SUBSTRATE COATED WITH A SILICON-CARBIDE (SIC) LAYER AND A METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20250075370A1

    公开(公告)日:2025-03-06

    申请号:US18811164

    申请日:2024-08-21

    Abstract: A structure including a base portion (e.g., made of a graphite-based or graphene-based material) with at least one surface that is coated with a homogenous coating layer (e.g., made of silicon-carbide (SiC)). The homogenous coating layer prevents contaminants (e.g., carbon) from being released by the base portion into a cavity of a processing tool when heated to process one or more workpieces (e.g., silicon substrate, silicon wafers, etc.) present within the cavity. The homogenous coating layer includes grains and grain boundaries that are relatively the same size and shape as each other, which further prevents propagation of defects (e.g., cracking, peeling, etc.) that could potentially cause exposure of a region of the first surface of the base portion to the cavity of the processing tool contaminating the one or more workpieces present within the cavity of the processing tool.

    METHOD TO TEST SYNCHRONOUS DOMAINS DURING STUCK-AT TEST

    公开(公告)号:US20250070785A1

    公开(公告)日:2025-02-27

    申请号:US18236038

    申请日:2023-08-21

    Abstract: A test-circuit includes a PLL-divider outputting first and third clock-signals as PLL clock-signals during functional mode and a capture-phase of transition and stuck-at-modes, and outputting a second clock-signal based upon an external clock-signal as an ATE clock-signal during a shift-phase of the transition and stuck-at-mode. An OCC passes the clock-signals in functional mode, transition capture mode, and stuck-at capture mode through sub-paths within first paths within first and second clock selection circuits so the first and third clock-signals are passed through less than the entire first paths, the sub-paths being first and second functional clock paths. In shift phase of transition and stuck-at-modes, the OCC passes the second clock-signal through sub-paths within second paths within the first and second clock selection circuits during the shift-phase so the second clock-signal is passed through less than the entire second paths, and through the first and second functional clock paths during the shift-phase.

    CIRCUITRY FOR ADJUSTING RETENTION VOLTAGE OF A STATIC RANDOM ACCESS MEMORY (SRAM)

    公开(公告)号:US20250069652A1

    公开(公告)日:2025-02-27

    申请号:US18942973

    申请日:2024-11-11

    Abstract: Disclosed herein is a method of operating a static random access memory (SRAM) device in retention mode. The method includes powering an array of SRAM cells between first and second voltages in retention mode, detecting process variation information about the array of SRAM cells, and generating a control word based thereupon. The method continues with generating a reference voltage that is proportional to absolute temperature and having a magnitude curve that is set by the control word, and then maintaining the second voltage as being equal to the reference voltage.

    DEBUG METHOD IMPLEMENTED BY AN NFC DEVICE

    公开(公告)号:US20250061301A1

    公开(公告)日:2025-02-20

    申请号:US18800891

    申请日:2024-08-12

    Abstract: A debug method implemented by a first near field communication (NFC) device includes a step of storing, in a memory of the first NFC device, one or more parameters which are associated with the operation of the first NFC device during a communication with a second distant NFC device. The first NFC device then uses an answer to select (ATS) communication, sent in response to receipt of an answer to select (ATS) communication, to send the stored one or more parameters to the second distant NFC device.

    MEMORY SYSTEM
    17.
    发明申请

    公开(公告)号:US20250053478A1

    公开(公告)日:2025-02-13

    申请号:US18798040

    申请日:2024-08-08

    Inventor: Raphael CLAUSS

    Abstract: A memory system includes a memory with memory blocks. A first logic circuit performs an XOR combinational logic function of a current value of a data addressing mode and of at least one bit of a first data packet including an error correction code of a data element to be written. A second data packet, generated by the first logic circuit, is stored into one of the memory blocks. A second logic circuit performs an XOR combinational logic function of at least one bit of the second packet (such as read from one of the memory blocks) and of the current value of the addressing mode. A weight of the bit of the first data packet corresponds to a weight of the at least one bit of the second read data packet.

    SYSTEMS, APPARATUSES, AND METHODS FOR ON CHIP DYNAMIC IR DROP OSCILLOSCOPE

    公开(公告)号:US20250052788A1

    公开(公告)日:2025-02-13

    申请号:US18788967

    申请日:2024-07-30

    Abstract: Systems, apparatuses, and methods for an on chip dynamic IR oscilloscope are provided. An oscilloscope circuitry may comprise sensor circuitry, voltage generator circuitry, finite state machine, and latch circuitry. The sensor circuitry may include digital logic circuitry, sample and hold circuitry, and sense amplifier circuitry. The voltage generator circuitry may include a voltage generator, analog buffers, switches, and high speed buffer. The finite state machine may control the sensor circuitry to sample a voltage waveform and the voltage generator circuitry to generate a reference voltage that may change over time. The sensing amplifier circuitry may compare the samples to the reference voltage to generate flags when a sample exceeds a reference voltage. The flags may be used to stored the voltages associated with the flags, which may be used to redraw the waveform sampled.

    IN-MEMORY COMPUTATION DEVICE WITH AT LEAST AN IMPROVED DIGITAL DETECTOR FOR A MORE ACCURATE CURRENT MEASUREMENT

    公开(公告)号:US20250046371A1

    公开(公告)日:2025-02-06

    申请号:US18790867

    申请日:2024-07-31

    Abstract: An in-memory computation device receives an input signal and provides an output signal. The device includes a memory array with memory cells coupled to word lines that receive word line activation signals indicative of the input signal and coupled to bit lines that generate bit line currents; and a digital detector for sampling the bit line current and, in response, providing the output signal. A digital detector includes: a control stage that compares the bit line current with at least one reference current and generates corresponding control signals; a selection stage that generates a total selection current based on the first bit line current and on the control signals; an integration stage that samples the total selection current; and a charge counter stage that generates the output signal on the basis of a sampled first total selection current and the control signals.

    MANUFACTURING PROCESS OF A SEMICONDUCTOR ELECTRONIC DEVICE INTEGRATING DIFFERENT ELECTRONIC COMPONENTS AND SEMICONDUCTOR ELECTRONIC DEVICE

    公开(公告)号:US20250040163A1

    公开(公告)日:2025-01-30

    申请号:US18776146

    申请日:2024-07-17

    Inventor: Riccardo DEPETRO

    Abstract: For manufacturing a semiconductor electronic device a wafer is provided which has a substrate layer of semiconductor material having a first portion and a second portion distinct from the first portion. An epitaxial region of a single semiconductor material is grown on the first portion of the substrate layer. An epitaxial multilayer having a heterostructure is grown on the second portion of the substrate layer. A first electronic component based on the single semiconductor material is formed from the epitaxial region and a second electronic component based on heterostructure is formed from the heterostructure. Forming a first electronic component comprises forming a plurality of doped regions in the epitaxial region, after the step of growing an epitaxial multilayer.

Patent Agency Ranking