which has been reduced ⅛th in the longitudinal direction. To obtain the angle of rotation of an image from the change in the evaluation value obtained while the angle relative to the lateral direction of the pre-processed image is modified in small steps, a parallel line is drawn for each direction, a projection is taken, and the sum of squares serves as the evaluation value of the direction. The direction having the highest evaluation value serves as the obtained direction of rotation from the normal position. The projection of each direction references the point of intersection between the parallel line drawn for each direction and the coordinate line of the horizontal axis.
Abstract:
The present invention achieves the process of easily registering a template which is prepared for a size change in pattern matching for specifying a measurement point, and high-speed pattern matching by which adequate position accuracy can be obtained in measurement. The present invention includes means for automatically calculating the size and position of a positioning template different from a measurement point itself when the measurement point is designated, to display a template having the calculated size and position. The present invention further includes means for performing pattern matching by using all or some of a plurality of divided templates and extracting templates having a similar positional relationship to the original positional relationship.
Abstract:
A matching degree computing apparatus is provided for comparing an input image and an object template image and computing a matching degree between an input image and an object template image based on the compared result. The computing apparatus includes a transforming unit for transforming the input image so as to be matched to the template object region and a computing unit for computing a matching degree between the transformed input image and the template image. The transforming unit provides a shaping unit for shaping a non-background region to the form of the template object region in the object corresponding region of the input image and a processing unit for arranging the non-background region contacting with the template object corresponding region so that the non-background region has no substantial impact on the matching degree in the object non-corresponding region of the input image.
Abstract:
Provided is a template matching method and a template matching apparatus, where the degree of matching between a template and the actual image upon template matching is maintained at a high level, without depending on a partial appearance of a lower layer. Proposed as one embodiment, is a method and an apparatus for template matching, where either an area is set in which comparison of the template and the image is not conducted, or a second area is set inside the template where comparison different from comparison conducted in a first comparison area is to be conducted, and the template matching is conducted on the basis either of comparison excluding the non-comparison area, or of comparison using the first and second areas.
Abstract:
The present invention achieves the process of easily registering a template which is prepared for a size change in pattern matching for specifying a measurement point, and high-speed pattern matching by which adequate position accuracy can be obtained in measurement. The present invention includes means for automatically calculating the size and position of a positioning template different from a measurement point itself when the measurement point is designated, to display a template having the calculated size and position. The present invention further includes means for performing pattern matching by using all or some of a plurality of divided templates and extracting templates having a similar positional relationship to the original positional relationship.