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公开(公告)号:US12222159B2
公开(公告)日:2025-02-11
申请号:US17408953
申请日:2021-08-23
Applicant: SEMES CO., LTD.
Inventor: Do Hyeon Yoon , Yong Hyun Choi , Eui Sang Lim , Jun Young Choi
Abstract: An apparatus for treating a substrate includes a body having an inner space in which the substrate is dried by a drying fluid in a supercritical state, a fluid supply unit that supplies the drying fluid into the inner space, a fluid exhaust unit that releases the drying fluid from the inner space, and a controller. The controller controls the fluid supply unit and the fluid exhaust unit to perform a pressure-raising step of raising pressure in the inner space to a set pressure and a flow step of generating a flow of the drying gas in the inner space by releasing, by the fluid exhaust unit, the drying fluid from the inner space while the fluid supply unit supplies the drying fluid into the inner space.
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公开(公告)号:US20250041911A1
公开(公告)日:2025-02-06
申请号:US18791839
申请日:2024-08-01
Applicant: SEMES CO., LTD.
Inventor: Myung A JEON , Yong Hoon HONG , Ji Su HONG , Bok Kyu LEE , Young Seop CHOI
Abstract: Disclosed is an ozone water supplying unit capable of maintaining a stable ozone concentration of ozone water supplied to a substrate, and a substrate treating apparatus including the same. The substrate treating apparatus includes: a chamber for liquid-treating a substrate loaded into a treating space with a liquid containing ozone water; and an ozone water supplying unit for supplying ozone water to the treating space, in which the ozone water supplying unit includes: an ozone water generator for generating ozone water; an ozone water supply line for supplying ozone water generated by the ozone water generator to the treating space; and a cooler provided in the ozone water supply line to cool the ozone water flowing through the ozone water supply line.
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公开(公告)号:US20250038023A1
公开(公告)日:2025-01-30
申请号:US18915552
申请日:2024-10-15
Applicant: SEMES CO., LTD.
Inventor: DUKHYUN SON , BYUNG KYU KIM
IPC: H01L21/673 , H01L21/677
Abstract: Disclosed is a container. The container includes a housing having an interior space, and a support part that supports an expendable component in the interior space, and the support part includes an alignment pin that aligns the expendable component.
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公开(公告)号:US12211675B2
公开(公告)日:2025-01-28
申请号:US18050711
申请日:2022-10-28
Applicant: SEMES CO., LTD.
Inventor: Ji Hun Kim , Hyung Joon Kim
IPC: H01J37/00 , H01J37/32 , H01L21/3065
Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a housing having a treating space for treating a substrate; a support unit configured to support the substrate at the treating space; and a plasma source for generating a plasma from a process gas supplied into the treating space; an exhaust line connecting to the housing and exhausting an atmosphere of the treating space; and a pressure adjusting unit positioned between the support unit and the exhaust line and configured to adjust an exhaust pressure exhausted from the exhaust line, and wherein the pressure adjusting unit includes: an opening/closing member for opening and closing the exhaust line; a lifting/lowering member for moving the opening/closing member in an up/down direction; and an elastic member for providing a restoring force to the lifting/lowering member.
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公开(公告)号:US12198950B2
公开(公告)日:2025-01-14
申请号:US17943312
申请日:2022-09-13
Applicant: SEMES CO., LTD.
Inventor: Myung A Jeon , Muhyeon Lee , Sul Lee
Abstract: Embodiments of the inventive concept described herein relate to an apparatus and method for removing an adhesive exposed to the outside from an object being processed. The apparatus for removing the adhesive exposed to the outside from an edge region of the object being processed, in which the object has a patterned substrate and a support plate bonded together by the adhesive. The cover liquid nozzle dispenses the cover liquid onto a cover area of a top surface of the object other than the exposed area, and the controller controls the cover liquid dispensing member to adjust a flow rate of the cover liquid to cause a removal rate of the adhesive to remain constant.
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公开(公告)号:US12198923B2
公开(公告)日:2025-01-14
申请号:US17660449
申请日:2022-04-25
Applicant: Semes Co., Ltd. , Samsung Electronics Co., Ltd.
