摘要:
A semiconductor Dynamic Random Access Memory (DRAM) cell is fabricated using a vertical access transistor and a storage capacitor formed in a vertical trench. A Shallow Trench Isolation (STI) region is used as a masking region to confine the channel region of the access transistor, the first and second output regions of the access transistor, and a strap region connecting the second output region to the storage capacitor, to a narrow portion of the trench. The so confined second output region of the access transistor has reduced leakage to similar second output regions of adjacent memory cells. Adjacent memory cells can then be placed closer to one another without an increase in leakage and cross-talk between adjacent memory cells.
摘要:
A memory cell for a dynamic random access memory includes a pass transistor and a storage capacitor. The transistor is a vertical transistor formed along an upper portion of a sidewall of a polysilicon-filled trench in a monocrystalline silicon body with the source and drain in the body and the source contact, gate and gate contact in the trench, with its gate dielectric being an oxide layer on the sidewall portion of the trench. The capacitor is a vertical capacitor formed along a deeper portion of the trench and has as its-storage plate a lower polysilicon layer in the trench and as its reference plate a deep doped well in the body. The source contact and the storage plate are in electrical contact in the trench and the source contact and the gate contact are in the trench electrically isolated from one another.
摘要:
The hardenable mortar composition consists of a bonding agent component including a hydraulic bonding agent, such as cement, gypsum or mortar, and a paste-forming agent consisting of a liquid solvent inert with respect to the hydraulic bonding agent, and an aqueous component kept separate from the bonding agent component until the two components are mixed to form a hardened mortar composition. The aqueous component includes water and a hydrophobic adsorbent or absorbent. The hydrophobic adsorbent or absorbent is included in the aqueous component to avoid the emergence of the paste-forming agent, which is at the very least unsightly, when the aqueous component is mixed with the bonding agent component. The hydrophobic adsorbent or absorbent binds the paste-forming agent which would otherwise escape during mixing and remains as an inert additive in the setting mortar composition, without reducing the hardness thereof.
摘要:
Interlocking metal parts that slide under pressure on one another are manufactured so that at least one metal part is manufactured by a powdered metal injection-molding method, an in order to improve the sliding behavior and to minimize the binding tendency, a non-metallic substance having a structured arrangement of molecules is admixed in powdered or granular form with the powdered metal of the metal part manufactured by powder injection molding. The substance is inert towards the metal and has a thermal stability of at least 900.degree. C. In particular, ceramic solid materials or fillers are suitable substances.
摘要:
Methods and devices that provide improved isolation and alignment of gate conductors or gate contacts of vertical transistors in deep trench memory cells. A method for forming a vertical gate contact of a vertical transistor includes an oxide spacer formation process that prevents defects, such as shorts caused by voids filled with polysilicon, resulting from etching processes that are performed during fabrication of a vertical transistor, and enables formation of well-defined contact plugs for gate contacts, providing improved alignment structures.
摘要:
Methods and devices that provide improved isolation and alignment of gate conductors or gate contacts of vertical transistors in deep trench memory cells. A method for forming a vertical gate contact of a vertical transistor includes an oxide spacer formation process that prevents defects, such as shorts caused by voids filled with polysilicon, resulting from etching processes that are performed during fabrication of a vertical transistor, and enables formation of well-defined contact plugs for gate contacts, providing improved alignment structures.
摘要:
The present invention provides a method for fabricating a trench capacitor, in particular for use in a semiconductor memory cell (100), with an insulation collar (168′; 168″), having the following steps: provision of a substrate (101); formation of a trench (108) in the substrate (101); provision of a first layer (177) on the trench wall; provision of a second layer (178) on the first layer (177) on the trench wall; filling of the trench (108) with a first filling material (152); removal of the first filling material (152) from the upper region of the trench (108) in order to define a collar region; removal of the second layer (178) from the upper region of the trench (108); removal of the first filling material (152) from the lower region of the trench (108); removal of the first layer (177) from the upper region of the trench (108); local oxidation of the upper region of the trench (108) in order to produce the insulation collar (168′; 168″); removal of the first and second layers (177; 178) from the lower region of the trench; formation of a dielectric layer (164) in the lower region of the trench (108) and on the inner side of the insulation collar (168′; 168″); and filling of the trench (108) with a conductive second filling material (161).
摘要:
A memory cell for a dynamic random access memory includes a pass transistor and a storage capacitor. The transistor is a vertical transistor formed along an upper portion of a sidewall of a polysilicon-filled trench in a monocrystalline silicon body with the source and drain in the body and the source contact, gate and gate contact in the trench, with its gate dielectric being an oxide layer on the sidewall portion of the trench. The capacitor is a vertical capacitor formed along a deeper portion of the trench and has as its storage plate a lower polysilicon layer in the trench and as its reference plate a deep doped well in the body. The source contact and the storage plate are in electrical contact in the trench and the source contact and the gate contact are in the trench electrically isolated from one another.
摘要:
A method of manufacturing an expansible anchor comprises the steps of forming one part as a partially slotted expansible sleeve composed of corrosion-resistant steel and anchorable in a building component, forming another part as an expander body composed of corrosion-resistant steel and arranged to be driven into the expansible sleeve so as to anchor the expansible sleeve in the building component, enriching one of the parts with interstitially dissolved, non-metallic alloying constituents selected from the group consisting of carbon, nitrogen and boron, and ageing by heat treating so as to precipitate the alloying constituents in the form selected from the group consisting of carbides, nitrides and borides, respectively, to achieve increased hardness.
摘要:
The mortar composition for fixing an anchoring element in a drilled hole in a substrate consists of a water component and a mineral mortar paste held separately from the water component in a crushable container. The mineral mortar paste includes a mixture of mineral mortar and a liquid solvent chemically inert towards the mineral mortar and the mineral mortar paste is hardenable with the water component to form a hardened mortar compound. The water component consists of water and a thixotropic agent so that the water component acts like a paste when not subject to shear forces but flows when subject to shear forces such as those created by the anchoring element advancing in the drilled hole. The thixotropic agent is advantageously amorphous pyrogenic silicic acid.