公开(公告)号：US09295155B2

公开(公告)日：2016-03-22

申请号：US13590908

申请日：2012-08-21

申请人： Naoki Nakamura ,  Shigeru Sugino ,  Nobuo Taketomi ,  Ryo Kanai

发明人： Naoki Nakamura ,  Shigeru Sugino ,  Nobuo Taketomi ,  Ryo Kanai

IPC分类号： H05K1/00 ,  H05K1/11 ,  H05K1/02

CPC分类号： H05K1/118 ,  H05K1/0281 ,  H05K1/117 ,  H05K2201/09709 ,  H05K2201/09727 ,  H05K2201/09781 ,  H05K2201/2009

摘要： A flexible printed board includes a base material, first conductive pads arranged along an imaginary line on the base material and extending with a first width from front end to rear end on a front side of the imaginary line, second conductive pads arranged along the imaginary line and extending with a second width from front end on a rear side of the imaginary line to rear end, first wiring patterns provided between the second conductive pads, and extending with a third width to front end connected to the rear ends of the first conductive pads, and a reinforcing layer for reinforcing a reinforcing area over the first conductive pads and the first wiring patterns, and having a front edge on a front side of rear ends of the first conductive pads and a rear edge on a rear side of the rear ends of the second conductive pads.

摘要翻译： 柔性印刷电路板包括基材，第一导电焊盘沿着假想线布置在基体材料上并且沿着假想线的前侧从前端到后端的第一宽度延伸，沿假想线布置的第二导电焊盘 并且以假想线的后侧的前端延伸到第二宽度，第一布线图案设置在第二导电焊盘之间，并且第三宽度延伸到连接到第一导电焊盘的后端的前端 ，以及用于加强第一导电焊盘和第一布线图案上的加强区域的加强层，并且在第一导电焊盘的后端的前侧具有前边缘，在后端的后侧具有后边缘 的第二导电焊盘。

公开(公告)号：US08233286B2

公开(公告)日：2012-07-31

申请号：US11905317

申请日：2007-09-28

申请人： Naoki Nakamura ,  Shigeru Sugino ,  Ryo Kanai

发明人： Naoki Nakamura ,  Shigeru Sugino ,  Ryo Kanai

IPC分类号： H05K7/10 ,  H05K7/12

摘要： Terminal pads are arranged on a first surface of the substrate for an electronic component to receive terminals of the electronic component. An electrically-conductive film is formed on a second surface defined on the back of the first surface over the back of a mounting area for the electronic component. The mounting area is contoured along the outer periphery of the arrangement of the terminal pads. The ratio of the area of the electrically-conductive material to the area of the surface of the substrate over the back of the mounting area is set appropriate to the ratio of the area of the electrically-conductive material to the area of the surface of the substrate over the mounting area for each electronic component. This results in suppression of flexure of the printed wiring board during reflow.

公开(公告)号：US20110286188A1

公开(公告)日：2011-11-24

申请号：US13048056

申请日：2011-03-15

申请人： Ryo KANAI ,  Shunichi KIKUCHI ,  Naoki NAKAMURA ,  Shigeru SUGINO ,  Kiyoyuki HATANAKA ,  Nobuo TAKETOMI

发明人： Ryo KANAI ,  Shunichi KIKUCHI ,  Naoki NAKAMURA ,  Shigeru SUGINO ,  Kiyoyuki HATANAKA ,  Nobuo TAKETOMI

IPC分类号： H05K5/00 ,  H01L21/50 ,  H05K1/18

CPC分类号： H05K1/185 ,  H01L23/4985 ,  H01L23/5389 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/06181 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73267 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/12042 ,  H05K1/186 ,  H05K3/4602 ,  H05K3/4691 ,  H05K2201/10681 ,  H05K2201/10734 ,  H05K2203/063 ,  H05K2203/1469 ,  H01L2924/00

摘要： A multilayer printed circuit board includes an interior interconnect layer, and a semiconductor package including a flexible interconnect structure whose distal end is a free end, wherein the flexible interconnect structure and the interior interconnect layer are electrically connected to each other.

摘要翻译： 多层印刷电路板包括内部互连层和包括其前端是自由端的柔性互连结构的半导体封装，其中柔性互连结构和内部互连层彼此电连接。

公开(公告)号：US20110132654A1

公开(公告)日：2011-06-09

申请号：US12959698

申请日：2010-12-03

申请人： Nobuo TAKETOMI ,  Shunichi KIKUCHI ,  Naoki NAKAMURA ,  Kiyoyuki HATANAKA ,  Shigeru SUGINO ,  Ryo KANAI

发明人： Nobuo TAKETOMI ,  Shunichi KIKUCHI ,  Naoki NAKAMURA ,  Kiyoyuki HATANAKA ,  Shigeru SUGINO ,  Ryo KANAI

IPC分类号： H05K5/00 ,  H05K1/00 ,  H05K1/11 ,  B29C65/02

CPC分类号： H05K3/4694 ,  H05K1/0269 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0187 ,  H05K2201/09918 ,  H05K2201/09972 ,  H05K2203/061 ,  H05K2203/063 ,  H05K2203/167

摘要： A method for manufacturing a multilayer printed circuit board, and a printed circuit board manufactured according to the method, includes laterally-aligning a first inner substrate in which first insulation layers and first conductor layers are alternately laminated and a second inner substrate in which second insulation layers and second conductor layers are alternately laminated. The second inner substrate has a lager number of layers than the first inner substrate. The laterally-aligned first inner substrate and second inner substrate are placed between a pair of third insulation layers in a thickness direction. The pair of the third insulation layer are heated under pressure in the thickness direction. A conductor pattern is formed on surfaces of the pair of the third insulation layers.

摘要翻译： 一种制造多层印刷电路板的方法和根据该方法制造的印刷电路板，包括横向对准第一绝缘层和第一导体层交替层叠的第一内部基板和第二内部基板，其中第二绝缘层 层和第二导体层交替层叠。 第二内部衬底具有比第一内部衬底更多的层数。 横向排列的第一内部基板和第二内部基板在厚度方向上放置在一对第三绝缘层之间。 一对第三绝缘层在厚度方向上被加压。 在一对第三绝缘层的表面上形成导体图案。