Inventor: Hae-Won Choi , Anton Koriakin , Sangjine Park Park , Keonyoung Kim , Sukhoon Kim , Seohyun Kim , Young-Hoo Kim , Kuntack Lee , Jihoon Jeong
Abstract: In a substrate processing method, a rinse process using a rinse solution is performed on a development-processed photoresist pattern on a substrate. A substitution process including a first substitution step using a mixed solution of a non-polar organic solvent and a surfactant and a second substitution step using the non-polar organic solvent is performed on the substrate. The substitution process is performed a plurality of times until the rinse solution remaining on the substrate is less than a predetermined value. A supercritical fluid drying process is performed on the substrate to dry the non-polar organic solvent remaining on the substrate.
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公开(公告)号:US12191181B2
公开(公告)日:2025-01-07
申请号:US17490011
申请日:2021-09-30
Applicant: SEMES Co., Ltd.
Inventor: Jun Sang Ahn , Bo Seung Hwang , Jeong Ung Cheon
IPC: H01L21/677 , B65G1/04 , B65G47/61
Abstract: Provided are an interface apparatus for resolving congestion through a non-stop interface between a transporting device and a logistics automation storage device, and a container transporting system having the same. The interface apparatus includes a saddle for receiving a container from a container transporting device; and a circulating path for providing a route for transporting the container seated on the saddle to a container storage device, wherein the saddle receives the container while moving together with the container transporting device.
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公开(公告)号:US20250006513A1
公开(公告)日:2025-01-02
申请号:US18676894
申请日:2024-05-29
Applicant: SEMES CO., LTD.
Inventor: Yong Hee LEE , Tae Jong CHOI , Mi So PARK
IPC: H01L21/67
Abstract: Disclosed is an apparatus for processing a substrate, the apparatus including: a body providing a processing space; a first fluid supply line connected to the body and supplying treatment fluid to the processing space; a second fluid supply line connected to the body at a location different from the first fluid supply line and supplying treatment fluid to the processing space; a first supply valve installed in the first fluid supply line; and an air removal line having one end connected to the first fluid supply line in a lower stream than the first supply valve to allow air in the processing space that is introduced into the first fluid supply line to be removed from the first fluid supply line when the second fluid supply line supplies treatment fluid to the processing space.
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公开(公告)号:US20240421566A1
公开(公告)日:2024-12-19
申请号:US18581653
申请日:2024-02-20
Applicant: SEMES CO., LTD.
Inventor: Jae Min KIM , Gun Min LEE
IPC: H02B1/056 , H01L21/67 , H01L21/687 , H02B1/20
Abstract: Disclosed are a substrate processing equipment and a method of driving the substrate processing equipment, which automatically cut off power supplied to a main circuit breaker and a branch circuit breaker when an operator inspects a process chamber or a power supply system. The substrate processing equipment for processing a substrate includes: a process processing module including loads utilized in a process for processing a substrate; a branch circuit breaker installed on a periphery to the process processing module and electrically connected to the loads; a main circuit breaker electrically connected to the branch circuit breaker and supplying power to the branch circuit breaker; and a power distribution board in which the branch circuit breaker is mounted, and including a power distribution board door, in which the main circuit breaker cuts off power when the power distribution board door is opened.
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20.
公开(公告)号:US20240420936A1
公开(公告)日:2024-12-19
申请号:US18818710
申请日:2024-08-29
Applicant: SEMES Co., Ltd.
Inventor: Hyo Seong Seong , Tae Hoon Jo , Jeong Yeon Hwang , Jae Hong Min
IPC: H01J37/32
Abstract: Provided are an impedance control apparatus for automatically compensating impedance by predicting the occurrence of wear on a ring assembly, and a substrate treating system having the same. The substrate treating system includes a housing for providing a space for treating a substrate, a substrate support member installed inside the housing and for supporting the substrate, a plasma generating unit for generating plasma inside the housing, a ring assembly disposed in circumference of the substrate, and an impedance control unit for controlling the impedance around the ring assembly and automatically compensating the impedance by predicting the occurrence of wear of the ring assembly.
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