Abstract:
A pressure sensor comprises a matrix of diaphragms of polysilicon which, via a structure of electrical conductors, are arranged at an upper side of a silicon substrate for the determination of their variable electrical capacitance dependent on the pressure stressing. These diaphragms are present in at least two different sizes. Capacitances of these diaphragms of a same size are respectively connected to form a sub-unit such that basic capacitances of these sub-units are of a respectively same size.
Abstract:
A grid-like arrangement of membranes of doped polysilicon are mounted on a substrate but are electrically insulated therefrom each membrane extends over a cavity and is joined to the substrate at at least two supporting locations so that they cavity lies between the membrane and the substrate. Changes in an electrical quantity existing between the membranes and the substrate are measured as forces exerted on the grid-like arrangement of sensor elements so that the ridges in the skin on a finger tip may be sensed for detecting a fingerprint.
Abstract:
A spacer layer (7) with a cavity (8) etched out therein and a diaphragm (2) arranged thereabove on the spacer layer are located on a silicon substrate (1) with a doped region (5) formed therein, whereby the doped region and the diaphragm are electrically connected via terminal contacts (4, 6) to electronic components (13) that are likewise integrated in the substrate (1). The electronic component are a component part of the operating circuit that can also be used for the drive of the diaphragm and for evaluating the diaphragm oscillations. The integration makes it possible to arrange the micromachined transducer components as array that can be electronically driven as phased array.
Abstract:
Micromechanically producible capacitively operating pressure sensor, in which there is a diaphragm, formed by a diaphragm layer (5), on a silicon substrate (1) over a hollow (4) in an auxiliary layer (3), and in which there is, on the side of the diaphragm averted from the hollow (4) and at a distance therefrom, an electrode formed by an electrode layer (8) with recesses (9) therein as a counter-electrode to the electrically conductive diaphragm layer (5). Given a rise in the external pressure, it is possible by applying a voltage between the diaphragm layer (5) and the electrode layer (8) to prevent the diaphragm from deflecting in the direction of the substrate, and to determine the magnitude of the pressure from the voltage required therefor.
Abstract:
In a method for the selective removal of SiO.sub.2 relative to semiconductor materials and/or metal, a specimen to be processed and containing SiO.sub.2 is placed into a chamber having at least one gas admission opening and one gas outlet opening. Using controllable valves at the gas admission opening, dosed quantities of hydrogen fluoride gas and water vapor are admitted into the chamber. These gasses proceed to the SiO.sub.2 in a specimen in a quantity adequate for etching. However, the quantities of these gasses are limited such that a condensation of the water vapor to form liquid water on the specimen during the etching event is avoided. An etching event is then implemented. Water vapor that arises as a reaction product during the etching is eliminated through the gas outlet opening before the occurrence of condensation and, simultaneously, an inert gas is admitted into the chamber through the gas admission opening. These steps are repeated as needed.
Abstract:
A micromechanically manufacturable pressure sensor has a cavity produced in an auxiliary layer that is covered with a membrane layer, the cavity is produced via recesses in the membrane layer. These recesses are subsequently closed by portions of a closure layer. Further layers can be applied on the closure layer. Portions of the further layers and closure layer are removed above the membrane layer.
Abstract:
A conductor layer is patterned into flat portions, for example of a fingerprint sensor that effects capacitive measurement. The conductor layer is fragmented in a lattice-like manner by cutouts so that an applied passivation layer rests on a base layer that is present beneath the conductor layer. The interlaminar shear strength of the passivation is increased in this way.
Abstract:
A reference image for pattern recognition tasks is produced. Overlapping individual images are combined to form an overall image and the overall image is used as the reference image. This allows the size of reference images for fingerprints, for instance, which has hitherto been governed by the sensor area, to be increased. The recognition rate can thus be improved.
Abstract:
A grid-shaped array of conductor areas is used for capacitive image acquisition. Shielding conductors are disposed in each case between the conductors that are provided for measurement. During a plurality of charging and discharging cycles, the potential is always carried along on the conductors belonging to a respective pixel in order to prevent displacement currents between the shielding capacitors. By way of example, a compensation line with a feedback operational amplifier can be used for identically altering the electrical potentials on the conductors.
Abstract:
A capacitance to be measured is connected together with three further capacitances to form a bridge circuit, in which each two of the capacitors are connected in series, and these two series circuits are connected in parallel to one another, and which replaces a part of the input stage of a .SIGMA.-.DELTA. modulator. As inputs of this bridge circuit, terminals are provided at the ends of these series circuits, and as outputs terminals are respectively provided between the capacitors connected one after the other in series. In a sensor realized thereby, two capacitively measuring sensor elements of the same type are used. These capacitors are built into the bridge circuit together with two equally large reference capacitors in such a way that exactly one measurement capacitor and one reference capacitor is La connected is connected to each input and to each output of the bridge circuit.