公开(公告)号：US5554887A

公开(公告)日：1996-09-10

申请号：US234808

申请日：1994-04-28

申请人： Akiyoshi Sawai ,  Haruo Shimamoto ,  Toru Tachikawa ,  Jun Shibata

发明人： Akiyoshi Sawai ,  Haruo Shimamoto ,  Toru Tachikawa ,  Jun Shibata

IPC分类号： H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L21/68 ,  H01L23/12 ,  H01L23/28 ,  H01L23/31 ,  H01L23/367 ,  H01L23/485 ,  H01L23/498 ,  H05K3/30

CPC分类号： H01L21/568 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/3677 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/13 ,  H01L24/28 ,  H01L24/83 ,  H01L2224/11 ,  H01L2224/11003 ,  H01L2224/1147 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/17051 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/73203 ,  H01L2224/81207 ,  H01L2224/83102 ,  H01L2224/83104 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/1579 ,  H01L2924/181 ,  Y10T29/49169

摘要： A pad electrode is formed on a main surface of a semiconductor chip. A passivation film, which covers a surface portion of the pad electrode, is formed on the main surface of the semiconductor chip. An internal connection conductor is formed on a surface portion of the pad electrode. The semiconductor chip is covered with a molding resin which exposes only a top surface of the internal connection conductor. An external connection conductor is formed on a top surface of the internal connection conductor. The external connection conductor has a substantially flat top surface. Thereby, a plastic molded semiconductor package can be easily mounted on a printed board, and can have improved reliability after being joined on the printed board.

摘要翻译： 在半导体芯片的主表面上形成焊盘电极。 在半导体芯片的主表面上形成覆盖焊盘电极的表面部分的钝化膜。 在焊盘电极的表面部分上形成内部连接导体。 半导体芯片被仅暴露内部连接导体顶表面的模制树脂覆盖。 外部连接导体形成在内部连接导体的顶表面上。 外部连接导体具有基本平坦的顶表面。 因此，塑料成型半导体封装可以容易地安装在印刷电路板上，并且可以在印刷电路板上接合之后具有改进的可靠性。

公开(公告)号：US5299955A

公开(公告)日：1994-04-05

申请号：US872031

申请日：1992-04-23

申请人： Hajime Maeda ,  Toru Tachikawa ,  Hitoshi Yoshikawa

发明人： Hajime Maeda ,  Toru Tachikawa ,  Hitoshi Yoshikawa

IPC分类号： H01M2/10 ,  H01M2/20 ,  H01R9/16 ,  H01R13/24 ,  H01R13/00

CPC分类号： H01R13/24 ,  H01M2/1066 ,  H01M2/20 ,  H01R9/16

摘要： In a portable electrical device, a plurality of engaging portions of a frame on surfaces of the frame are directed in the same direction and engaging portions on two connecting terminals can be brought into engagement with the engaging portions along the same direction. Thus, both of the connecting terminals can be mounted on the frame from the same direction, and the efficiency of the mounting operation is improved and can be automated. Furthermore, deformation of or damage to the connecting terminals, caused by the mounting process, is reduced.

摘要翻译： 在便携式电气设备中，框架的表面上的框架的多个接合部分被引向相同的方向，并且两个连接端子上的接合部分可以沿着相同的方向与接合部分接合。 因此，两个连接端子可以从相同的方向安装在框架上，并且提高了安装操作的效率并且可以自动化。 此外，减少了由安装过程引起的连接端子的变形或损坏。

公开(公告)号：US5105261A

公开(公告)日：1992-04-14

申请号：US758719

申请日：1991-09-09

申请人： Tetsuya Ueda ,  Toru Tachikawa ,  Masataka Takehara

发明人： Tetsuya Ueda ,  Toru Tachikawa ,  Masataka Takehara

IPC分类号： H05K1/18 ,  H01L23/495 ,  H01L23/50 ,  H01L25/00 ,  H01L25/10 ,  H01L25/11 ,  H01L25/18 ,  H05K1/14 ,  H05K3/36

CPC分类号： H05K1/145 ,  H01L23/49555 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/181 ,  H05K2201/09709 ,  H05K2201/10946

摘要： The semiconductor device has leads projecting from at least two sides of all of a package which are bent in a zigzag manner so that ends of the leads lie on at least two planes. The semiconductor device may be mounted across a plurality of printed circuit boards by fixing a part of the leads from one side to a first board and fixing a remaining part of the leads from the other side to a second board, or by fixing a part of the leads on one plane to a first board and fixing a remaining part of the leads on the other plane to a second board.

摘要翻译： 半导体器件具有从所有封装的至少两侧突出的引线，其以锯齿形的方式弯曲，使得引线的端部位于至少两个平面上。 半导体器件可以通过将一部分引线从一侧固定到第一板并将引线的剩余部分从另一侧固定到第二板，或者通过固定一部分 将一个平面上的引线连接到第一板，并将另一个平面上的引线的剩余部分固定到第二板。

公开(公告)号：US4753807A

公开(公告)日：1988-06-28

申请号：US18416

申请日：1987-02-25

申请人： Yoshihiko Fuseya ,  Toru Tachikawa

发明人： Yoshihiko Fuseya ,  Toru Tachikawa

IPC分类号： A23D9/007 ,  A23D9/013 ,  A23L1/22 ,  A23L1/229 ,  A23L1/30 ,  A23D5/00

CPC分类号： A23D9/007 ,  A23D9/013 ,  A23L27/23 ,  A23L27/72 ,  A23L33/13

摘要： The invention relates to oil or fat coated 5'-ribonucleotides and a method of making the same.

摘要翻译： 本发明涉及油或脂肪包被的5'-核糖核苷酸及其制备方法。