Silver Ink Composition
    11.
    发明申请
    Silver Ink Composition 有权
    银色墨水组成

    公开(公告)号:US20150008376A1

    公开(公告)日:2015-01-08

    申请号:US14371913

    申请日:2013-01-25

    CPC classification number: C09D11/52 C08K5/01 C08K5/05 C08K5/098 C08K5/17 C09D11/30

    Abstract: A silver ink composition which includes a silver carboxylate having a group represented by a formula —COOAg, an aliphatic primary amine or secondary amine having 2 to 10 carbon atoms, an acetylene alcohol represented by a general formula (2) shown below, and a hydrocarbon having 6 to 20 carbon atoms, and has a viscosity at 27° C. of 40 mPa·s or less, (In the formula, each of R′ and R″ independently represents an alkyl group having 1 to 20 carbon atoms or a phenyl group in which one or more hydrogen atoms may be substituted with a substituent.)

    Abstract translation: 一种银墨水组合物,其包含具有由式-COOAg表示的基团的羧酸银,具有2至10个碳原子的脂族伯胺或仲胺,由以下通式(2)表示的乙炔醇和烃 具有6〜20个碳原子,在27℃下的粘度为40mPa·s以下(式中,R'和R“各自独立地表示碳原子数1〜20的烷基或苯基 基团,其中一个或多个氢原子可以被取代基取代。)

    LAMINATE AND CIRCUIT BOARD
    15.
    发明申请
    LAMINATE AND CIRCUIT BOARD 审中-公开
    层压板和电路板

    公开(公告)号:US20160286653A1

    公开(公告)日:2016-09-29

    申请号:US14778162

    申请日:2014-03-27

    Inventor: Akihito MORI

    Abstract: Provided are a laminate including a silver layer on a substrate, in which the silver layer includes a surface in which Kurtosis of a roughness curve satisfies at least one of Condition (i) the change rate of Kurtosis is greater than or equal to 50% under conditions of a temperature of 85° C. and a relative humidity of 85% after 240 hours have elapsed and Condition (ii) the change rate of Kurtosis is greater than or equal to 200% under conditions of a temperature of 85° C. and a relative humidity of 85% after 480 hours have elapsed, and a circuit board in which an electronic component is mounted on the surface of the laminate through a conductive joint portion.

    Abstract translation: 提供一种在基材上具有银层的层叠体,其中,银层包含粗糙度曲线的曲线满足以下条件(i)中的至少一个的表面,即,峰度的变化率为50%以下,高于或等于50% 240小时后温度为85℃,相对湿度为85%的条件已经过去,条件(ii)在85℃的温度条件下,峰度的变化率大于等于200% 经过480小时后的相对湿度为85%,并且通过导电接合部分将电子部件安装在层叠体的表面上的电路板。

    Method for producing wiring board
    17.
    发明授权

    公开(公告)号:US10477679B2

    公开(公告)日:2019-11-12

    申请号:US15864301

    申请日:2018-01-08

    Abstract: A wiring board includes: thin silver wires formed on a substrate by a printing method, in which the thin silver wires are configured so that the width thereof in a cross-section in a direction perpendicular to a wire length direction thereof is 20 μm or less, a top thereof has a smaller width than that of a contact portion that comes into contact with the substrate, and a volume resistivity of the thin silver wire is 15 μΩ·cm or less.

    Non-contract data receiving/transmitting body

    公开(公告)号:US10303994B2

    公开(公告)日:2019-05-28

    申请号:US15519029

    申请日:2015-10-28

    Abstract: A non-contact data receiving/transmitting body is provided which includes an IC chip, a first antenna to which the IC chip is connected, and a second antenna for use as a booster that resonates with the first antenna in a non-contact manner. The first antenna is a ring-shaped antenna having at least three straight portions. The second antenna has a central portion that is bent such that parts of the central portion extend respectively along the three straight portions of the first antenna and are at an angle equal to or greater than 90° to each other. The IC chip is provided on the three straight portions of the first antenna and is connected to the first antenna at the straight portions.

    Silver ink composition, conductor and communication device

    公开(公告)号:US10040960B2

    公开(公告)日:2018-08-07

    申请号:US14431092

    申请日:2013-09-27

    Abstract: There are provided a silver ink composition which is capable of forming metallic silver having sufficient electrical conductivity without carrying out a heat treatment at high temperatures; and a conductor and communication device which are obtained using this silver ink composition. Such a silver ink composition is characterized by being obtained by blending: a silver carboxylate having a group represented by a formula “—COOAg”; one or more nitrogen-containing compounds selected from the group consisting of amine compounds and quaternary ammonium salts of not more than 25 carbon atoms, ammonia, and ammonium salts obtained by reacting the above amine compounds or ammonia with an acid; and one or more reducing compounds selected from the group consisting of oxalic acid, hydrazine and compounds represented by a general formula (5) shown below (in the formula, R21 represents an alkyl group, alkoxy group or N,N-dialkylamino group of not more than 20 carbon atoms, a hydroxyl group or an amino group): or obtained by preparing a second mixture by supplying carbon dioxide to a first mixture formed by mixing a silver carboxylate having a group represented by a formula “—COOAg” and one or more nitrogen-containing compounds selected from the group consisting of amine compounds and quaternary ammonium salts of not more than 25 carbon atoms, ammonia, and ammonium salts obtained by reacting the amine compounds or ammonia with an acid; and further mixing one or more reducing compounds selected from the group consisting of oxalic acid, hydrazine and compounds represented by a general formula (5) shown below to the mixture: H—C(═O)—R21 (5).

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