Abstract:
A thin film manufacturing system, wherein a stage for placing a substrate thereon is disposed within a vacuum reactor and a gas head for supplying a film forming gas to a central area on a top face of the vacuum reactor is arranged so that the gas head is opposed to the stage. A cylindrical sleeve member is disposed and comes in close contact with a side wall of the stage to surround a periphery of the stage. The height of the stage can be established at the position where the volume of a second space formed below the stage and connected to a vacuum discharge means is larger than that of a first space formed above the stage, in such a manner that an exhaust gas is isotropically discharged from the first space without causing any convection current therein through the interstice between the sleeve member and an inner wall surface constituting the reactor.
Abstract:
A triangle prism (PR1) that refracts light coming from a first light-reception face (RS1) is formed on a first outgoing face (IS1) of a first prism sheet (PS1). Furthermore, one of the side surfaces (SS1a, SS2a) of that triangle prism (PR1) will refract light coming from the first light-reception face (RS1), and the other side surface will refract light coming from that side surface.
Abstract:
An illumination device 10 includes a diffusion plate 13 for diffusing light emitted from light sources 17, which diffusion plate 13 is fixed on first partition walls 11 and provided on upper sides of light source blocks 18. The arrangement makes it possible to provide a high-quality illumination device and a high-quality liquid crystal display device in each of which unevenness in luminance and color is restrained so that a luminance distribution becomes constant.
Abstract:
Each of light guides (2) has: a reflection surface (2e); and a light emitting surface (2c) that is opposite to the reflection surface (2e) and is not covered by a neighboring light guide (2). The light emitting surface (2c) is made up of a first emitting surface (7) and a second emitting surface (8). The first emitting surface (7) is substantially parallel with the reflection surface (2e). The second emitting surface (8) is substantially parallel with an irradiated surface. The each of the light guides (2) is provided with microprisms (9) serving as diffusing means at least in a first emitting surface region (12) in which there is the first emitting surface (7).
Abstract:
A backlight (illumination device) of the present invention includes a plurality of light source units (32) each of which includes: a plurality of light sources (25) which emit light beams of two or more different colors; and a light guide (27) which mixes colored light beams emitted from the light sources and then converts the colored light beams thus mixed into surface emission. The plurality of light source units (32) are arranged so as not to overlap one another. In the light source unit (32), the plurality of light sources (25) are aligned in a given order along an end part (27d) of the light guide (27), and a light source disposed at a midsection of the end part (27d) of the light guide (27) has the highest luminance intensity among the plurality of light sources (25), and luminous intensities of the other light sources decrease with distance from the light source disposed at the midsection of the end part (27d) of the light guide (27).
Abstract:
An illumination device includes a plurality of light source blocks defined by a first partition wall and a second partition wall, the light source blocks being provided with LEDs. The illumination device is capable of adjusting a luminance of each of the plurality of light source blocks. A projection section to diffuse the light is provided on a vertex of the first partition wall. As a result, it is possible to prevent a luminance irregularity and a color irregularity from occurring between illumination areas when adjusting the respective luminance in each of the plurality of illumination areas.
Abstract:
A light-emitting element (11) of the present invention includes: a light source (5a); a light guide (7) having a light-emitting surface (7a); and a maintaining section (10), the light source (5a) having directivity which causes components of the light travel in a first direction, which is parallel to the light-emitting surface (7a), to be more than those in a direction perpendicular to the light-emitting surface (7a), the light guide (7) having a light-receiving surface for receiving the components of the light traveling in the first direction, the maintaining section (10) being provided in a first region, indicative of a lowest level of luminance, on the light-emitting surface (7a) in a case where luminance over the light-emitting surface (7) is divided into a plurality of levels between a low luminance and a high luminance. This makes it possible to produce a light-emitting element and an illumination device each of which has improved uniformity of the luminance over the light-emitting surface.
Abstract:
An information processing system includes a first system and a second system. The first system and the second system each includes: hardware; a compensation section configured to provide execution environments for execution of a process using the hardware of the system to which the compensation section belongs; and a processing section configured to execute a predetermined process in the execution environments provided by the compensation section. The hardware of the first system and the hardware of the second system are different in nature from each other. The compensation section of one of the first system and the second system compensates for the differences between the hardware of the first system and the hardware of the second system to provide the processing section of the other with the execution environments which are not affected by the differences between the hardware of the first system and the hardware of the second system.
Abstract:
A liquid resin composition of the present invention is a liquid resin composition for bonding a semiconductor element on a support, exhibiting a tackiness of 0.05 N or less after heating at 120° C. for 10 min and a tackiness of 1 N or more at 80° C. A semiconductor wafer having an adhesive layer of the present invention is a semiconductor wafer having an adhesive layer in which the adhesive layer is formed from the above liquid resin composition. A process for manufacturing a semiconductor element of the present invention has the application step of applying an adhesive as a liquid resin composition containing a thermosetting resin and a solvent to one side of a wafer; the evaporation step of evaporating said solvent while substantially maintaining a molecular weight of said liquid resin composition to form an adhesive layer; the bonding step of bonding a dicing sheet on one side of said wafer; and the cutting step of cutting said wafer into pieces.
Abstract:
The present invention herein provide a thin film-manufacturing device and a thin film-manufacturing method which are excellent in the mass-production ability and productivity, which permit the stable and continuous production of films over a long period of time while reproducing a good film thickness distribution, a good compositional distribution and a high film-forming rate and controlling the number of particles generated during the film-formation to a lower level. The device is one serving as a CVD device in which a film-forming gas is introduced into a reaction chamber from the upper portion of the chamber serving as a reaction space, through a shower head and a film is formed on a heated substrate, wherein the device is so designed that the upper reaction space is constructed by the substrate-supporting stage which is free of any rotational motion or free of any elevating motion, the shower head and a deposition-inhibitory plate, that the substrate-supporting stage and the deposition-inhibitory plate are so arranged as to form, between them, a concentric gap or interstice serving as a gas-exhaust path through which an inert gas can flow from the upper portion of the gas-exhaust path along the deposition-inhibitory plate and that a lower space is formed on the secondary side of the gas-exhaust path.